公开(公告)号：US20210187693A1

公开(公告)日：2021-06-24

申请号：US17036623

申请日：2020-09-29

Applicant: Applied Materials, Inc.

Inventor： Aniruddh Jagdish KHANNA ,  Jason G. FUNG ,  Puneet Narendra JAWALI ,  Rajeev BAJAJ ,  Adam Wade MANZONIE ,  Nandan BARADANAHALLI KENCHAPPA ,  Veera Raghava Reddy KAKIREDDY ,  Joonho AN ,  Jaeseok KIM ,  Mayu YAMAMURA

IPC: B24B37/20 ,  B24B37/04

Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.

公开(公告)号：US20200299834A1

公开(公告)日：2020-09-24

申请号：US16795431

申请日：2020-02-19

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Mei CHANG ,  Deenesh PADHI

IPC: C23C16/30 ,  C23C16/44

Abstract: A method of depositing a coating and a layered structure is provided. A coating is deposited on a substrate to make a layered structure, such that an interface between the coating and the substrate is formed. The coating includes silicon, oxygen, and carbon, where the carbon doping in the coating increases between the interface and the top surface of the coating. The top surface of the coating is inherently hydrophobic and icephobic, and reduces the wetting of water or ice film on the layered structure, without requiring reapplication of the coating.

公开(公告)号：US20200055161A1

公开(公告)日：2020-02-20

申请号：US16661400

申请日：2019-10-23

Applicant: Applied Materials, Inc.

Inventor： Ashwin CHOCKALINGHAM ,  Mahendra C. ORILALL ,  Mayu YAMAMURA ,  Boyi FU ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24 ,  H01L21/306

Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

公开(公告)号：US20190047112A1

公开(公告)日：2019-02-14

申请号：US16050442

申请日：2018-07-31

Applicant: Applied Materials, Inc.

Inventor： Boyi FU ,  Sivapackia GANAPATHIAPPAN ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Ashwin CHOCKALINGAM ,  Dominic J. BENVEGNU ,  Mario Dagio CORNEJO ,  Mayu YAMAMURA ,  Nag B. PATIBANDLA ,  Ankit VORA

IPC: B24B37/20

Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.

公开(公告)号：US20180009079A1

公开(公告)日：2018-01-11

申请号：US15546068

申请日：2016-01-29

Applicant: Applied Materials, Inc.

Inventor： Robert D. TOLLES ,  Mahendra C. ORILALL ,  Fred C. REDEKER ,  Rajeev BAJAJ

IPC: B24B37/22 ,  B24B37/24

Abstract: The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.

公开(公告)号：US20170259499A1

公开(公告)日：2017-09-14

申请号：US15452053

申请日：2017-03-07

Applicant: Applied Materials, Inc.

Inventor： Hou T. NG ,  Nag B. PATIBANDLA ,  Rajeev BAJAJ ,  Daniel REDFIELD ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Mario CORNEJO

IPC: B29C67/00 ,  B24B37/22 ,  B33Y80/00 ,  B33Y10/00 ,  B33Y30/00

CPC classification number: B33Y10/00 ,  B24B37/22 ,  B29K2105/0058 ,  B33Y30/00 ,  B33Y80/00 ,  G03F7/0035 ,  G03F7/2014

Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.

公开(公告)号：US20170120416A1

公开(公告)日：2017-05-04

申请号：US15298766

申请日：2016-10-20

Applicant: Applied Materials, Inc.

Inventor： Ashwin CHOCKALINGAM ,  Mahendra C. ORILALL ,  Mayu YAMAMURA ,  Boyi FU ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/20 ,  H01L21/306

CPC classification number: B24B37/20 ,  H01L21/30625

Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

公开(公告)号：US20160101500A1

公开(公告)日：2016-04-14

申请号：US14695778

申请日：2015-04-24

Applicant: Applied Materials, Inc.

Inventor： Jason Garcheung FUNG ,  Rajeev BAJAJ ,  Kasiraman KRISHNAN ,  Mahendra C. ORILALL ,  Fred C. REDEKER ,  Russell Edward PERRY ,  Gregory E. MENK ,  Daniel REDFIELD

IPC: B24B37/26 ,  B24B55/02 ,  B24B37/015

CPC classification number: B24B37/26 ,  B24B37/015 ,  B24B55/02

Abstract: A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.

Abstract translation: 提供了用于化学机械抛光的抛光垫。 抛光垫包括具有支撑表面的基底区域。 抛光垫还包括形成抛光表面的多个抛光特征，抛光表面与支撑表面相对。 抛光垫还包括形成在抛光垫的内部区域中并且至少部分地围绕抛光垫的中心延伸的一个或多个通道，其中每个通道流体地联接到至少一个端口。

公开(公告)号：US20150044951A1

公开(公告)日：2015-02-12

申请号：US14454785

申请日：2014-08-08

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Craig E. BOHN ,  Fred Conrad REDEKER

IPC: B24B37/24 ,  B24B53/017

CPC classification number: B24B37/245

Abstract: Embodiments of the disclosure generally provides a method and apparatus for a polishing article or polishing pad having a microstructure that facilitates uniform conditioning when exposed to laser energy. In one embodiment, a polishing pad comprising a combination of a first material and a second material is provided, and the first material is more reactive to laser energy than the second material. In another embodiment, a method of texturing a composite polishing pad is provided. The method includes directing a laser energy source onto a surface of the polishing pad to affect a greater ablation rate within a first material having a greater laser absorption rate and a lesser ablation rate within a second material having a lesser laser absorption rate to provide a micro-textured surface consistent with microstructure of the composite polishing pad.

Abstract translation: 本公开的实施例通常提供了一种用于抛光制品或抛光垫的方法和装置，其具有当暴露于激光能量时有助于均匀调理的微结构。 在一个实施例中，提供了包括第一材料和第二材料的组合的抛光垫，并且第一材料比第二材料对激光能量更有反应性。 在另一个实施例中，提供纹理化复合抛光垫的方法。 该方法包括将激光能量源引导到抛光垫的表面上以影响具有较大激光吸收率的第一材料内具有更大的消融速率，并且在具有较小激光吸收率的第二材料内具有较小的烧蚀速率以提供微观 表面与复合抛光垫的微结构一致。

公开(公告)号：US20140273752A1

公开(公告)日：2014-09-18

申请号：US14200149

申请日：2014-03-07

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Rixin PENG ,  Mario CORNEJO ,  Thomas BREZOCZKY ,  Fred REDEKER ,  Thomas H. OSTERHELD

IPC: B24B53/017 ,  B24B37/04

CPC classification number: B24B49/18 ,  B24B37/042 ,  B24B53/017

Abstract: A method and apparatus for conditioning a polishing pad used in a substrate polishing process. In one embodiment, a method for conditioning a polishing pad utilized to polish a substrate is provided. The method includes providing relative motion between an optical device and a polishing pad having a polishing medium disposed thereon, and scanning a processing surface of the polishing pad with a laser beam to condition the processing surface, wherein the laser beam has a wavelength that is substantially transparent to the polishing medium, but is reactive with the material of the polishing pad.

Abstract translation: 一种用于调整用于衬底抛光工艺中的抛光垫的方法和装置。 在一个实施例中，提供了一种用于调节用于抛光衬底的抛光垫的方法。 该方法包括提供光学装置与其上布置有抛光介质的抛光垫之间的相对运动，以及用激光束扫描抛光垫的处理表面以调节处理表面，其中激光束具有基本上 对抛光介质透明，但与抛光垫的材料反应。