利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

65 条记录 (耗时 0.059 秒)

    Semiconductor memory having a pulse generator for generating column pulses
    21.
    发明授权
    Semiconductor memory having a pulse generator for generating column pulses 有权
    具有产生列脉冲的脉冲发生器的半导体存储器

    公开(公告)号：US06963518B2

    公开(公告)日：2005-11-08

    申请号：US10387398

    申请日：2003-03-14

    申请人： Junichi Sasaki ,  Naoharu Shinozaki

    发明人： Junichi Sasaki ,  Naoharu Shinozaki

    IPC分类号： G11C11/407 ,  G11C7/00 ,  G11C7/10 ,  G11C7/22 ,  G11C11/401 ,  G11C8/00

    CPC分类号： G11C7/103 ,  G11C7/1048 ,  G11C7/22 ,  G11C2207/002

    摘要： A pulse generator generates a plurality of column pulses in response to a read command. An address counter outputs addresses subsequent to an external address supplied in association with the read command in succession as internal addresses. A column decoder successively selects column selecting lines in synchronization with the column pulses. A plurality of bits of data read from memory cells in response to a single read command RD is successively transmitted to a common data bus line through column switches. This can reduce the number of data bus lines to a minimum, preventing an increase in chip size. Since a single data bus line can transmit a plurality of bits of data, it is possible to minimize the size of the memory region to be activated in response to a read command. This consequently allows a reduction in power consumption.

    摘要翻译： 脉冲发生器响应于读取命令产生多个列脉冲。 地址计数器作为内部地址连续地输出与读取命令相关联地提供的外部地址之后的地址。 列解码器与列脉冲同步地连续地选择列选择线。 响应于单个读取命令RD从存储器单元读取的多个数据位被连续地通过列开关发送到公共数据总线。 这可以将数据总线的数量减少到最小，防止芯片尺寸的增加。 由于单个数据总线能够发送多个数据位，所以可以根据读取命令最小化要激活的存储器区域的大小。 因此，能够降低功耗。

    Optical module for optical transmission and manufacturing process therefor
    22.
    发明授权
    Optical module for optical transmission and manufacturing process therefor 有权
    用于光传输及其制造工艺的光模块

    公开(公告)号：US06393171B2

    公开(公告)日：2002-05-21

    申请号：US09885518

    申请日：2001-06-20

    申请人： Junichi Sasaki ,  Masataka Itoh ,  Naoki Kitamura

    发明人： Junichi Sasaki ,  Masataka Itoh ,  Naoki Kitamura

    IPC分类号： G02B612

    CPC分类号： G02B6/42 ,  G02B6/423 ,  G02B6/4232

    摘要： The integrity of a solder jointing pad, which is used to mount an optical module, is enhanced by avoiding exposure to high temperatures used in the formation of an accompanying optical wave guide. The enhanced integrity of the solder jointing pad permits a mounting solder bump to be evenly distributed on the pad, which improves mounting position characteristics. The solder jointing pads are elongated in shape and arranged in parallel and perpendicular orientation with respect to an optical transmission path in the optical module. The enhanced integrity of the solder jointing pads permits a precise amount of solder to be introduced to the pads when mounting the optical module. The optical module can then be precisely positioned simply by varying the amount of solder introduced to the solder jointing pads. The optical device can be positioned with high accuracy by taking advantage of the self-alignment action which occurs between the molten solder bumps and the solder jointing pads. The optical module can thus be precisely positioned during manufacturing, without the need for additional adjustments.

    摘要翻译： 用于安装光学模块的焊接焊盘的完整性通过避免暴露于形成伴随的光波导的高温来增强。 焊接焊盘的增强的完整性允许将焊料凸块均匀分布在焊盘上，这改善了安装位置特性。 焊接焊盘的形状是细长的，并且相对于光学模块中的光传输路径平行且垂直定向布置。 焊接接头焊盘的增强的完整性允许在安装光学模块时将精确量的焊料引入焊盘。 然后可以简单地通过改变引入焊接焊盘的焊料的量来精确地定位光学模块。 通过利用在熔融焊料凸块和焊接焊盘之间发生的自对准作用，可以高精度地定位光学装置。 因此，光学模块可以在制造期间精确地定位，而不需要额外的调整。

    PLASMA ETCHING METHOD, PLASMA ETCHING APPARATUS, AND COMPUTER-READABLE STORAGE MEDIUM
    25.
    发明申请
    PLASMA ETCHING METHOD, PLASMA ETCHING APPARATUS, AND COMPUTER-READABLE STORAGE MEDIUM 有权
    等离子体蚀刻方法，等离子体蚀刻装置和计算机可读存储介质

    公开(公告)号：US20110250761A1

    公开(公告)日：2011-10-13

    申请号：US13045988

    申请日：2011-03-11

    申请人： Sungtae LEE ,  Masahiro Ogasawara ,  Junichi Sasaki ,  Naohito Yanagida

    发明人： Sungtae LEE ,  Masahiro Ogasawara ,  Junichi Sasaki ,  Naohito Yanagida

    IPC分类号： H01L21/3065

    CPC分类号： H01L21/31144 ,  H01J37/32091

    摘要： A plasma etching method is provided to perform a plasma etching on a silicon oxide film or a silicon nitride film formed below an amorphous carbon film by using a pattern of the amorphous carbon film as a final mask in a multilayer mask including a photoresist layer having a predetermined pattern, an organic bottom anti-reflection coating (BARC) film formed below the photoresist layer, an SiON film formed below the BARC film, and the amorphous carbon film formed below the SiON film. An initial mask used at the time when the plasma etching of the silicon oxide film or the silicon nitride film is started is under a state in which the SiON film remains on the amorphous carbon film and a ratio of a film thickness of the amorphous carbon film to a film thickness of the residual SiON film is smaller than or equal to about 14.

    摘要翻译： 提供了一种等离子体蚀刻方法，用于通过在非晶碳膜的图案作为最终掩模的非晶碳膜上形成的氧化硅膜或氮化硅膜上进行等离子体蚀刻，所述多层掩模包括具有 预定图案，在光致抗蚀剂层下形成的有机底部防反射涂层（BARC）膜，在BARC膜下面形成的SiON膜和形成在SiON膜下面的无定形碳膜。 在氧化硅膜或氮化硅膜的等离子体蚀刻开始时使用的初始掩模是在无定形碳膜上残留SiON膜的状态和无定形碳膜的膜厚比 残留SiON膜的膜厚小于或等于约14。

    COMMUNICATION APPARATUS FOR COMMUNICATION BETWEEN HOUSING SLOTS, WIRING CHANGE UNIT AND WIRING METHOD
    28.
    发明申请
    COMMUNICATION APPARATUS FOR COMMUNICATION BETWEEN HOUSING SLOTS, WIRING CHANGE UNIT AND WIRING METHOD 审中-公开
    通信设备，用于通信接口，接线改变单元和接线方式

    公开(公告)号：US20090148116A1

    公开(公告)日：2009-06-11

    申请号：US11719649

    申请日：2005-11-18

    申请人： Shigeyuki Yanagimachi ,  Takashi Yoshikawa ,  Junichi Sasaki ,  Kazuhiko Kurata

    发明人： Shigeyuki Yanagimachi ,  Takashi Yoshikawa ,  Junichi Sasaki ,  Kazuhiko Kurata

    IPC分类号： G02B6/00

    CPC分类号： H05K7/1424 ,  G02B6/43 ,  H05K7/1447

    摘要： An intra-housing optical communication system includes card slots 61 to 64 and at least a concentrate slot and conducts the optical communication between the slots, wherein the optical wires between the card slots are connected by using an optical fiber sheet or the like to simplify the wiring and reduce the size of the housing. The concentrate slots include an optical wiring change unit 6 for changing the form of connection between the card slots, thereby making it possible to easily change the form of connection to the desired shape (mesh, ring, etc.). Also, the optical terminals of the optical connectors are shared by a plurality of the slots and thus made available for use among the optical connectors.

    摘要翻译： 一种室内光通信系统包括卡槽61至64和至少一个集中槽，并且在狭槽之间进行光通信，其中通过使用光纤片等将卡槽之间的光线连接，以简化 接线并减小外壳尺寸。 浓缩槽包括用于改变卡槽之间的连接形式的光布线改变单元6，从而可以容易地改变到所需形状（网格，环等）的连接形式。 此外，光连接器的光端子由多个槽共用，从而可在光连接器之间使用。

    OPTICAL COMMUNICATION MODULE AND OPTICAL SIGNAL TRANSMISSION METHOD
    29.
    发明申请
    OPTICAL COMMUNICATION MODULE AND OPTICAL SIGNAL TRANSMISSION METHOD 审中-公开
    光通信模块和光信号传输方法

    公开(公告)号：US20090052909A1

    公开(公告)日：2009-02-26

    申请号：US11814462

    申请日：2006-01-21

    申请人： Tomoyuki Hino ,  Kazuhiko Kurata ,  Yutaka Urino ,  Ichirou Ogura ,  Junichi Sasaki ,  Youichi Hashimoto

    发明人： Tomoyuki Hino ,  Kazuhiko Kurata ,  Yutaka Urino ,  Ichirou Ogura ,  Junichi Sasaki ,  Youichi Hashimoto

    IPC分类号： G02B6/28 ,  H04B10/12

    CPC分类号： G02B6/3897 ,  G02B6/43

    摘要： One or more one-dimensional array-shaped photoelectric conversion modules 302 are mounted on a board 301. A one-dimensional array-shaped light receiving/emitting element 303 is mounted in each of the one-dimensional array-shaped photoelectric conversion modules 302. Further, the one-dimensional array-shaped photoelectric conversion modules 302 are mechanically and optically connected to a flexible fiber sheet 306 through an optical connector 305. As parallel transmission paths 306 from the one-dimensional array-shaped photoelectric conversion modules 302 approach an end of a board 301, they are laminated with each other and connected to a two-dimensional array-shaped optical connector 307 at an end of the board. Further, a wavelength multiplexer/demultiplexer is connected to the optical connector.

    摘要翻译： 一个或多个一维阵列状光电转换模块302安装在板301上。一维阵列状光接收/发射元件303安装在一维阵列状光电转换模块302的每一个中。 此外，一维阵列状光电转换模块302通过光连接器305机械地和光学地连接到柔性纤维片材306上。由于一维阵列状光电转换模块302的平行传输路径306接近尾端 板301彼此层叠并连接到板的一端的二维阵列状光连接器307。 此外，波长多路复用器/解复用器连接到光学连接器。