公开(公告)号：US07088118B2

公开(公告)日：2006-08-08

申请号：US11011200

申请日：2004-12-15

申请人： An-Hong Liu ,  Yeong-Her Wang ,  Yeong-Ching Chao ,  Yao-Jung Lee

发明人： An-Hong Liu ,  Yeong-Her Wang ,  Yeong-Ching Chao ,  Yao-Jung Lee

IPC分类号： G01R31/02

CPC分类号： G01R31/2889 ,  G01R1/07378 ,  G01R31/2822

摘要： A modularized probe head for high frequency probing is provided. The probe head mainly includes a probe head, a mounting board and an interposer between the probe head and the mounting board. The probe head has a plurality of cavities on its back surface. A plurality of decoupling components are installed inside the cavities and are electrically coupled to the ground/power circuitry of the probe head via by-pass circuitry. The interposer has a bottom surface corresponding to the back surface of the probe head, and includes a plurality of contact ends on the bottom surface. Some of the contact ends electrically contact the decoupling components and electrically coupled to the ground plane of the mounting board.

摘要翻译： 提供了一种用于高频探测的模块化探头。 探头主要包括探头，安装板和探头与安装板之间的插入件。 探头在其后表面上具有多个空腔。 多个去耦组件安装在空腔内，并通过旁通电路电耦合到探头的接地/电源电路。 插入器具有对应于探针头的后表面的底面，并且在底面上包括多个接触端。 一些接触端与去耦组件电接触并电耦合到安装板的接地平面。

公开(公告)号：US20060125501A1

公开(公告)日：2006-06-15

申请号：US11011104

申请日：2004-12-15

申请人： An-Hong Liu ,  Yeong-Her Wang ,  Yeong-Ching Chao ,  Yao-Jung Lee

发明人： An-Hong Liu ,  Yeong-Her Wang ,  Yeong-Ching Chao ,  Yao-Jung Lee

IPC分类号： G01R31/02

CPC分类号： G01R31/2889 ,  G01R1/07314 ,  H05K3/325 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09481 ,  H05K2201/10378

摘要： A modularized probe head assembly mainly includes a probe head, an interposer and a probe head carrier with guide pins. The probe head has a plurality of first through holes. The interposer has a plurality of second through holes corresponding in location to the first through holes. The probe head carrier is configured to secure the PCB of a probe card and jointing the probe head with the interposer. A via is formed under a pad on the interposer. A plurality of stud bumps are formed on the pad. After assembling of the probe card, the guide pins pass through the first and second through holes and the stud bumps electrically contact the interconnect pad of the probe head.

摘要翻译： 模块化探头头组件主要包括探针头，插入器和带引导针的探针头托架。 探头具有多个第一通孔。 插入器具有与位于第一通孔对应的多个第二通孔。 探针头托架被配置为固定探针卡的PCB并将探头与插入器连接。 通孔形成在插入件上的垫下方。 在该垫上形成多个柱状凸块。 在组装探针卡之后，引导销通过第一通孔和第二通孔，柱形凸块与探针头的互连焊盘电接触。

公开(公告)号：US07005054B2

公开(公告)日：2006-02-28

申请号：US10223350

申请日：2002-08-20

申请人： S. J. Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Y. J. Lee

发明人： S. J. Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Y. J. Lee

IPC分类号： C25D5/02 ,  C25D5/54 ,  C25D5/56 ,  H05K3/00

CPC分类号： C25D5/022 ,  C25D5/04 ,  G01R1/07342 ,  G01R3/00 ,  H05K3/241 ,  H05K3/4007 ,  H05K2201/0367

摘要： A method to make probes of a probe card includes providing a blocking plate on an electroplating tank. The blocking plate has a plurality of openings according to the layout of contact pads on a probe head. There are bumps on the contact pads of the probe head. Continuous electroplating process can be executed after bumps (contact pads) contact electroplating solution in the electroplating tank through the openings of the blocking plate. By continuously moving the probe head according to the desired shape of probes, probes were formed by electroplating. These probes can be made into different shapes with good uniformity in elasticity and heights to increase the quality of electrical contact during wafer probing. Moreover, the process lead time and fabrication cost are saved.

摘要翻译： 探针卡的探针的方法包括在电镀槽上设置阻挡板。 阻挡板根据探针头上的接触垫的布局具有多个开口。 探针头的接触垫上有凸块。 凸点（接触垫）可以通过阻挡板的开口接触电镀槽中的电镀溶液，进行连续电镀工艺。 通过根据所需形状的探针连续移动探头，通过电镀形成探针。 这些探针可以制成不同的形状，具有良好的弹性和高度均匀性，以增加晶片探测期间电接触的质量。 此外，节省了处理时间和制造成本。

公开(公告)号：US20050012513A1

公开(公告)日：2005-01-20

申请号：US10620448

申请日：2003-07-17

申请人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

发明人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

IPC分类号： G01R1/073 ,  G01R1/18 ,  G01R31/28 ,  G01R31/02

CPC分类号： G01R1/07342 ,  G01R1/06733 ,  G01R1/18 ,  G01R31/2889

摘要： A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.

摘要翻译： 公开了一种探针卡组件。 探针卡组件包括分别与上印刷电路板和下印刷电路板组合的加强环。 多个同轴发射器安装在加强环中，并通过电缆连接器连接到上下印刷电路板。 下部印刷电路板组装有可拆卸的探针头，该探头包括具有探测点的硅衬底和探针头托架。 在探针头托架的中心处形成一个凹陷。 然后将标准化的同轴发射器，印刷电路板和探头组装成用于测试各种IC产品的探针卡组件。

公开(公告)号：US06686615B1

公开(公告)日：2004-02-03

申请号：US10223297

申请日：2002-08-20

申请人： S. J. Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Y. J. Lee

发明人： S. J. Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Y. J. Lee

IPC分类号： H01L2973

CPC分类号： H01L22/34 ,  H01L23/5258 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01019 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/00

摘要： A flip chip type semiconductor device for reducing signal skew includes: a chip with bonding pads, and a plurality of bumping pads on the chip. Between each bonding pad and corresponding bumping pads is connected with a metal redistribution trace covered by a passivation layer. Each metal trace has an equal trace length for reducing signal skew.

摘要翻译： 用于减少信号偏移的倒装芯片型半导体器件包括：具有接合焊盘的芯片和芯片上的多个凸点焊盘。 在每个焊盘和相应的焊盘之间连接有由钝化层覆盖的金属再分布迹线。 每个金属迹线具有相同的迹线长度，以减少信号偏移。

公开(公告)号：US06621710B1

公开(公告)日：2003-09-16

申请号：US10198118

申请日：2002-07-19

申请人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

发明人： Shih-Jye Cheng ,  An-Hong Liu ,  Yeong-Her Wang ,  Yuan-Ping Tseng ,  Yao-Jung Lee

IPC分类号： H01R900

CPC分类号： H01R13/22 ,  H01R2201/20

摘要： A modular probe card assembly comprises a silicon substrate with probes modularly assembled on a main board. At least a socket is installed around silicon substrate and electrically connects to probe needles by a flexible printed wiring film. A plurality of detachable coaxial wires electrically connect sockets with the main board for achieving variability of connecting paths during manufacturing. Thus, the probe card assembly has the effect of adjustable amendment and is suitable for high speed testing.

摘要翻译： 模块化探针卡组件包括具有模块地组装在主板上的探针的硅衬底。 至少一个插座安装在硅衬底周围，并通过柔性印刷布线膜电连接到探针上。 多个可拆卸的同轴线将插座与主板电连接以实现制造期间的连接路径的变化。 因此，探针卡组件具有可调节的修正效果，适用于高速测试。

公开(公告)号：US5115441A

公开(公告)日：1992-05-19

申请号：US637245

申请日：1991-01-03

申请人： Rose F. Kopf ,  Henry M. O'Bryan, Jr. ,  Erdmann F. Schubert ,  Li-Wei Tu ,  Yeong-Her Wang ,  George J. Zydzik

发明人： Rose F. Kopf ,  Henry M. O'Bryan, Jr. ,  Erdmann F. Schubert ,  Li-Wei Tu ,  Yeong-Her Wang ,  George J. Zydzik

IPC分类号： H01S5/00 ,  H01S5/042 ,  H01S5/183 ,  H01S5/187 ,  H01S5/20 ,  H01S5/343

CPC分类号： B82Y20/00 ,  H01S5/18308 ,  H01S2301/18 ,  H01S5/0425 ,  H01S5/06216 ,  H01S5/2063 ,  H01S5/3432

摘要： Optically transparent and electrically conductive cadmium tin oxide or indium tin oxide is employed in vertical cavity surface emitting lasers for vertical current injection. Continuous wave lasing at room temperature is achieved in GaAs/AlGaAs quantum well lasers. Devices with a 10 .mu.m optical window which also serves as a vertical current injection inlet give lasing threshold currents as low as 3.8 mA. The differential series resistance is (350-450) .OMEGA. with a diode voltage of (5.1-5.6) V at the lasing threshold. Far field pattern of the laser emission is Gaussian-like with a full width at half maximum of 7.degree..

公开(公告)号：US09052332B2

公开(公告)日：2015-06-09

申请号：US13484681

申请日：2012-05-31

申请人： Chih-Wei Huang ,  Chieh-Pin Chang ,  Ja-Hao Chen ,  Chuan-Jane Chao ,  Ying-Zong Juang ,  Shyh-Chyi Wong ,  Yeong-Her Wang

发明人： Chih-Wei Huang ,  Chieh-Pin Chang ,  Ja-Hao Chen ,  Chuan-Jane Chao ,  Ying-Zong Juang ,  Shyh-Chyi Wong ,  Yeong-Her Wang

IPC分类号： G01P15/09 ,  G01P15/08 ,  G01P15/12

CPC分类号： G01P15/0802 ,  G01P15/123 ,  G01P2015/0837

摘要： A pizeoresistive type Z-axis accelerometer is provided, including a substrate; a plurality of anchors formed over the substrate; a plurality of cantilever beams, wherein the cantilever beams include a piezoresistive material; and a proof mass, wherein the proof mass is suspended over the substrate by respectively connecting the proof mass with the anchors, and the accelerometer senses a movement of the proof mass by the piezoresistive material.

摘要翻译： 提供了一种包括基板的等离子体型Z轴加速度计， 形成在所述基板上的多个锚固件; 多个悬臂梁，其中所述悬臂梁包括压阻材料; 以及证明物质，其中通过分别将证明物质与锚固件连接，将证明物料悬浮在基材上，并且加速度计通过压阻材料感测证明物质的移动。

公开(公告)号：US08904868B2

公开(公告)日：2014-12-09

申请号：US13458359

申请日：2012-04-27

申请人： Chih-Wei Huang ,  Chieh-Pin Chang ,  Ja-Hao Chen ,  Chuan-Jane Chao ,  Ying-Zong Juang ,  Shyh-Chyi Wong ,  Yeong-Her Wang

发明人： Chih-Wei Huang ,  Chieh-Pin Chang ,  Ja-Hao Chen ,  Chuan-Jane Chao ,  Ying-Zong Juang ,  Shyh-Chyi Wong ,  Yeong-Her Wang

IPC分类号： G01P15/125 ,  G01P15/08

CPC分类号： G01P15/125 ,  G01P2015/0814

摘要： A sensing apparatus includes an acceleration sensing unit, for measuring an acceleration applied to a proof mass, further including: a proof mass; a carrier signal source, for providing a carrier signal; a capacitive half-bridge, including a first and a second capacitor, wherein each capacitor is coupled to the proof mass and the carrier signal source, one with a positive electrode and the other one with a negative electrode, and the acceleration applied to the proof mass makes the carrier signal flow through the first and the second capacitor so that the first capacitor and the second capacitor respectively generates a first voltage and a second voltage variation which have opposite phases with each other; and an instrumentation amplifier, for receiving and amplifying the first voltage and the second voltage variation, whereby the magnitude and the direction of the acceleration applied to the proof mass is determined.

摘要翻译： 感测装置包括加速度检测单元，用于测量施加到检验质量块的加速度，还包括：检验质量块; 载波信号源，用于提供载波信号; 包括第一和第二电容器的电容半桥，其中每个电容器耦合到检测质量块和载波信号源，一个具有正电极，另一个与负电极耦合，并且加速度应用于证明 质量使载体信号流过第一和第二电容器，使得第一电容器和第二电容器分别产生彼此具有相反相位的第一电压和第二电压变化; 以及用于接收和放大第一电压和第二电压变化的仪表放大器，由此确定施加到检验质量块的加速度的大小和方向。

公开(公告)号：US20070069749A1

公开(公告)日：2007-03-29

申请号：US11605442

申请日：2006-11-29

申请人： Yi-Chang Lee ,  An-Hong Liu ,  Yeong-Her Wang ,  Yeong-Ching Chao ,  Hsiang-Ming Huang

发明人： Yi-Chang Lee ,  An-Hong Liu ,  Yeong-Her Wang ,  Yeong-Ching Chao ,  Hsiang-Ming Huang

IPC分类号： G01R31/02

CPC分类号： G01R3/00 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07342 ,  H01R13/2414 ,  H01R43/007 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： A method of forming a plurality of elastic probes in a row is disclosed. Firstly, a substrate is provided, then, a shaping layer is formed on the substrate so as to offer two flat surfaces in parallel. A photoresist layer is formed on the substrate and on the shaping layer. Then, the photoresist layer is patterned to form a plurality of slots crossing an interface between the two flat surfaces where a plurality of elastic probes are formed in the slots. In one embodiment, the interface is an edge slope of the shaping layer so that each of the elastic probes has at least an elastic bending portion. During chip probing, the shifting direction of the elastic probes due to overdrives is perpendicular to the arranging direction of the bonding pads so that the elastic probes are suitable for probing chips with high-density and fine-pitch bonding pads.

摘要翻译： 公开了一排形成多个弹性探针的方法。 首先，提供基板，然后在基板上形成成形层，以便平行地提供两个平坦表面。 在基板上和形成层上形成光致抗蚀剂层。 然后，对光致抗蚀剂层进行图案化以形成与两个平坦表面之间的界面交叉的多个槽，其中在槽中形成有多个弹性探针。 在一个实施例中，界面是成形层的边缘斜率，使得每个弹性探针具有至少一个弹性弯曲部分。 在芯片探测期间，由于过驱动导致的弹性探针的移动方向垂直于接合焊盘的布置方向，使得弹性探头适用于探测具有高密度和细间距接合焊盘的芯片。