公开(公告)号：US5942798A

公开(公告)日：1999-08-24

申请号：US977078

申请日：1997-11-24

Applicant: Anthony M. Chiu

Inventor： Anthony M. Chiu

IPC: H01L21/56 ,  H01L23/48

CPC classification number: H01L21/563 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3025

Abstract: An apparatus and method for underfilling a silicon chip (16) to a substrate (12) by depositing an underfill dam (18) on the surface (20) of the substrate (12) prior to addition of the underfill material (14), is disclosed. A bead of underfill material (14) is provided on the substrate (12) about the periphery of the silicon chip (16), within the underfill dam (18). The underfill material (14) fills the gap (22) between the electrical contacts, the substrate (12) and the silicon chip (16) by capillary action and differential pressure created by a vacuum system (40).

Abstract translation: 在加入底部填充材料（14）之前，通过在衬底（12）的表面（20）上沉积底部填充坝（18）将硅芯片（16）底部填充到衬底（12）的装置和方法是 披露 底部填充材料（14）的小珠围绕硅芯片（16）的周边在底部填充坝（18）内设置在基底（12）上。 底部填充材料（14）通过由真空系统（40）产生的毛细作用和压差填充电触头，基板（12）和硅芯片（16）之间的间隙（22）。

公开(公告)号：US5849132A

公开(公告)日：1998-12-15

申请号：US485169

申请日：1995-08-04

Applicant: Anthony M. Chiu

Inventor： Anthony M. Chiu

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  B05D3/12

CPC classification number: H01L21/4853 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H05K3/3436 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/11332 ,  H01L2224/1184 ,  H01L2224/13078 ,  H01L2224/13191 ,  H01L2224/1357 ,  H01L2224/13644 ,  H01L2224/45144 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K2201/0212 ,  H05K2201/0979 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/082 ,  H05K3/321 ,  Y02P70/613 ,  Y10T156/109 ,  Y10T29/49224

Abstract: A contact for a semiconductor device or passive substrate is made up of an array of conductive balls, the individual balls of the contact being a compressible material coated with a metal conductive material. The balls in the array are compressed while being bonded to the contact area to provide a larger bond area between the ball and the contact area to which it is bonded.

Abstract translation: 用于半导体器件或无源基板的触点由导电球阵列组成，接触的各个球是涂覆有金属导电材料的可压缩材料。 阵列中的球在被接合到接触区域的同时被压缩，以在球和接合区域之间提供更大的接合面积。

公开(公告)号：US5677247A

公开(公告)日：1997-10-14

申请号：US725600

申请日：1996-10-03

Applicant: Michael J. Hundt ,  Anthony M. Chiu

Inventor： Michael J. Hundt ,  Anthony M. Chiu

IPC: H01R33/76 ,  H01L23/32 ,  H01L23/40 ,  H01R12/00 ,  H05K7/10 ,  H05K7/20 ,  H01L21/60

CPC classification number: H05K7/1069 ,  H01L23/4093 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/181

Abstract: A socketed integrated circuit packaging system, including a packaged integrated circuit and a socket therefor, is disclosed. The integrated circuit package includes a device circuit board to which a thermally conductive slug is mounted; the underside of the device circuit board has a plurality of lands arranged in an array. The integrated circuit chip is mounted to the slug, through a hole in the device circuit board, and is wire-bonded to the device circuit board and thus to the lands on the underside. The socket is a molded frame, having a hole therethrough to receive the conductive slug of the integrated circuit package; the socket may also have its own thermally conductive slug disposed within the hole of the frame. The socket has spring contact members at locations matching the location of the lands on the device circuit board. The integrated circuit package may be inserted into the socket frame, held there by a metal or molded clip. A low profile, low cost, and high thermal conductivity package and socket combination, is thus produced.

Abstract translation: 公开了一种插座集成电路封装系统，包括封装集成电路及其插座。 集成电路封装包括安装导热块的器件电路板; 器件电路板的下侧具有排列成阵列的多个焊盘。 集成电路芯片通过器件电路板上的一个孔安装到芯块上，并且被引线接合到器件电路板，从而连接到底面的焊盘上。 插座是模制框架，具有穿过其中的孔以接收集成电路封装的导电块; 插座还可以具有设置在框架的孔内的其自身的导热块。 插座在与设备电路板上的焊盘的位置匹配的位置处具有弹簧接触构件。 集成电路封装可以插入插座框架中，通过金属或模制夹子保持在该框架中。 因此，制造了薄型，低成本和高导热性的封装和插座组合。

公开(公告)号：US5239199A

公开(公告)日：1993-08-24

申请号：US839041

申请日：1992-02-18

Applicant: Anthony M. Chiu

Inventor： Anthony M. Chiu

IPC: H01L23/495 ,  H05K3/30 ,  H05K7/20

CPC classification number: H01L23/4951 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/8592 ,  H05K3/303 ,  H05K3/306

Abstract: A vertical lead-on-chip package and the method of making defines a high density array of semiconductor devices with leads extending from and across one face of the device, to the edge of the device such that a plurality of devices are vertically mounted on a circuit board. Each device has a heat sink thereon which is held in a fixture which serves as an array heat sink during testing and burn-in and during mounting and operation of the devices on the circuit board.

Abstract translation: 一种垂直的片上芯片封装及其制造方法通过从器件的一个表面延伸到器件的边缘的引线来限定半导体器件的高密度阵列，使得多个器件垂直地安装在器件的边缘上 电路板。 每个设备在其上具有散热器，其在测试和老化期间以及在电路板上的设备的安装和操作期间保持在用作阵列散热器的固定装置中。

公开(公告)号：US07786582B2

公开(公告)日：2010-08-31

申请号：US11455503

申请日：2006-06-19

Applicant: Danielle A. Thomas ,  Harry Michael Siegel ,  Antonio A. Do Bento Vieira ,  Anthony M. Chiu

Inventor： Danielle A. Thomas ,  Harry Michael Siegel ,  Antonio A. Do Bento Vieira ,  Anthony M. Chiu

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L24/13 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05546 ,  H01L2224/05624 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: A system and method is disclosed for providing a redistribution metal layer in an integrated circuit. The redistribution metal layer is formed from the last metal layer in the integrated circuit during manufacture of the integrated circuit before final passivation is applied. The last metal layer provides sites for solder bump pads used in flip chip interconnection. The redistribution metal layer can be (1) a flat layer deposited over the next to last metal layer through an opening in a dielectric layer, or (2) deposited over an array of vias connected to the next to last metal layer. Space between the solder bump pads is deposited with narrower traces for connecting active circuit areas below. A final passivation layer is deposited to ensure product reliability.

Abstract translation: 公开了用于在集成电路中提供再分配金属层的系统和方法。 在施加最终钝化之前，在集成电路的制造期间，由分布金属层由集成电路中的最后一个金属层形成。 最后一个金属层提供了用于倒装芯片互连的焊料凸块的位置。 再分布金属层可以是（1）通过介电层中的开口沉积在下一个最后金属层上的平坦层，或（2）沉积在连接到最后一个金属层上的通孔阵列上。 焊锡凸块之间的空间沉积有较窄的走线，用于连接下面的有源电路区域。 沉积最后的钝化层以确保产品的可靠性。

公开(公告)号：US07595017B2

公开(公告)日：2009-09-29

申请号：US10066245

申请日：2002-01-31

Applicant: Harry Michael Siegel ,  Anthony M. Chiu

Inventor： Harry Michael Siegel ,  Anthony M. Chiu

IPC: B29C45/02

CPC classification number: H01L21/566 ,  H01L23/3107 ,  H01L2924/0002 ,  Y10T428/31663 ,  H01L2924/00

Abstract: A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape of the film to a mold cavity surface of the transfer mold. The pre-formed film is then placed adjacent to the surfaces of the mold cavity of the transfer mold. The mold cavity is filled with molding compound and the integrated circuit is encapsulated. The pre-formation of the film allows materials to be used that are not suitable for use with prior art methods.

Abstract translation: 公开了一种用于在传递模塑工艺中使用预成型膜的系统和方法，该方法使用转移模具将模制化合物的集成电路的部分封装。 预先形成柔顺材料薄膜以使膜的形状符合转移模具的模腔表面。 然后将预成型的膜放置在传送模具的模腔的表面附近。 模腔充满模塑料，集成电路封装。 该膜的预成型允许使用不适用于现有技术方法的材料。

公开(公告)号：US07547483B2

公开(公告)日：2009-06-16

申请号：US10958575

申请日：2004-10-05

Applicant: Anthony M. Chiu

Inventor： Anthony M. Chiu

IPC: H01M2/00 ,  H01M8/00 ,  H01M8/10 ,  H01M8/18

CPC classification number: H01M8/0612 ,  H01M8/04089 ,  H01M8/04201 ,  H01M8/04291 ,  H01M8/0656 ,  H01M8/186 ,  H01M2008/1095 ,  Y02E60/528

Abstract: A fuel cell device includes a housing containing a fuel processor that generates fuel gas and a fuel cell having electrodes forming an anode and cathode, and an ion exchange electrolyte positioned between the electrodes. The housing can be formed as first and second cylindrically configured outer shell sections that form a battery cell that is configured similar to a commercially available battery cell. A thermal-capillary pump can be operative with the electrodes and an ion exchange electrolyte, and operatively connected to the fuel processor. The electrodes are configured such that heat generated between the electrodes forces water to any cooler edges of the electrodes and is pumped by capillary action back to the fuel processor to supply water for producing hydrogen gas. The electrodes can be formed on a silicon substrate that includes a flow divider with at least one fuel gas input channel that can be controlled by a MEMS valve.

Abstract translation: 燃料电池装置包括容纳产生燃料气体的燃料处理器和形成阳极和阴极的电极的燃料电池和位于电极之间的离子交换电解质的壳体。 壳体可以形成为形成类似于市售电池单元的电池单元的第一和第二圆柱形构造的外壳部分。 热毛细管泵可以与电极和离子交换电解质操作，并且可操作地连接到燃料处理器。 电极被配置成使得在电极之间产生的热量迫使水到达电极的任何较冷的边缘，并且通过毛细作用泵送回到燃料处理器以供应用于产生氢气的水。 电极可以形成在硅衬底上，该硅衬底包括具有可由MEMS阀控制的至少一个燃料气体输入通道的分流器。

公开(公告)号：US06787388B1

公开(公告)日：2004-09-07

申请号：US09656984

申请日：2000-09-07

Applicant: Anthony M. Chiu

Inventor： Anthony M. Chiu

IPC: H01L2144

CPC classification number: H01L23/60 ,  G06K9/00053 ,  H01L23/49555 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: In a packaged integrated circuit, electrostatic discharge protection is provided by portions of a lead frame on which the integrated circuit is mounted. The lead frame includes a die paddle on which an integrated circuit die is mounted, with plastic or epoxy material encapsulating exposed surfaces of the integrated circuit die except for a sensing surface, and supporting pins or leads formed from the lead frame. Portions of the lead frame extending from the die paddle are folded around sides of the encapsulated integrated circuit die and over, or adjacent to and level with, a peripheral upper surface of the encapsulated integrated circuit die to form an electrostatic discharge ring. The lead frame portions folded around the integrated circuit package are connected to ground through a ground pin, so that charge on a human finger touching the electrostatic discharge ring is dissipated to ground before the finger contacts a sensing surface of the integrated circuit. The portions of the lead frame which are folded around the encapsulated integrated circuit die may extend only around sides or side regions of the integrated circuit package not including pins or leads or, alternatively, may extend around all sides of the integrated circuit package and have openings where side regions of the integrated circuit package includes pins or leads.

Abstract translation: 在封装的集成电路中，通过安装集成电路的引线框架的部分提供静电放电保护。 引线框架包括其上安装有集成电路管芯的管芯，除了感测表面之外，塑料或环氧材料封装集成电路管芯的暴露表面，以及由引线框形成的支撑销或引线。 从模片延伸的引线框架的部分在封装的集成电路管芯的侧面折叠，并且与封装的集成电路管芯的外围上表面相邻或相邻并且与其平齐，以形成静电放电环。 围绕集成电路封装折叠的引线框架部分通过接地引脚连接到地，使得手指接触静电放电环的电荷在手指接触集成电路的感测表面之前被耗散到地面。 引线框架围绕封装的集成电路芯片折叠的部分可以仅在不包括引脚或引线的集成电路封装的侧面或侧面区域上延伸，或者可以围绕集成电路封装的所有侧面延伸并且具有开口 集成电路封装的侧面区域包括引脚或引线。

公开(公告)号：US06771500B1

公开(公告)日：2004-08-03

申请号：US10400249

申请日：2003-03-27

Applicant: Harry Michael Siegel ,  Anthony M. Chiu

Inventor： Harry Michael Siegel ,  Anthony M. Chiu

IPC: H05K720

CPC classification number: H01L23/473 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention comprises a lid that is capable of being placed in contact with and attached to an integrated circuit that has an exposed surface of an integrated circuit die. The lid has portions that form a cavity between a surface of the lid and the exposed surface of the integrated circuit die when the lid is placed in contact with the integrated circuit. The lid also has portions that form a first fluid conduit for transporting a fluid into the cavity and a second fluid conduit for transporting the fluid out of the cavity. Heat from the integrated circuit die is absorbed by the fluid by direct convection and removed from the integrated circuit when the fluid is removed from the cavity.

Abstract translation: 本发明包括能够被放置成与具有集成电路管芯的暴露表面的集成电路接触并附接的盖。 当盖与集成电路接触时，盖具有在盖的表面和集成电路裸片的暴露表面之间形成空腔的部分。 盖子还具有形成用于将流体输送到空腔中的第一流体导管和用于将流体输送出空腔的第二流体导管的部分。 来自集成电路管芯的热量通过直接对流被流体吸收，并且当流体从空腔中移出时从集成电路移除。

公开(公告)号：US06707163B2

公开(公告)日：2004-03-16

申请号：US09835306

申请日：2001-04-13

Applicant: Anthony M. Chiu

Inventor： Anthony M. Chiu

IPC: H01L2352

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/29011 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

Abstract: A preformed adhesive layer for joining components within integrated circuit packaging includes venting slots for controlling the size and location of voids within an assembled integrated circuit package. Air randomly entrapped between the surfaces of the adhesive layer and adjoining components during assembly will generally release into the venting slots during subsequent assembly and/or mounting steps performed at elevated temperatures, rather than creating internal pressures causing separation of package components or releasing into the encapsulant. Die delamination and encapsulant void problems occurring during reflow or other assembly and mounting processes as a result of entrapped air are avoided.

Abstract translation: 用于连接集成电路封装内的部件的预成型粘合剂层包括用于控制组装的集成电路封装内的空隙的尺寸和位置的排气槽。 在组装过程中随机夹带在粘合剂层表面和相邻部件之间的空气通常在随后在高温下进行的组装和/或安装步骤期间释放到通风槽中，而不是产生导致包装部件分离或释放到密封剂中的内部压力 。 在回流或其它组装和装配过程中由于夹带空气而导致的脱模和密封剂空隙问题被避免。