公开(公告)号：US09842822B2

公开(公告)日：2017-12-12

申请号：US14831463

申请日：2015-08-20

申请人： SK hynix Inc.

发明人： Hyeong Seok Choi

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L25/075 ,  H01L25/11

CPC分类号： H01L24/72 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/90 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/0756 ,  H01L25/117 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13078 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13191 ,  H01L2224/13193 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2224/90

摘要： A semiconductor package may include a first substrate and a second substrate. Socket bumps may be disposed on the first substrate to provide insertion grooves within the socket bumps. Plug bumps may be disposed on the second substrate. The plug bumps may be configured for insertion into the insertion grooves of the socket bumps and may electrically connect to the socket bumps. Related memory cards and electronic systems may also be provided.

公开(公告)号：US07221053B2

公开(公告)日：2007-05-22

申请号：US11086922

申请日：2005-03-21

申请人： Thorsten Meyer ,  Harry Hedler ,  Stephan Dobritz

发明人： Thorsten Meyer ,  Harry Hedler ,  Stephan Dobritz

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/13 ,  H01L23/3114 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13191 ,  H01L2224/13541 ,  H01L2224/13551 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/14051 ,  H01L2224/14141 ,  H01L2224/14145 ,  H01L2224/14146 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/17051 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10659 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention relates to an integrated device comprising an electronic circuit chip, a solder contact structure to provide contact to the electronic circuit chip and an elastic contact structure to provide contact to the electronic circuit chip, wherein the solder contact structure and the elastic contact structure are arranged on a contacting surface of the integrated device.

摘要翻译： 本发明涉及一种集成装置，其包括电子电路芯片，提供与电子电路芯片的接触的焊接触点结构和用于提供与电子电路芯片的接触的弹性接触结构，其中焊料接触结构和弹性接触结构 布置在集成装置的接触表面上。

公开(公告)号：US20160293565A1

公开(公告)日：2016-10-06

申请号：US14831463

申请日：2015-08-20

申请人： SK hynix Inc.

发明人： Hyeong Seok CHOI

IPC分类号： H01L23/00

CPC分类号： H01L24/72 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/90 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/0756 ,  H01L25/117 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13078 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13191 ,  H01L2224/13193 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2224/90

摘要： A semiconductor package may include a first substrate and a second substrate. Socket bumps may be disposed on the first substrate to provide insertion grooves within the socket bumps. Plug bumps may be disposed on the second substrate. The plug bumps may be configured for insertion into the insertion grooves of the socket bumps and may electrically connect to the socket bumps. Related memory cards and electronic systems may also be provided.

摘要翻译： 半导体封装可以包括第一衬底和第二衬底。 插座凸块可以设置在第一基板上，以在插座凸块内提供插入槽。 插头凸块可以设置在第二基板上。 插头凸块可以被配置为插入到插座凸块的插入槽中，并且可以电连接到插座凸块。 还可以提供相关的存储卡和电子系统。

公开(公告)号：US20140232427A1

公开(公告)日：2014-08-21

申请号：US13511137

申请日：2011-11-09

申请人： Laksmi Namburi ,  Matt Losey ,  Florent Cros

发明人： Laksmi Namburi ,  Matt Losey ,  Florent Cros

IPC分类号： G01R1/067 ,  H05K13/00 ,  G01R1/073

CPC分类号： G01R1/06794 ,  G01R1/0491 ,  G01R1/06716 ,  G01R1/06755 ,  G01R1/07314 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2889 ,  H01L2224/13191 ,  H01L2924/1461 ,  H05K13/00 ,  Y10T29/49155 ,  H01L2924/00

摘要： Provided are microfabricated probe elements, including elastomer elements, and methods of making the same, that can be readily used with fine pitch microelectronic arrays, for instance by providing sufficient compliance in a small package, while minimizing deflection forces, and while precisely maintaining the planarity and positioning of the contact tips across vast grid arrays. Elastomer elements may be generated using photolithography, either directly or through a sacrificial lost-mold process. Elastomer probe elements are provided with rigid tip structures microfabricated thereon to improve contact pressure. A novel space transformation probe card assembly is also provided.

摘要翻译： 提供了微制造的探针元件，包括弹性体元件及其制造方法，其可以容易地与细间距微电子阵列一起使用，例如通过在小封装中提供足够的柔量，同时最小化偏转力，同时精确地保持平面度 并将接触尖端定位在广泛的网格阵列上。 弹性体元件可以使用光刻技术直接地或通过牺牲损失模具工艺来产生。 弹性体探针元件设置有微加工在其上的刚性尖端结构以改善接触压力。 还提供了一种新颖的空间转换探针卡组件。

公开(公告)号：US20120104574A1

公开(公告)日：2012-05-03

申请号：US12914274

申请日：2010-10-28

申请人： Josef Boeck ,  Rudolf Lachner ,  Maciej Wojnowski ,  Thorsten Meyer

发明人： Josef Boeck ,  Rudolf Lachner ,  Maciej Wojnowski ,  Thorsten Meyer

IPC分类号： H01L23/552 ,  H01L21/50 ,  H01L23/52

CPC分类号： H01L24/20 ,  G01S7/032 ,  H01L23/49816 ,  H01L23/66 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/81 ,  H01L24/96 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/11318 ,  H01L2224/1132 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/13191 ,  H01L2224/13299 ,  H01L2224/14051 ,  H01L2224/141 ,  H01L2224/14505 ,  H01L2224/14517 ,  H01L2224/16225 ,  H01L2224/17517 ,  H01L2224/21 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/831 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3512 ,  H01L2924/384 ,  H01Q1/44 ,  H01Q17/00 ,  H01Q23/00 ,  H05K3/3436 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor module having one or more integrated antennas in a single package is provided herein to comprise a bonding interconnect structure having a plurality of individual bonding elements that are confined to a relatively small area of the bottom of a package. In particular, the semiconductor module comprises a bonding interconnect structure configured to connect an integrated package to a printed circuit board (PCB), wherein the integrated antenna structures are located at greater center-to-center distance from the IC device than the three dimensional interconnect structures. Therefore, the bonding interconnect structures are confined to a connection area that causes a part of the package containing the one or more antenna structures to extend beyond the bonding interconnect structure as a cantilevered structure. Such a bonding interconnect structure result in a package that is in contact with a PCB at a relatively small area that supports the load of the package.

摘要翻译： 本文提供了在单个封装中具有一个或多个集成天线的半导体模块，其包括具有限定在封装的底部的较小区域的多个单独的结合元件的接合互连结构。 特别地，半导体模块包括被配置为将集成封装连接到印刷电路板（PCB）的接合互连结构，其中集成天线结构位于距离IC器件更大的中心到距离三维互连 结构。 因此，接合互连结构被限制在连接区域上，该连接区域使得包含一个或多个天线结构的封装的一部分延伸超过作为悬臂结构的接合互连结构。 这种接合互连结构导致在支撑封装负载的较小区域处与PCB接触的封装。

公开(公告)号：US20110095420A1

公开(公告)日：2011-04-28

申请号：US12923885

申请日：2010-10-13

申请人： Fumihiro Bekku

发明人： Fumihiro Bekku

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L24/11 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/13 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/114 ,  H01L2224/11515 ,  H01L2224/11618 ,  H01L2224/11826 ,  H01L2224/13005 ,  H01L2224/13008 ,  H01L2224/13017 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/13191 ,  H01L2224/1329 ,  H01L2224/13291 ,  H01L2224/133 ,  H01L2224/13541 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13644 ,  H01L2224/1411 ,  H01L2224/14151 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes a protective insulating film, an opening formed in the protective insulating film, an electrode pad located within the opening, a bump formed on the protective insulating film, and an interconnect. The bump includes a bump core and a conductive film. The bump core includes an insulating resin layer and a conductive resin layer located on the insulating resin layer. The conductive film is formed on at least the upper surface of the bump core. The interconnect connects the conductive film of the bump and the electrode pad.

摘要翻译： 半导体器件包括保护绝缘膜，形成在保护绝缘膜中的开口，位于开口内的电极垫，形成在保护绝缘膜上的凸起和互连。 凸块包括凸块和导电膜。 凸块包括绝缘树脂层和位于绝缘树脂层上的导电树脂层。 至少在凸起芯的上表面上形成导电膜。 互连连接凸块的导电膜和电极垫。

公开(公告)号：US09704818B1

公开(公告)日：2017-07-11

申请号：US15203055

申请日：2016-07-06

申请人： NANYA TECHNOLOGY CORPORATION

发明人： Po Chun Lin

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/44 ,  H01L23/00

CPC分类号： H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0332 ,  H01L2224/03416 ,  H01L2224/0361 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05022 ,  H01L2224/05073 ,  H01L2224/05111 ,  H01L2224/05116 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05184 ,  H01L2224/05551 ,  H01L2224/05557 ,  H01L2224/05564 ,  H01L2224/05572 ,  H01L2224/05578 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/0569 ,  H01L2224/10126 ,  H01L2224/1112 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13011 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13022 ,  H01L2224/13078 ,  H01L2224/1319 ,  H01L2224/13191 ,  H01L2224/13541 ,  H01L2224/13553 ,  H01L2224/1356 ,  H01L2224/13561 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13616 ,  H01L2224/13624 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/13684 ,  H01L2224/1369 ,  H01L2924/06 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/0715 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

摘要： A semiconductor structure includes a substrate; a pad disposed over the substrate; a passivation disposed over the substrate and exposing a portion of the pad; and a bump disposed over the portion of the pad. The bump includes a buffering member disposed over the portion of the pad; and a conductive layer surrounding the buffering member and electrically connected to the pad.

公开(公告)号：US09287210B2

公开(公告)日：2016-03-15

申请号：US14561751

申请日：2014-12-05

申请人： FUJITSU LIMITED

发明人： Hajime Kubota

IPC分类号： H01L23/12 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/525 ,  H01L23/34 ,  H01L25/065 ,  H01L23/00

CPC分类号： H01L23/525 ,  H01L23/345 ,  H01L23/52 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/98 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/1012 ,  H01L2224/13005 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13025 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13187 ,  H01L2224/1319 ,  H01L2224/13191 ,  H01L2224/13561 ,  H01L2224/13565 ,  H01L2224/13578 ,  H01L2224/13582 ,  H01L2224/13583 ,  H01L2224/13647 ,  H01L2224/1369 ,  H01L2224/1601 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/81007 ,  H01L2224/811 ,  H01L2224/81815 ,  H01L2224/819 ,  H01L2224/81902 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00012 ,  H01L2924/0715 ,  H01L2924/0497 ,  H01L2924/01025 ,  H01L2924/0549 ,  H01L2924/05342 ,  H01L2924/0536 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014

摘要： A semiconductor device includes: a first semiconductor-chip including a first electrode; a second semiconductor-chip including a second electrode; and a switch including a core element configured to contract and expand by a temperature change, a heat generation unit configured to heat the core element, a first metal element configured to cover the core element and connected to the first electrode, and a second metal element configured to cover the core element and connected to the second electrode, wherein, when the core element contracts, the first metal element and the second metal element come in contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically connected with each other, and when the core element expands, the first metal element and the second metal element become in non-contact with each other so that the first semiconductor-chip and the second semiconductor-chip are electrically separated from each other.

摘要翻译： 一种半导体器件包括：包括第一电极的第一半导体芯片; 包括第二电极的第二半导体芯片; 以及包括被构造成通过温度变化而收缩和膨胀的芯体元件的开关，被配置为加热所述芯元件的发热单元，被配置为覆盖所述芯元件并连接到所述第一电极的第一金属元件，以及第二金属元件 被配置为覆盖所述芯体并连接到所述第二电极，其中，当所述芯体收缩时，所述第一金属元件和所述第二金属元件彼此接触，使得所述第一半导体芯片和所述第二半导体芯片是 彼此电连接，并且当芯元件膨胀时，第一金属元件和第二金属元件彼此不接触，使得第一半导体芯片和第二半导体芯片彼此电分离。

公开(公告)号：US20120133042A1

公开(公告)日：2012-05-31

申请号：US13320998

申请日：2009-05-21

申请人： Shintarou Hayashi ,  Mitsuhiko Ueda ,  Yoshiharu Sanagawa ,  Takamasa Sakai

发明人： Shintarou Hayashi ,  Mitsuhiko Ueda ,  Yoshiharu Sanagawa ,  Takamasa Sakai

IPC分类号： H01L23/488 ,  H01L23/48 ,  H01L23/495

CPC分类号： G01P15/123 ,  B81B7/0048 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0842 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06155 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13191 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13561 ,  H01L2224/1357 ,  H01L2224/13691 ,  H01L2224/14155 ,  H01L2224/14165 ,  H01L2224/14179 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/29191 ,  H01L2224/321 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81862 ,  H01L2224/83 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/0715 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A mounting structure of chip comprises a substrate having a base, a chip on the upper surface of the base, and adhesive agents which bonds the base and the first chip. The adhesive agent is applied to the upper surface of the base. The chip has a rectangular shape to have a width and a length, and is bonded at its lower surface to the base. The adhesive agents comprises the first adhesive agent, the second adhesive agent, and the third adhesive agent which are disposed on the three spots of the upper surface of the base, respectively. The three spots on the base are located on vertexes of a triangle. The first chip is bonded to the base by only the first adhesive agent, the second adhesive agent, and the third adhesive agent.

摘要翻译： 芯片的安装结构包括具有底座，底座上表面上的芯片以及粘接基座和第一芯片的粘接剂的基片。 粘合剂施加到基底的上表面。 芯片具有宽度和长度的矩形形状，并且在其下表面与基底结合。 粘合剂包括分别设置在基底的上表面的三个点上的第一粘合剂，第二粘合剂和第三粘合剂。 基座上的三个点位于三角形的顶点。 第一芯片仅通过第一粘合剂，第二粘合剂和第三粘合剂结合到基底上。

公开(公告)号：US20060208357A1

公开(公告)日：2006-09-21

申请号：US11086922

申请日：2005-03-21

申请人： Thorsten Meyer ,  Harry Hedler ,  Stephan Dobritz

发明人： Thorsten Meyer ,  Harry Hedler ,  Stephan Dobritz

IPC分类号： H01L23/48

CPC分类号： H01L24/13 ,  H01L23/3114 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13191 ,  H01L2224/13541 ,  H01L2224/13551 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/14051 ,  H01L2224/14141 ,  H01L2224/14145 ,  H01L2224/14146 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/17051 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/325 ,  H05K3/3436 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/10659 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention relates to an integrated device comprising an electronic circuit chip, a solder contact structure to provide contact to the electronic circuit chip and an elastic contact structure to provide contact to the electronic circuit chip, wherein the solder contact structure and the elastic contact structure are arranged on a contacting surface of the integrated device.

摘要翻译： 本发明涉及一种集成装置，其包括电子电路芯片，提供与电子电路芯片的接触的焊接触点结构和用于提供与电子电路芯片的接触的弹性接触结构，其中焊料接触结构和弹性接触结构 布置在集成装置的接触表面上。