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    Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components
    21.
    发明授权
    Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components 有权
    具有热隔离区域的插入器配置，用于温度敏感的光电子部件

    公开(公告)号：US08905632B2

    公开(公告)日：2014-12-09

    申请号：US13687021

    申请日：2012-11-28

    Applicant: Cisco Technology, Inc.

    Inventor： Kalpendu Shastri ,  Soham Pathak ,  Vipulkumar Patel ,  Bipin Dama ,  Kishor Desai

    IPC: H01S3/04 ,  H01S5/024 ,  G02B6/42 ,  H01S5/022 ,  H01S5/00

    CPC classification number: H01S5/02415 ,  G02B6/42 ,  G02B6/4273 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/02248 ,  H01S5/024 ,  H01S5/02469 ,  H01S5/4025

    Abstract: An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.

    Abstract translation: 形成用于光电组件的插入器（支撑衬底），以包括热隔离区域，其中可以将温度敏感器件（例如激光二极管）定位并独立于其中的温度波动 部件。 通过形成介电材料的边界通过插入件的厚度来实现热隔离，绝缘体的外围限定了热隔离区域和组件的其余部分之间的边界。 热电冷却器可与温度敏感设备结合使用，以稳定这些设备的运行。

    Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips
    24.
    发明授权
    Laser patterned adapters with waveguides and etched connectors for low cost alignment of optics to chips 有权

    公开(公告)号：US10746934B2

    公开(公告)日：2020-08-18

    申请号：US16058608

    申请日：2018-08-08

    Applicant: Cisco Technology, Inc.

    Inventor： Vipulkumar Patel ,  Matthew J. Traverso ,  Ashley J. Maker ,  Jock T. Bovington

    IPC: G02B6/30 ,  G02B6/12 ,  G02B6/10

    Abstract: By determining an alignment point for a photonic element in a substrate of a given material; applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and removing the patterned region from the photonic element via the etchant, various systems and methods may make use of laser patterning in optical components to enable alignment of optics to chips.

    Fiber to chip alignment using passive vgroove structures
    26.
    发明授权
    Fiber to chip alignment using passive vgroove structures 有权

    公开(公告)号：US10656339B2

    公开(公告)日：2020-05-19

    申请号：US16146311

    申请日：2018-09-28

    Applicant: Cisco Technology, Inc.

    Inventor： Vipulkumar Patel ,  Ashley J. Maker ,  Anthony D. Kopinetz

    IPC: G02B6/30 ,  G02B6/42 ,  G02B6/36

    Abstract: An apparatus comprises a plurality of optical fibers and a lid member having one or more surfaces with grooves formed therein. The lid member defines a first plurality of grooves that are each dimensioned to partly receive an optical fiber of the plurality of optical fibers. The apparatus further comprises a substrate comprising a plurality of waveguides arranged at a predefined depth relative to a reference surface of the substrate, and a plurality of ribs extending from the reference surface. Each rib of the plurality of ribs is dimensioned to engage with a respective groove of a second plurality of grooves of the lid member. Engaging the plurality of ribs of the substrate with the second plurality of grooves of the lid member provides an optical alignment of the plurality of optical fibers with the plurality of waveguides.

    Photonic chip with an evanescent coupling interface
    27.
    发明授权
    Photonic chip with an evanescent coupling interface 有权

    公开(公告)号：US10481326B2

    公开(公告)日：2019-11-19

    申请号：US15899255

    申请日：2018-02-19

    Applicant: Cisco Technology, Inc.

    Inventor： Vipulkumar Patel ,  Mark Webster ,  Ravi Tummidi ,  Mary Nadeau

    IPC: G02B6/12 ,  G02B6/30 ,  G02B6/42 ,  G02B6/125 ,  G02B6/34 ,  G02B6/122 ,  G02B6/124

    Abstract: Embodiments herein describe a photonic chip which includes a coupling interface for evanescently coupling the chip to a waveguide on an external substrate. In one embodiment, the photonic chip includes a tapered waveguide that aligns with a tapered waveguide on the external substrate. The respective tapers of the two waveguides are inverted such that as the width of the waveguide in the photonic chip decreases, the width of the waveguide on the external substrate increases. In one embodiment, these two waveguides form an adiabatic structure where the optical signal transfers between the waveguides with minimal or no coupling of the optical signal to other non-intended modes. Using the two waveguides, optical signals can be transmitted between the photonic chip and the external substrate.

    Germanium multi-directional detector
    30.
    发明授权
    Germanium multi-directional detector 有权

    公开(公告)号：US09978890B1

    公开(公告)日：2018-05-22

    申请号：US15440209

    申请日：2017-02-23

    Applicant: Cisco Technology, Inc.

    Inventor： Igal I. Bayn ,  Vipulkumar Patel ,  Sean P. Anderson ,  Prakash Gothoskar

    IPC: H01L31/00 ,  H01L31/0232 ,  H01L31/105 ,  H01L31/0352 ,  G02B6/125 ,  G02B6/12

    CPC classification number: G02B6/12 ,  G02B6/125 ,  G02B2006/12061 ,  H01L31/02327 ,  H01L31/028 ,  H01L31/105

    Abstract: Embodiments herein describe a photonic device that includes a germanium photodetector coupled to multiple silicon waveguides. In one embodiment, the silicon waveguides optically couple to a layer of germanium material. In one embodiment, if the germanium material forms a polygon, then a respective silicon waveguide optically couple to each of the corners of the polygon. Each of the plurality of input silicon waveguides may be arranged to transmit light in a direction under the germanium that is offset relative to both sides of the germanium forming the respective corner. In another example, the germanium material may be a circle or ellipse in which case the silicon waveguides terminate at or close to a non-straight, curved surface of the germanium material. As described below, optically coupling the silicon waveguides at a non-straight surface can reduce the distance charge carriers have to travel in the optical detector which can improve bandwidth.

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