RESIN COMPOSITION AND PROCESS FOR PRODUCING RESIN MOLDING
    21.
    发明申请
    RESIN COMPOSITION AND PROCESS FOR PRODUCING RESIN MOLDING 失效
    树脂组合物和生产树脂模塑的方法

    公开(公告)号:US20100144936A1

    公开(公告)日:2010-06-10

    申请号:US12704784

    申请日:2010-02-12

    IPC分类号: C08K5/3447

    CPC分类号: C08G63/88

    摘要: A polyester resin component having crystallization improved and including a cyclic compound shown by a below-described formula and polyester capable of having a crystal structure: In the formula, each of ring A and a ring B is a benzene ring, and the hydrogen bonded to the benzene rings be substituted with other groups. Additionally, Y is —CONH— or —NHCO— and X is a heterocyclic group or a condensed heterocyclic group including one or more NH or CO.

    摘要翻译: 具有结晶改性的聚酯树脂组分和包含下式所示的环状化合物和能够具有结晶结构的聚酯:在该式中,环A和环B各自为苯环,并且氢键键合至 苯环被其他基团取代。 另外,Y是-CONH-或-NHCO-,X是杂环基或包含一个或多个NH或CO的稠合杂环基。

    PROCESS FOR PRODUCTION OF BETAINE
    22.
    发明申请
    PROCESS FOR PRODUCTION OF BETAINE 失效
    生产BETAINE的方法

    公开(公告)号:US20090325246A1

    公开(公告)日:2009-12-31

    申请号:US12514000

    申请日:2007-11-09

    摘要: According to the present invention, by using 4-halogeno-3-hydroxybutanamide as a substrate in quaternary amination reaction with trialkylamine which is an important step in betaine (such as carnitine) preparation processes, it becomes possible to reduce the production of crotonic acid derivatives (the major by-product) greatly compared to conventional processes. Consequently, it becomes possible to prepare a betaine, such as carnitine, at a high yield.The present invention also relates to a process for preparing a betaine represented by formula (1) below, comprising a step of quaternary aminating an amide represented by formula (2) below: wherein A1, A2 and A3 individually represent a C1-C20 hydrocarbon group which may have a substituent(s); and X1 is a halogen atom.

    摘要翻译: 根据本发明,通过在作为甜菜碱(例如肉碱)制备方法中的重要步骤的三烷基胺的季胺化反应中使用4-卤代-3-羟基丁酰胺作为底物,可以减少巴豆酸衍生物的生产 (主要副产品)与常规工艺相比大大增加。 因此,可以以高收率制备甜菜碱,如肉毒碱。 本发明还涉及由下式(1)表示的甜菜碱的制备方法,该方法包括下述式(2)表示的酰胺季铵化的步骤:其中A1,A2和A3各自表示C1-C20烃基 其可以具有取代基; X1是卤原子。

    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20090317932A1

    公开(公告)日:2009-12-24

    申请号:US12548907

    申请日:2009-08-27

    IPC分类号: H01L21/50

    摘要: A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided. The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer 4 is 10 μm or less. Also, the method for manufacturing the solid-state imaging device at least includes the steps of: forming a semiconductor region of a photo sensor portion in a silicon layer of a layered substrate in which a silicon substrate, an intermediate layer and a silicon layer are laminated; bonding a first supporting substrate onto the silicon layer; removing the silicon substrate and the intermediate layer; forming thereafter a wiring portion above the silicon layer; bonding a second supporting substrate onto the wiring portion, and removing the first supporting substrate to make the silicon layer exposed.

    SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20090315134A1

    公开(公告)日:2009-12-24

    申请号:US12548931

    申请日:2009-08-27

    IPC分类号: H01L33/00

    摘要: A solid-state imaging device having a high sensitivity and a structure in which a miniaturized pixel is obtained, and a method for manufacturing the solid-state imaging device in which an interface is stable, a spectroscopic characteristic is excellent and which can be manufactured with a high yield ratio are provided. The solid-state imaging device includes at least a silicon layer formed with a photo sensor portion and a wiring layer formed on the front-surface side of the silicon layer, and in which light L is made to enter from the rear-surface side opposite to the front-surface side of the silicon layer and the thickness of the silicon layer 4 is 10 μm or less. Also, the method for manufacturing the solid-state imaging device at least includes the steps of: forming a semiconductor region of a photo sensor portion in a silicon layer of a layered substrate in which a silicon substrate, an intermediate layer and a silicon layer are laminated; bonding a first supporting substrate onto the silicon layer; removing the silicon substrate and the intermediate layer; forming thereafter a wiring portion above the silicon layer; bonding a second supporting substrate onto the wiring portion, and removing the first supporting substrate to make the silicon layer exposed.

    SYSTEMS AND METHODS FOR MANIPULATING LIQUID FILMS ON SEMICONDUCTOR SUBSTRATES
    27.
    发明申请
    SYSTEMS AND METHODS FOR MANIPULATING LIQUID FILMS ON SEMICONDUCTOR SUBSTRATES 有权
    用于在半导体衬底上操作液膜的系统和方法

    公开(公告)号:US20090068848A1

    公开(公告)日:2009-03-12

    申请号:US12272500

    申请日:2008-11-17

    IPC分类号: H01L21/30

    CPC分类号: H01L21/6715

    摘要: A semiconductor substrate undergoing processing to fabricate integrated circuit devices thereon is spun about a rotational axis while introducing liquid onto a surface of the substrate. An annular-shaped sheet of liquid is formed on the surface, the sheet of liquid having an inner diameter defining a liquid-free void. The size of a diameter of the void is reduced by manipulation of the annular-shaped sheet of liquid. The void may then be enlarged until the surface is substantially dry. The annular-shaped sheet of liquid may be formed and altered by selectively moving a contact area on the surface of the substrate on which the liquid is introduced. Systems for processing a substrate and configured to deposit and manipulate a sheet of liquid thereon are also disclosed.

    摘要翻译: 在其上制造集成电路器件的处理的半导体衬底围绕旋转轴旋转,同时将液体引入到衬底的表面上。 在表面上形成环状的液体片,该液体片具有限定无液体空隙的内径。 通过操作环形片状液体来减小空隙直径的大小。 然后可以扩大空隙,直到表面基本上干燥。 可以通过选择性地移动在其上引入液体的基板的表面上的接触区域来形成和改变环形片状液体。 还公开了用于处理基板并且被配置为在其上沉积和操纵一片液体的系统。

    RESIN COMPOSITION
    29.
    发明申请
    RESIN COMPOSITION 失效
    树脂组合物

    公开(公告)号:US20090005475A1

    公开(公告)日:2009-01-01

    申请号:US11830276

    申请日:2007-07-30

    IPC分类号: C08K5/3417

    摘要: Moldings made with a polyester resin which comprises a cyclic compound represented by a following formula A1-B-A2 (In the formula, A1 and A2 are the same or different and show groups represented by a below-described formula, P shows a benzene ring which may be replaced by a material, and B shows a bivalent hydrocarbon group which may be replaced by a material) and polyester capable of having a crystal structure.

    摘要翻译: 使用包含由下式表示的环状化合物的聚酯树脂制成的模制品:在线式描述=“In-line formula”end =“lead”→> A1-B-A2 <βin-line-formula (式中,A 1和A 2相同或不同,表示由下述式表示的基团,P表示苯环,可以被 材料,B表示可被材料代替的二价烃基)和能够具有晶体结构的聚酯。