公开(公告)号：US07125794B2

公开(公告)日：2006-10-24

申请号：US10940820

申请日：2004-09-15

申请人： Seiichi Kondo ,  Kaori Misawa ,  Shunichi Tokitoh ,  Takashi Nasuno

发明人： Seiichi Kondo ,  Kaori Misawa ,  Shunichi Tokitoh ,  Takashi Nasuno

IPC分类号： H01L21/4763 ,  H01L21/312 ,  H01L21/469

CPC分类号： H01L21/76826 ,  H01L21/02126 ,  H01L21/02137 ,  H01L21/02164 ,  H01L21/02167 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/02282 ,  H01L21/02337 ,  H01L21/3124 ,  H01L21/3148 ,  H01L21/31633 ,  H01L21/318 ,  H01L21/76807 ,  H01L21/76828 ,  H01L21/76829 ,  H01L21/76835

摘要： A first CVD dielectric layer is deposited on a surface of a semiconductor substrate. Next, low-k layers are deposited in at least two different steps to form one of a via-layer dielectric film and a wiring-layer dielectric film on the first CVD dielectric layer. Immediately after the depositions, thermal treatment is performed. A second CVD dielectric layer is deposited on the low-k layers. A groove is formed in the second CVD dielectric layer and the low-k layers. A metal layer is deposited on that structure, filling the groove. The metal layer is removed from the second CVD dielectric layer by chemical mechanical polishing.

摘要翻译： 第一CVD绝缘层沉积在半导体衬底的表面上。 接下来，在至少两个不同的步骤中沉积低k层，以在第一CVD电介质层上形成通孔层电介质膜和布线层电介质膜之一。 沉积后立即进行热处理。 在低k层上沉积第二CVD介电层。 在第二CVD介质层和低k层中形成凹槽。 在该结构上沉积金属层，填充凹槽。 金属层通过化学机械抛光从第二CVD介电层去除。

公开(公告)号：US20050170760A1

公开(公告)日：2005-08-04

申请号：US11097303

申请日：2005-04-04

申请人： Yoshio Homma ,  Seiichi Kondo ,  Noriyuki Sakuma ,  Youhei Yamada ,  Takeshi Kimura ,  Hiroki Nezu

发明人： Yoshio Homma ,  Seiichi Kondo ,  Noriyuki Sakuma ,  Youhei Yamada ,  Takeshi Kimura ,  Hiroki Nezu

IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  B24B37/32 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B37/30

摘要： In a polishing apparatus having a cover body with fluid pressing mechanism, during polishing, vibration and migration of sticking portion between a retainer and a membrane generated in downstream of rotation of a polishing platen is prevented by reducing sticking force between the retainer and the membrane to less than force needed to wafer polishing with rotation of the cover body.

公开(公告)号：US06531400B2

公开(公告)日：2003-03-11

申请号：US10222848

申请日：2002-08-19

申请人： Naofumi Ohashi ,  Junji Noguchi ,  Toshinori Imai ,  Hizuru Yamaguchi ,  Nobuo Owada ,  Kenji Hinode ,  Yoshio Homma ,  Seiichi Kondo

发明人： Naofumi Ohashi ,  Junji Noguchi ,  Toshinori Imai ,  Hizuru Yamaguchi ,  Nobuo Owada ,  Kenji Hinode ,  Yoshio Homma ,  Seiichi Kondo

IPC分类号： H01L214263

CPC分类号： H01L21/0209 ,  G09G5/399 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/76838 ,  H01L21/7684 ,  Y10S438/906

摘要： In order to provide an anticorrosive technique for metal wirings formed by a chemical mechanical polishing (CMP) method, a process for manufacturing a semiconductor integrated circuit device according to the invention comprises the steps of: forming a metal layer of Cu (or a Cu alloy containing Cu as a main component) over the major face of a wafer and then planarizing the metal layer by a chemical mechanical polishing (CMP) method to form metal wirings; anticorroding the planarized major face of the wafer to form a hydrophobic protective film over the surfaces of the metal wirings; immersing the anticorroded major face of the wafer or keeping the same in a wet state so that it may not become dry; and post-cleaning the major face, kept in the wet state, of the wafer.

公开(公告)号：US5235449A

公开(公告)日：1993-08-10

申请号：US662642

申请日：1991-03-01

申请人： Shuji Imazeki ,  Yasushi Tomioka ,  Naoki Tanaka ,  Tatsuo Kanetake ,  Seiichi Kondo ,  Yoshio Taniguchi ,  Katsumi Kondo ,  Hideaki Kawakami

发明人： Shuji Imazeki ,  Yasushi Tomioka ,  Naoki Tanaka ,  Tatsuo Kanetake ,  Seiichi Kondo ,  Yoshio Taniguchi ,  Katsumi Kondo ,  Hideaki Kawakami

IPC分类号： B29D11/00 ,  G02B1/08 ,  G02B5/30 ,  G02F1/1335 ,  G02F1/1337

CPC分类号： G02F1/133711 ,  B29D11/00634 ,  G02B1/08 ,  G02B5/3033 ,  G02F1/133528

摘要： A method for producing a polarizer patterned with a plural number of portions having a polarizing ability or direction of polarization comprising the first step of producing a surface oriented in a pre-determined direction on a substrate, the second step of producing a polymerizable molecular layer which comprises polymerizable molecules on the above surface, the third step of polymerizing the molecules in said polymerizable molecular layer into a desired pattern and the fourth step of removing the unpolymerized portion of said polymerizable molecular layer. For example, the following procedure is repeated on one surface of a substrate to be given a polarizing ability: (1) An organic thin film uniformly oriented in a particular direction is produced by the Langmuir-Blodgett method, (2) a polymerizable molecular layer is produced on the above thin film, (3) the molecules in the polymerizable molecular layer is polymerized into a desired pattern and (4) the portion left unpolymerized of the polymerizable molecular layer is removed. By this treatment, a polarizer having as many orientation directions as the number of repetitions is obtained. The orientational order can also be given by rubbing in place of the Langmuir-Blodgett method.

摘要翻译： 一种用于制造具有多个具有偏振能力或偏振方向的多个部分的偏振器的制造方法，所述方法包括：在基板上产生沿预定方向取向的表面的第一步骤;制备可聚合分子层的第二步骤， 包括在上述表面上的可聚合分子，将所述可聚合分子层中的分子聚合成所需图案的第三步骤和除去所述可聚合分子层的未聚合部分的第四步骤。 例如，在基板的一个表面上重复以下步骤以赋予极化能力：（1）通过Langmuir-Blodgett方法产生沿特定方向均匀取向的有机薄膜，（2）可聚合分子层 在上述薄膜上制造，（3）可聚合分子层中的分子被聚合成所需的图案，（4）除去聚合性分子层未聚合的部分。 通过该处理，获得具有与重复次数相同的取向方向的偏振片。 也可以通过摩擦代替Langmuir-Blodgett方法给出取向顺序。

公开(公告)号：US10291620B2

公开(公告)日：2019-05-14

申请号：US15352758

申请日：2016-11-16

申请人： Hiroki Ohzaki ,  Yasuharu Fukuda ,  Seiichi Kondo ,  Kohsuke Namihira ,  Hikaru Kominami

发明人： Hiroki Ohzaki ,  Yasuharu Fukuda ,  Seiichi Kondo ,  Kohsuke Namihira ,  Hikaru Kominami

IPC分类号： H04L29/06 ,  G06F21/60 ,  H04N1/00 ,  H04N1/44 ,  G06F16/9535

摘要： An information processing apparatus issuing qualification information that is used by a terminal apparatus in using a service includes an authenticating unit configured to receive an authentication request, which includes organization information, domain information, and account information in an on-premises environment, from the terminal apparatus, and search for a user belonging to an organization identified by the organization information from user administration information based on the account information in the on-premises environment in response to a correspondence between the organization information and the domain information inside organization administration information, which causes the organization information and the domain information to correspond; and a qualification information issuing unit configured to issue the qualification information to the searched user.

公开(公告)号：US07563716B2

公开(公告)日：2009-07-21

申请号：US11693383

申请日：2007-03-29

申请人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

发明人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

IPC分类号： H01L21/302

CPC分类号： C23F3/06 ,  B24B37/04 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/7684

摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.

摘要翻译： 抑制了划痕，剥离，凹陷和侵蚀的抛光技术，不需要复杂的清洁工艺和浆料供应/加工设备，并且消耗品如浆料和抛光垫的成本降低。 在包含凹槽的绝缘膜上形成的金属膜用含有氧化剂和使氧化物溶于水但不含抛光磨料的物质的抛光溶液抛光。

公开(公告)号：US20070167015A1

公开(公告)日：2007-07-19

申请号：US11693383

申请日：2007-03-29

申请人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

发明人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

IPC分类号： H01L21/302 ,  C03C15/00 ,  C23F1/00 ,  H01L21/461

CPC分类号： C23F3/06 ,  B24B37/04 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/7684

摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.

摘要翻译： 抑制了划痕，剥离，凹陷和侵蚀的抛光技术，不需要复杂的清洁工艺和浆料供应/加工设备，并且消耗品如浆料和抛光垫的成本降低。 在包含凹槽的绝缘膜上形成的金属膜用含有氧化剂和使氧化物溶于水但不含抛光磨料的物质的抛光溶液抛光。

公开(公告)号：US20070029285A1

公开(公告)日：2007-02-08

申请号：US11581375

申请日：2006-10-17

申请人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

发明人： Seiichi Kondo ,  Yoshio Homma ,  Noriyuki Sakuma ,  Kenichi Takeda ,  Kenji Hinode

IPC分类号： C03C15/00 ,  H01L21/461 ,  H01L21/302 ,  B44C1/22

CPC分类号： C23F3/06 ,  B24B37/04 ,  C09G1/02 ,  C09K3/1463 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/7684

摘要： A polishing technique wherein scratches, peeling, dishing and erosion are suppressed, a complex cleaning process and slurry supply/processing equipment are not required, and the cost of consumable items such as slurries and polishing pads is reduced. A metal film formed on an insulating film comprising a groove is polished with a polishing solution containing an oxidizer and a substance which renders oxides water-soluble, but not containing a polishing abrasive.

公开(公告)号：US06565422B1

公开(公告)日：2003-05-20

申请号：US09507787

申请日：2000-02-22

申请人： Yoshio Homma ,  Hiroki Nezu ,  Takeshi Kimura ,  Seiichi Kondo ,  Noriyuki Sakuma

发明人： Yoshio Homma ,  Hiroki Nezu ,  Takeshi Kimura ,  Seiichi Kondo ,  Noriyuki Sakuma

IPC分类号： B24B100

CPC分类号： B24B37/04 ,  B24B57/02

摘要： In order to resolve problems of an increase in cost of transportation and vessels for polishing solutions to polish metal films, and of aging change of the polishing solutions, apparatus for preparing and mixing solutions of polishing materials without including abrasive are installed at a site the same as a site of polishing apparatus, an abrasive free slurry is supplied to the polishing apparatus and a metal film on a wiring substrate is polished to thereby form embedded metal wirings by which the cost of polishing metal can significantly be reduced and stability of the polishing solution is promoted.

摘要翻译： 为了解决运输成本增加和抛光溶液抛光金属膜的容器以及抛光液的老化变化的问题，在不含磨料的情况下安装抛光材料的溶液的制备和混合装置安装在相同的位置 作为抛光装置的位置，向抛光装置供给无磨料的浆料，对配线基板上的金属膜进行研磨，形成嵌入金属配线，通过该金属配线可以显着降低抛光金属的成本，并且研磨液的稳定性 被提拔。

公开(公告)号：US06561883B1

公开(公告)日：2003-05-13

申请号：US09548289

申请日：2000-04-12

申请人： Seiichi Kondo ,  Noriyuki Sakuma ,  Yoshio Homma

发明人： Seiichi Kondo ,  Noriyuki Sakuma ,  Yoshio Homma

IPC分类号： B24B100

CPC分类号： H01L21/3212 ,  C09G1/04 ,  H01L21/02074

摘要： A polishing method comprising mechanically polishing the surface of a metal film by the use of a polishing solution comprising an oxidizer, a substance which renders an oxide water-soluble, a thickener and water, is suitable for polishing the metal film at a high removal rate with suppressed scratching, delamination, dishing and erosion, and can be applied to production of semiconductors, etc.

摘要翻译： 抛光方法包括通过使用包含氧化剂，使氧化物水溶性的物质，增稠剂和水的抛光溶液机械抛光金属膜的表面，适于以高的去除速率抛光金属膜 具有抑制划痕，分层，凹陷和侵蚀，可应用于半导体等的生产。