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    Three capacitor stack and associated methods
    21.
    发明授权
    Three capacitor stack and associated methods 有权

    公开(公告)号：US09960224B2

    公开(公告)日：2018-05-01

    申请号：US15282504

    申请日：2016-09-30

    Applicant: Intel Corporation

    Inventor： Eng Huat Goh ,  Jiun Hann Sir ,  Han Kung Chua ,  Min Suet Lim ,  Hoay Tien Teoh

    IPC: H01L49/02

    CPC classification number: H01L28/75

    Abstract: A three capacitor stack and associated methods are shown. An exemplary capacitor device may include a first capacitor stack that includes a first plurality of layers of reference electrodes interleaved with first capacitor electrodes, a second capacitor stack on the first capacitor stack that includes a second plurality of layers of reference electrodes interleaved with second capacitor electrodes, and a third capacitor stack on the second capacitor stack that includes a reference electrode and a third capacitor electrode. A respective layer of dielectric material is formed between the reference electrodes and the first capacitor electrodes, the second capacitor electrodes, and the third capacitor electrode.

    MULTI-ORIENTATION DISPLAY DEVICE
    22.
    发明申请
    MULTI-ORIENTATION DISPLAY DEVICE 审中-公开
    多方位显示设备

    公开(公告)号：US20170075388A1

    公开(公告)日：2017-03-16

    申请号：US14852592

    申请日：2015-09-13

    Applicant: Intel Corporation

    Inventor： Chee Chun Yee ,  David W. Browning ,  Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Min Suet Lim ,  Howe Yin Loo ,  Poh Tat Oh

    IPC: G06F1/16 ,  G06F3/041

    CPC classification number: G06F1/1652 ,  G06F1/1626 ,  G06F1/1641 ,  G06F1/1643 ,  G06F1/1675 ,  G06F3/041 ,  G06F2203/04102

    Abstract: A computing device includes a flexible display screen, a housing to house at least one processor device and at least one memory element, and a first wing to support a side portion of the display screen. The front face of the housing includes a center portion of the display screen. The first wing is connected to the housing by a hinge, the first wing configured to swivel about an axis defined by the hinge. The hinge is configured to lock the first wing in at least two wing positions, a first of the wing positions supports the side portion of the display screen in a first orientation, a second of the wing positions supports the side portion of the display screen in a second orientation, and the side portion of the display screen is active in the first orientation and hidden in the second orientation.

    Abstract translation: 计算设备包括柔性显示屏，用于容纳至少一个处理器设备的壳体和至少一个存储器元件，以及支撑显示屏幕的侧面部分的第一翼片。 壳体的前表面包括显示屏的中心部分。 第一翼通过铰链连接到壳体，第一翼构造成围绕由铰链限定的轴线旋转。 所述铰链被构造成将所述第一翼片锁定在至少两个翼位置中，所述机翼位置中的第一翼位置以第一方向支撑所述显示屏的侧部，所述翼位置中的第二翼支撑所述显示屏幕的侧部 第二取向，并且显示屏幕的侧部在第一取向中是有效的，并且在第二取向中被隐藏。

    FOLDABLE THERMAL GROUND PLANES FOR ELECTRONIC DEVICES
    23.
    发明申请
    FOLDABLE THERMAL GROUND PLANES FOR ELECTRONIC DEVICES 有权

    公开(公告)号：US20250113460A1

    公开(公告)日：2025-04-03

    申请号：US18979203

    申请日：2024-12-12

    Applicant: Intel Corporation

    Inventor： Jeff Ku ,  Smit Kapila ,  Min Suet Lim ,  Surya Pratap Mishra ,  Kari Mansukoski ,  Shantanu D. Kulkarni

    IPC: H05K7/20 ,  G06F1/20

    Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for foldable thermal ground planes for electronic devices. An example an apparatus to cool an electronic device includes a first plate; a second plate; a plurality of first pillars extending between the first plate and the second plate, the plurality of first pillars having a first shape; a plurality of second pillars extending between the first plate and the second plate, the plurality of second pillars having a second shape, the second shape different than the first shape; and a hinge separating the apparatus into a first section and a second section, the plurality of second pillars in the hinge.

    Electronic device package on package (POP)
    28.
    发明授权
    Electronic device package on package (POP) 有权

    公开(公告)号：US11587844B2

    公开(公告)日：2023-02-21

    申请号：US16306884

    申请日：2016-07-02

    Applicant: Intel Corporation

    Inventor： Eng Huat Goh ,  Jiun Hann Sir ,  Min Suet Lim ,  Xi Guo

    IPC: H01L23/367 ,  H01L21/48 ,  H01L23/498 ,  H01L25/065

    Abstract: Electronic device package on package (POP) technology is disclosed. A POP can comprise a first electronic device package including a heat source. The POP can also comprise a second electronic device package disposed on the first electronic device package. The second electronic device package can include a substrate having a heat transfer portion proximate the heat source that facilitates heat transfer from the heat source through a thickness of the substrate. The substrate can also have an electronic component portion at least partially about the heat transfer portion that facilitates electrical communication. In addition, the POP can comprise an electronic component operably coupled to the electronic component portion.

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