ALL IN ONE MOBILE COMPUTING DEVICE
    22.
    发明申请

    公开(公告)号:US20200326955A1

    公开(公告)日:2020-10-15

    申请号:US16091201

    申请日:2016-04-26

    Abstract: All in one mobile computing devices and methods performed by the devices. The all in one mobile computing device includes a processor, memory, and software instructions configured to be executed on the processor to enable the mobile computing device to perform various operations. The all in one device may include various wired and wireless interfaces that enable it to communicate with a wide-range of devices, including smartphones, tablets, laptops, personal computers, smart TVs, and others. The all in one device is capable of being remotely accessed when linked in communication with a second device, and is enabled to aggregate data from various user devices and cloud-based services to create unified data resources. Data that is accessed by the device may be synched with a cloud-based storage service to enable a user to access data from across a range of devices via the all in one device. The all in one device has a form factor that is approximately the size of a credit card, yet is capable of running a full-fledged desktop operating system.

    INTEGRATED ANDROID AND WINDOWS DEVICE
    28.
    发明申请

    公开(公告)号:US20190121682A1

    公开(公告)日:2019-04-25

    申请号:US16091206

    申请日:2016-04-26

    Abstract: Techniques for implementing assess to Android applications and native Window application on Android devices and systems. A processor board includes a processor that is configured to run a full version of a Windows operating system and Windows applications. The processor board is configured to be communicatively coupled to the processor board in an Android device, such as a Smartphone or tablet. Upon operations and when the processor board is communicatively coupled to the Android device, a user of the Android device is enabled to selectively run Android applications and Windows applications, with the Windows applications being executed natively on the processor board. The processor board may be implemented in a computing card that is approximately the size of a credit card or smaller, which in turn may be coupled to the Android device via a backpack or similar means. The processor board may also be disposed within the same housing as the Android device.

    Technologies for optical communication in rack clusters

    公开(公告)号:US10070207B2

    公开(公告)日:2018-09-04

    申请号:US15396035

    申请日:2016-12-30

    Abstract: Technologies for optical communication in a rack cluster in a data center are disclosed. In the illustrative embodiment, a network switch is connected to each of 1,024 sleds by an optical cable that enables communication at a rate of 200 gigabits per second. The optical cable has low loss, allowing for long cable lengths, which in turn allows for connecting to a large number of sleds. The optical cable also has a very high intrinsic bandwidth limit, allowing for the bandwidth to be upgraded without upgrading the optical infrastructure.

Patent Agency Ranking