公开(公告)号：US12066833B2

公开(公告)日：2024-08-20

申请号：US17322056

申请日：2021-05-17

Applicant: Intel Corporation

Inventor： Rajashree Baskaran ,  Maruti Gupta Hyde ,  Min Suet Lim ,  Van Le ,  Hebatallah Saadeldeen

IPC: G05D1/00 ,  B60W30/00 ,  G08G1/01 ,  H04W4/029 ,  H04W4/38 ,  H04W4/44

CPC classification number: G05D1/0276 ,  B60W30/00 ,  G05D1/0231 ,  G08G1/0116 ,  H04W4/029 ,  H04W4/38 ,  H04W4/44

Abstract: The present disclosure may be directed to a computer-assisted or autonomous driving (CA/AD) vehicle that receives a plurality of indications of a condition of one or more features of a plurality of locations of a roadway, respectively, encoded in a plurality of navigation signals broadcast by a plurality of transmitters as the CA/AD vehicle drives past the locations enroute to a destination. The CA/AD vehicle may then determine, based in part on the received indications, driving adjustments to be made and send indications of the driving adjustments to a driving control unit of the CA/AD vehicle.

公开(公告)号：US20230029545A1

公开(公告)日：2023-02-02

申请号：US17860741

申请日：2022-07-08

Applicant: Intel Corporation

Inventor： Johanna Swan ,  Shahrnaz Azizi ,  Rajashree Baskaran ,  Melissa Ortiz ,  Fatema Adenwala ,  Mengjie Yu

IPC: G05D1/00 ,  A61B5/16 ,  A61B5/18 ,  A61B5/00 ,  A63F13/44 ,  A63F13/803

Abstract: Technologies for providing a cognitive capacity test for autonomous driving include a compute device. The compute device includes circuitry that is configured to display content to a user, prompt a message to the user to turn user’s attention to another activity that needs situational awareness, receive a user response, and analyze the user response to determine an accuracy of the user response and a response time, wherein the accuracy and response time are indicative of a cognitive capacity of the user to assume control of an autonomous vehicle when the autonomous vehicle encounters a situation that the vehicle is unable to navigate.

公开(公告)号：US11009890B2

公开(公告)日：2021-05-18

申请号：US16143355

申请日：2018-09-26

Applicant: Intel Corporation

Inventor： Rajashree Baskaran ,  Maruti Gupta Hyde ,  Min Suet Lim ,  Van Le ,  Hebatallah Saadeldeen

IPC: G05D1/02 ,  H04W4/44 ,  H04W4/029 ,  H04W4/38 ,  B60W30/00 ,  G08G1/01

Abstract: The present disclosure may be directed to a computer-assisted or autonomous driving (CA/AD) vehicle that receives a plurality of indications of a condition of one or more features of a plurality of locations of a roadway, respectively, encoded in a plurality of navigation signals broadcast by a plurality of transmitters as the CA/AD vehicle drives past the locations enroute to a destination. The CA/AD vehicle may then determine, based in part on the received indications, driving adjustments to be made and send indications of the driving adjustments to a driving control unit of the CA/AD vehicle.

公开(公告)号：US20210058701A1

公开(公告)日：2021-02-25

申请号：US17085884

申请日：2020-10-30

Applicant: Intel Corporation

Inventor： Beverly Klemme ,  Rajashree Baskaran ,  Sergio E. Sian

IPC: H04R1/46 ,  G10L21/0232 ,  H04R29/00 ,  G10L25/51 ,  A61F11/04 ,  G10L25/78 ,  A61B5/11 ,  H04R1/02 ,  A61B5/00 ,  G10L21/0208

Abstract: Apparatus and methods for bone conduction detection are disclosed herein. An example apparatus includes a first sensor to output a first vibration signal associated with a first bone structure of a user, a second sensor to output a second vibration signal associated with a second bone structure of the user, memory, and at least one processor to execute instructions to determine a sound associated with at least one of the first vibration signal or the second vibration signal originated external to the user; determine a direction from which the sound originated relative to the user; and generate a signal to cause an output device to present an alert to the user, the alert indicative of the direction of the sound.

公开(公告)号：US20190130743A1

公开(公告)日：2019-05-02

申请号：US16233922

申请日：2018-12-27

Applicant: Intel Corporation

Inventor： Nadine Dabby ,  Johanna Swan ,  Annie Foong ,  Karla Saur ,  Hassnaa Moustafa ,  Rita H. Wouhaybi ,  Linda Hurd ,  Rajashree Baskaran

IPC: G08G1/0968 ,  H04W4/44 ,  G01C21/34 ,  G01C21/28 ,  G08G1/0962 ,  G08G1/0965

Abstract: Techniques are disclosed herein for providing guidance for autonomous vehicles in areas of low network connectivity, such as rural areas. According to an embodiment, a guidance system receives a request to exchange data with a vehicle within a specified radius thereof over a wireless connection (e.g., a radio frequency protocol-based connection). The data is stored by the guidance system and is indicative of navigation information within the specified radius. The guidance system transmits the stored data to the vehicle. The guidance system also receives, from the vehicle, data indicative of navigation information for a path previously passed by the vehicle.

公开(公告)号：US20190129418A1

公开(公告)日：2019-05-02

申请号：US16234032

申请日：2018-12-27

Applicant: Intel Corporation

Inventor： Johanna Swan ,  Shahrnaz Azizi ,  Rajashree Baskaran ,  Melissa Ortiz ,  Fatema Adenwala ,  Mengjie Yu

IPC: G05D1/00 ,  A61B5/16 ,  A61B5/18 ,  A61B5/00

Abstract: Technologies for providing a cognitive capacity test for autonomous driving include a compute device. The compute device includes circuitry that is configured to display content to a user, prompt a message to the user to turn user's attention to another activity that needs situational awareness, receive a user response, and analyze the user response to determine an accuracy of the user response and a response time, wherein the accuracy and response time are indicative of a cognitive capacity of the user to assume control of an autonomous vehicle when the autonomous vehicle encounters a situation that the vehicle is unable to navigate.

公开(公告)号：US20190045298A1

公开(公告)日：2019-02-07

申请号：US15870043

申请日：2018-01-12

Applicant: Intel Corporation

Inventor： Beverly Klemme ,  Rajashree Baskaran ,  Sergio E. Sian

IPC: H04R1/46 ,  A61F11/04 ,  G10L25/78 ,  G10L25/51 ,  G10L21/0232 ,  H04R29/00

CPC classification number: H04R1/46 ,  A61B5/11 ,  A61B5/1123 ,  A61B5/12 ,  A61B5/4504 ,  A61B5/4803 ,  A61B5/486 ,  A61B5/6803 ,  A61B5/721 ,  A61F11/04 ,  G10L21/0208 ,  G10L21/0232 ,  G10L25/51 ,  G10L25/78 ,  H04R1/028 ,  H04R29/001 ,  H04R2460/13

Abstract: Apparatus and methods for bone conduction detection are disclosed herein. An example wearable device includes a first sensor positioned to generate first vibration information from a bone structure of a user and a second sensor positioned to generate second vibration information from the bone structure of the user. The first vibration information and the second vibration information include sound data and motion data. The motion data is indicative of a motion by the user. The example wearable device includes a signal modifier to generate a modified signal including the sound data based on the first vibration information and the second vibration information. The example wearable device includes a communicator to transmit the modified signal for output via a speaker.

公开(公告)号：US09818751B2

公开(公告)日：2017-11-14

申请号：US15490754

申请日：2017-04-18

Applicant: Intel Corporation

Inventor： Rajashree Baskaran ,  Kimin Jun ,  Patrick Morrow

IPC: H01L27/108 ,  H01L49/02

CPC classification number: H01L27/10832 ,  H01L21/84 ,  H01L27/0629 ,  H01L27/0688 ,  H01L27/10861 ,  H01L27/10867 ,  H01L27/1087 ,  H01L28/20 ,  H01L28/87 ,  H01L28/91 ,  H01L29/945

Abstract: Methods of forming passive elements under a device layer are described. Those methods and structures may include forming at least one passive structure, such as a capacitor and a resistor structure, in a substrate, wherein the passive structures are vertically disposed within the substrate. An insulator layer is formed on a top surface of the passive structure, a device layer is formed on the insulator layer, and a contact is formed to couple a device disposed in the device layer to the at least one passive structure.

公开(公告)号：US09294035B2

公开(公告)日：2016-03-22

申请号：US13994714

申请日：2013-03-28

Applicant: Intel Corporation

Inventor： Sasikanth Manipatruni ,  Raseong Kim ,  Rajashree Baskaran ,  Rajeev K. Dokania ,  Ian A. Young

IPC: H03B5/12 ,  H03B5/30 ,  H01L29/66 ,  H01L29/78

CPC classification number: H03B5/30 ,  H01L29/66795 ,  H01L29/7831 ,  H01L2924/13067 ,  H01L2924/13084

Abstract: An embodiment includes an oscillator comprising an amplifier formed on a substrate; a multiple gate resonant channel array, formed on the substrate, including: (a) transistors including fins, each of the fins having a channel between source and drain nodes, coupled to common source and drain contacts; and (b) common first and second tri-gates coupled to each of the fins and located between the source and drain contacts; wherein the fins mechanically resonate at a first frequency when one of the first and second tri-gates is periodically activated to produce periodic downward forces on the fins. Other embodiments include a non planar transistor with a channel between the source and drain nodes and a tri-gate on the fin; wherein the fin mechanically resonates when the first tri-gate is periodically activated to produce periodic downward forces on the fin. Other embodiments are described herein.

Abstract translation: 实施例包括：振荡器，包括形成在基板上的放大器; 形成在所述衬底上的多栅极共振沟道阵列包括：（a）包括鳍片的晶体管，每个鳍片在源极和漏极节点之间具有耦合到共源极和漏极触点的沟道; 和（b）共同的第一和第二三栅极，其耦合到每个散热片并且位于源极和漏极接触之间; 其中当第一和第二三门中的一个被周期性地激活以在翅片上产生周期性向下的力时，翅片以第一频率机械共振。 其他实施例包括在源极和漏极节点之间具有沟道的非平面晶体管和鳍上的三栅极; 其中当所述第一三栅极被周期性地激活以在所述散热片上产生周期性向下的力时，所述翅片机械谐振。 本文描述了其它实施例。

公开(公告)号：US09061890B2

公开(公告)日：2015-06-23

申请号：US13798600

申请日：2013-03-13

Applicant: Intel Corporation

Inventor： Rajashree Baskaran

IPC: H01L29/40 ,  H01L21/00 ,  H01L29/84 ,  B81C1/00 ,  B81B7/02 ,  H01L23/31

CPC classification number: B81C1/00238 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2207/012 ,  B81C1/00015 ,  B81C2203/0118 ,  B81C2203/0136 ,  B81C2203/035 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L23/315 ,  H01L2224/16 ,  H01L2924/00 ,  H01L2924/0002

Abstract: Methods of forming integrated MEMS structures are described. Those methods and structures may include forming at least one MEMS structure on a first substrate, forming a first bonding layer on a top surface of the first substrate, and then coupling the first bonding layer disposed on the first substrate to a second substrate, wherein the second substrate comprises a device layer. The bonding may comprise a layer transfer process, wherein an integrated MEMS device is formed.

Abstract translation: 描述了形成集成MEMS结构的方法。 这些方法和结构可以包括在第一衬底上形成至少一个MEMS结构，在第一衬底的顶表面上形成第一结合层，然后将设置在第一衬底上的第一结合层耦合到第二衬底，其中 第二衬底包括器件层。 接合可以包括层转移工艺，其中形成集成的MEMS器件。