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公开(公告)号：US11805603B2
公开(公告)日：2023-10-31
申请号：US16450147
申请日：2019-06-24
Applicant: International Business Machines Corporation
Inventor： Mark K. Hoffmeyer , Prabjit Singh
CPC classification number: H05K3/3485 , H05K3/245 , H05K2203/043
Abstract: Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.
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公开(公告)号：US10978313B2
公开(公告)日：2021-04-13
申请号：US15899661
申请日：2018-02-20
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Phillip D. Isaacs , Christopher M. Marroquin , Daren Simmons , Frank L. Pompeo , Jason R. Eagle , Mark K. Hoffmeyer , Michael J. Ellsworth, Jr. , Prabjit Singh , Steve Ostrander
IPC: H01L21/48 , H01L23/367 , H01L23/40 , H05K7/20 , B21D53/02 , H01L23/473
Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.
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公开(公告)号：US10265812B2
公开(公告)日：2019-04-23
申请号：US14824492
申请日：2015-08-12
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Dylan J. Boday , Levi A. Campbell , Milnes P. David , Dustin W. Demetriou , Michael J. Ellsworth, Jr. , Roger R. Schmidt , Robert E. Simons , Prabjit Singh , Jason T. Wertz
Abstract: Liquid-cooled heat sink assemblies are provided which include: a heat transfer element including a heat transfer base with opposite first and second sides and a plurality of thermally conductive fins extending from the first side, and with the second side of the heat transfer base to couple to a component(s) to be cooled. The heat sink assembly further includes a coolant-carrying structure attached to the heat transfer element. The coolant-carrying structure includes a coolant-carrying base, and a coolant-carrying compartment through which liquid coolant flows. The coolant-carrying base includes a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins to extend therethrough. The plurality of thermally conductive fins extend into the coolant-carrying compartment through which the liquid coolant flows. In one or more embodiments, the heat transfer element is a metal structure and the coolant-carrying structure is a plastic structure.
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公开(公告)号：US10241021B2
公开(公告)日：2019-03-26
申请号：US14805502
申请日：2015-07-22
Applicant: International Business Machines Corporation
Inventor： Levi A. Campbell , Prabjit Singh , Jing Zhang
Abstract: A method includes measuring a leakage current through a particulate matter sample in a humidity chamber, the leakage current is measured as a relative humidity in the humidity chamber is incrementally increased, and plotting a logarithm of the measured leakage current as a function of the relative humidity. The plot of the logarithm of the measured leakage current as a function of the relative humidity has an inversion region, a low relative humidity region, and a high relative humidity region.
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25.发明申请公开(公告)号：US20140202573A1
公开(公告)日：2014-07-24
申请号：US13744785
申请日：2013-01-18
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Dylan J. Boday , Joseph Kuczynski , Prabjit Singh , Jason T. Wertz , Jing Zhang
CPC classification number: F16L11/00 , B23P6/00 , C23F11/00 , C23F11/10 , F16L58/00 , G06F2200/201 , Y10T137/0402
Abstract: Pre-treated water cooling hoses and a method for implementing pretreatment of water cooling hoses for increased reliability are provided. Pretreatment of the water cooling hoses includes attaching the water cooling hose to a water cooling system, filling the water cooling system with a high concentration corrosion inhibitor solution, and running the system for an extended time to saturate the attached hose with the high concentration corrosion inhibitor.
Abstract translation: 提供了预处理的水冷软管以及用于实现水冷软管预处理以提高可靠性的方法。 水冷软管的预处理包括将水冷软管连接到水冷却系统，用高浓度腐蚀抑制剂溶液填充水冷却系统，延长系统运行时间，使附着的软管与高浓度腐蚀抑制剂 。
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Patent Agency Ranking
公开(公告)号：US08720063B2
公开(公告)日：2014-05-13
申请号：US13692196
申请日：2012-12-03
Applicant: International Business Machines Corporation
Inventor： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madnusudan K. Iyengar , Robert E. Simons , Prabjit Singh
CPC classification number: H05K7/20 , H01L23/367 , H01L23/373 , H01L23/3736 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2023/4087 , H01L2224/16 , Y10T29/49002 , Y10T29/4935 , Y10T29/49353
Abstract: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.
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公开(公告)号：US20240072373A1
公开(公告)日：2024-02-29
申请号：US17822580
申请日：2022-08-26
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： John S. Werner , Andrew C. M. Hicks , Noah Singer , Prabjit Singh , Sadegh Khalili
IPC: H01M50/383 , H01M50/618 , H01M50/636
CPC classification number: H01M50/383 , H01M50/618 , H01M50/636
Abstract: A system and method for flushing the electrolyte out of an electrolyte flushable battery apparatus during a thermal runaway event. At least one condition of the electrolyte flushable battery apparatus is monitored to detect a potential thermal runaway event based on the at least one condition exceeding a threshold value. In response the inlet valve and outlet valves on the battery apparatus are opened. A flushing liquid is flushed or pumped through the battery apparatus where the flushing liquid enters the apparatus through the inlet valve and leaves the apparatus through the outlet valve. The flushing liquid is then stored in a reservoir.
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公开(公告)号：US10952330B2
公开(公告)日：2021-03-16
申请号：US16255879
申请日：2019-01-24
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Prabjit Singh , Daniel J. Kearney
Abstract: A method for repairing a through-hole includes inserting a repair coil, comprising a tightly-wound repair strip, into a through-hole and inserting a heating element into the repair coil. Passing an electrical current through the heating element liquefies a bonding material disposed on the repair coil and the repair coil expands within the through-hole. Subsequently solidifying the bonding material bonds the repair coil to the through-hole. A repair assembly comprises a repair coil inserted into a through-hole and a heating element inserted into the repair coil. The repair coil comprises a tightly-wound repair strip. The heating element comprises a segment of a heating wire enclosed within an insulating material. Passing an electric current through the segment of the heating wire liquefies bonding material disposed on the repair coil and the repair coil expands within the through-hole. The liquified bonding material solidifies to bond the repair coil to the through-hole.
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公开(公告)号：US10950831B2
公开(公告)日：2021-03-16
申请号：US16189011
申请日：2018-11-13
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Noah Singer , Prabjit Singh , John G. Torok , David C. Long
IPC: H01M2/10 , H01M10/52 , H01M2/12 , H01M10/653
Abstract: A battery pack is provided which includes an enclosure. The enclosure includes a battery cell compartment and a vent. The battery cell compartment is a sealed compartment, except for the vent, and the vent facilitates pressure-induced venting of gas from the battery cell compartment. One or more battery cells are disposed within the battery cell compartment, and the battery pack also includes a filter system associated with the enclosure. The filter system filters the pressure-induced venting of gas from the battery cell compartment resulting from a thermal runaway event at a battery cell of the one or more battery cells within the battery cell compartment of the enclosure.
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公开(公告)号：US20200245469A1
公开(公告)日：2020-07-30
申请号：US16255879
申请日：2019-01-24
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Prabjit Singh , Daniel J. Kearney
Abstract: A method for repairing a through-hole includes inserting a repair coil, comprising a tightly-wound repair strip, into a through-hole and inserting a heating element into the repair coil. Passing an electrical current through the heating element liquefies a bonding material disposed on the repair coil and the repair coil expands within the through-hole. Subsequently solidifying the bonding material bonds the repair coil to the through-hole. A repair assembly comprises a repair coil inserted into a through-hole and a heating element inserted into the repair coil. The repair coil comprises a tightly-wound repair strip. The heating element comprises a segment of a heating wire enclosed within an insulating material. Passing an electric current through the segment of the heating wire liquefies bonding material disposed on the repair coil and the repair coil expands within the through-hole. The liquified bonding material solidifies to bond the repair coil to the through-hole.
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