公开(公告)号：US20130277864A1

公开(公告)日：2013-10-24

申请号：US13920759

申请日：2013-06-18

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Albert Auburger ,  Jochen Dangelmaier ,  Josef Hirtreiter

IPC: H01L23/498

CPC classification number: H01L23/4985 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49224 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.

Abstract translation: 公开了一种用于制造包括部件的部件和装置的方法。 提供了具有纸作为基底材料的基本基底，至少一个集成电路施加到基底衬底上，施加在基底衬底上的至少一个集成电路用封装材料包住，至少部分碱性衬底被去除 从所述至少一个包络集成电路。

公开(公告)号：US11573204B2

公开(公告)日：2023-02-07

申请号：US17116029

申请日：2020-12-09

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Jochen Dangelmaier ,  Matthias Eberl ,  Simon Gassner ,  Franz Jost ,  Stefan Kolb ,  Horst Theuss

IPC: G01N21/17 ,  G01N29/02 ,  B81B3/00

Abstract: A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

公开(公告)号：US10461056B2

公开(公告)日：2019-10-29

申请号：US15600857

申请日：2017-05-22

Applicant: Infineon Technologies AG

Inventor： Joachim Mahler ,  Michael Bauer ,  Jochen Dangelmaier ,  Reimund Engl ,  Johann Gatterbauer ,  Frank Hille ,  Michael Huettinger ,  Werner Kanert ,  Heinrich Koerner ,  Brigitte Ruehle ,  Francisco Javier Santos Rodriguez ,  Antonio Vellei

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L21/02 ,  H01L23/495

Abstract: In various embodiments, a chip package is provided. The chip package may include a chip, a metal contact structure including a non-noble metal and electrically contacting the chip, a packaging material, and a protective layer including or essentially consisting of a portion formed at an interface between a portion of the metal contact structure and the packaging material, wherein the protective layer may include a noble metal, wherein the portion of the protective layer may include a plurality of regions free from the noble metal, and wherein the regions free from the noble metal may provide an interface between the packaging material and the non-noble metal of the metal contact structure.

公开(公告)号：US20190237396A1

公开(公告)日：2019-08-01

申请号：US16382508

申请日：2019-04-12

Applicant: Infineon Technologies AG

Inventor： Jochen Dangelmaier ,  Kim Huat Hoa ,  Hazrul Alang Abd Hamid ,  Andreas Allmeier ,  Dietmar Lang

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49541 ,  H01L21/4825 ,  H01L21/4835 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/49524 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/00 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/85011 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/206 ,  H01L2224/45099

Abstract: A semiconductor device includes a die paddle, a plurality of electrically conductive leads extending away from the die paddle, and an adhesion promoter plating material selectively formed on the electrically conductive leads such that outer portions of the leads are covered by the adhesion promoter plating material, and interior portions of the leads that are disposed between the die paddle and the respective outer portions of each lead are substantially devoid of the adhesion promoter plating material.

公开(公告)号：US10107867B2

公开(公告)日：2018-10-23

申请号：US14631443

申请日：2015-02-25

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Franz Michael Darrer ,  Thomas Mueller ,  Mathias Vaupel ,  Manfred Fries ,  Guenther Ruhl ,  Horst Theuss ,  Matthias Rose ,  Stephan Auer ,  Tue Fatt David Wee ,  Sie Boo Chiang

IPC: H01M10/48 ,  G01R31/36 ,  H01M10/42 ,  H04Q9/00 ,  H01M10/0525

Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.

公开(公告)号：US09986354B2

公开(公告)日：2018-05-29

申请号：US13927865

申请日：2013-06-26

Applicant: Infineon Technologies AG

Inventor： Thomas Mueller ,  Horst Theuss ,  Stefan Uwe Schindler ,  Dominik Kohl ,  Jochen Dangelmaier

IPC: H01L29/84 ,  H01L21/78 ,  H04R25/00 ,  B81C1/00 ,  H01L23/495 ,  H04R31/00 ,  H04R19/00 ,  H04R19/04 ,  H04R1/08

CPC classification number: H04R31/00 ,  B81B2201/0257 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/0023 ,  B81C1/00301 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/10158 ,  H01L2924/16195 ,  H04R1/086 ,  H04R19/005 ,  H04R19/04 ,  Y10T29/49121 ,  H01L2924/00014

Abstract: A microphone assembly is provided, wherein the pre-mold comprises a bent leadframe and a mold body, wherein the mold body is mold to at least partially encapsulate the bent leadframe to build the pre-mold comprising a cavity for accommodating a microphone, and wherein the pre-mold comprises a through-hole transmissive for sound waves.

公开(公告)号：US20170271245A1

公开(公告)日：2017-09-21

申请号：US15605093

申请日：2017-05-25

Applicant: Infineon Technologies AG

Inventor： Jochen Dangelmaier ,  Kim Huat Hoa ,  Hazrul Alang Abd Hamid ,  Andreas Allmeier ,  Dietmar Lang

IPC: H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49541 ,  H01L21/4825 ,  H01L21/4835 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/49524 ,  H01L23/49582 ,  H01L23/49586 ,  H01L2224/48247 ,  H01L2224/85011

Abstract: A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames have a die paddle and a plurality of leads extending away from the die paddle. A first one of the unit lead frames is plated with an adhesion promoter plating material within a package outline area of the first unit lead frame. The package outline area includes one of the die paddles and interior portions of the leads. Wire bond sites are processed in the first unit lead frame before or after the plating of the first lead frame such that, after the plating of the first lead frame. The wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area at an end of the interior portions of the leads that is closest to the die paddle.

公开(公告)号：US20170092569A1

公开(公告)日：2017-03-30

申请号：US14866050

申请日：2015-09-25

Applicant: Infineon Technologies AG

Inventor： Jochen Dangelmaier ,  Kim Huat Hoa ,  Hazrul Alang Abd Hamid ,  Andreas Allmeier ,  Dietmar Lang

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/49541 ,  H01L21/4825 ,  H01L21/4835 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/49524 ,  H01L23/49582 ,  H01L23/49586 ,  H01L2224/48247 ,  H01L2224/85011

Abstract: A lead frame strip having a plurality of unit lead frames is provided. Each of the unit lead frames includes a die paddle, a plurality of leads extending away from the die paddle, and a peripheral ring delineating interior portions of the leads from exterior portions of the leads. An adhesion promoter plating material is selectively plated within a package outline area of a first unit lead frame. The die paddle and the interior portions of the leads are disposed within the package outline area and the exterior portions of the leads are disposed outside of the package outline area. Wire bond sides are processed such that, after selectively plating the adhesion promoter plating material, the wire bond sites are substantially devoid of the adhesion promoter plating material. The wire bond sites are disposed within the package outline area and are spaced apart from the peripheral ring.

公开(公告)号：US20150226810A1

公开(公告)日：2015-08-13

申请号：US14631443

申请日：2015-02-25

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Jochen Dangelmaier ,  Franz Michael Darrer ,  Thomas Mueller ,  Mathias Vaupel ,  Manfred Fries ,  Guenther Ruhl ,  Horst Theuss ,  Matthias Rose ,  Stephan Auer ,  Tue Fatt David Wee ,  Sie Boo Chiang

IPC: G01R31/36 ,  H01M10/42 ,  H01M10/48

CPC classification number: G01R31/3658 ,  H01M10/0525 ,  H01M10/4257 ,  H01M10/48 ,  H01M10/486 ,  H01M2010/4271 ,  H04Q9/00 ,  H04Q2209/40 ,  H04Q2209/823

Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.

Abstract translation: 根据实施例的传感器装置包括基板，以及安装在基板上的至少一个传感器和控制电路，其中至少一个传感器和控制电路位于基板上，以可安装在电池单元内部， 电池单元。

公开(公告)号：US08872314B2

公开(公告)日：2014-10-28

申请号：US13920759

申请日：2013-06-18

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Albert Auburger ,  Jochen Dangelmaier ,  Josef Hirtreiter

IPC: H01L21/84 ,  H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/56 ,  H01L23/495 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/4985 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49224 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.

Abstract translation: 公开了一种用于制造包括部件的部件和装置的方法。 提供了具有纸作为基底材料的基本基底，至少一个集成电路施加到基底衬底上，施加在基底衬底上的至少一个集成电路用封装材料包住，至少部分碱性衬底被去除 从所述至少一个包络集成电路。