公开(公告)号：US09536953B2

公开(公告)日：2017-01-03

申请号：US14745428

申请日：2015-06-20

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Guenther Ruhl ,  Horst Theuss ,  Irmgard Escher-Poeppel

IPC: H01L29/06 ,  H01L29/16 ,  G01N27/12 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  H01L23/28 ,  H01L23/495 ,  H01L23/00 ,  G01N33/00

CPC classification number: H01L29/1606 ,  G01N27/127 ,  G01N33/0059 ,  H01L21/561 ,  H01L21/568 ,  H01L23/28 ,  H01L23/293 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/49562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/11 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.

Abstract translation: 在基板上产生石​​墨烯层。 在石墨烯层上沉积塑料材料以至少部分地覆盖石墨烯层。 将基板分成至少两个基片。

公开(公告)号：US20160209477A1

公开(公告)日：2016-07-21

申请号：US15056284

申请日：2016-02-29

Applicant: Infineon Technologies AG

Inventor： Tobias Werth ,  Klaus Elian ,  James Sterling

IPC: G01R33/00 ,  G01D5/16 ,  G01R33/09

CPC classification number: G01R33/0023 ,  B82Y25/00 ,  G01D5/12 ,  G01D5/16 ,  G01R3/00 ,  G01R33/0052 ,  G01R33/072 ,  G01R33/09 ,  G01R33/091 ,  G01R33/093 ,  G01R33/098 ,  G11B2005/0008 ,  H01L43/08 ,  Y10T29/49002

Abstract: Embodiments related to the generation of magnetic bias fields for magnetic sensing are described and depicted. In one embodiment, a sensor includes at least one magnetosensitive element, and a magnetic body with an opening, the magnetic body comprising magnetic material magnetized mainly in a vertical direction, the magnetic body having inclined surface sections shaped by the opening, wherein the sensor is arranged atop the opening.

Abstract translation: 描述和描绘了与产生用于磁感测的磁偏置场相关的实施例。 在一个实施例中，传感器包括至少一个磁敏元件和具有开口的磁体，磁体包括主要在垂直方向上磁化的磁性材料，磁体具有由开口成形的倾斜表面部分，其中传感器 安排在开口顶部。

公开(公告)号：US09332330B2

公开(公告)日：2016-05-03

申请号：US13947930

申请日：2013-07-22

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss ,  Thomas Mueller

IPC: H04R11/04 ,  H04R1/04 ,  H01L29/84

CPC classification number: H04R1/04 ,  B81B2201/0257 ,  H04R2201/00 ,  H04R2499/11

Abstract: A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.

Abstract translation: 表面安装式麦克风封装包括第一麦克风和第二麦克风。 此外，表面可安装麦克风封装包括用于第一麦克风的第一开口和用于第二麦克风的第二开口。 第一开口和第二开口布置在可表面安装的麦克风包装的相对侧上。

公开(公告)号：US20150355291A1

公开(公告)日：2015-12-10

申请号：US14297685

申请日：2014-06-06

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss ,  Alexander Spielbauer ,  Ingrid Bollmann

IPC: G01R33/06 ,  G01R33/00

CPC classification number: G01R33/06 ,  G01R33/0052 ,  H01L2224/48091 ,  H01L2924/181 ,  Y10T29/49021 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A magnetic sensor device includes a ring-shaped magnet and a sensor chip arranged in an opening of the ring-shaped magnet.

Abstract translation: 磁传感器装置包括环形磁体和布置在环形磁体的开口中的传感器芯片。

公开(公告)号：US20150024807A1

公开(公告)日：2015-01-22

申请号：US13947930

申请日：2013-07-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Klaus Elian ,  Horst Theuss ,  Thomas Mueller

IPC: H04M1/19 ,  H04R1/04

CPC classification number: H04R1/04 ,  B81B2201/0257 ,  H04R2201/00 ,  H04R2499/11

Abstract: A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.

Abstract translation: 表面安装式麦克风封装包括第一麦克风和第二麦克风。 此外，表面可安装麦克风封装包括用于第一麦克风的第一开口和用于第二麦克风的第二开口。 第一开口和第二开口布置在可表面安装的麦克风封装的相对侧上。

公开(公告)号：US20150023523A1

公开(公告)日：2015-01-22

申请号：US14065067

申请日：2013-10-28

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss ,  Thomas Mueller

IPC: H04R1/08 ,  B81B7/00

CPC classification number: H04R1/083 ,  B81B7/0061 ,  B81B2201/0257 ,  H01L2224/95 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15 ,  H01L2924/181 ,  H01L2924/19106 ,  H04R1/04 ,  H04R1/406 ,  H04R19/005 ,  H04R2201/003 ,  H04R2410/05 ,  H04R2499/11

Abstract: A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.

Abstract translation: 表面可安装麦克风包包括第一麦克风和第二麦克风。 此外，表面可安装麦克风封装包括用于第一麦克风的第一开口和用于第二麦克风的第二开口。 第一开口和第二开口布置在可表面安装的麦克风封装的相对侧上。

公开(公告)号：US20130122660A1

公开(公告)日：2013-05-16

申请号：US13733375

申请日：2013-01-03

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Georg Meyer-Berg ,  Horst Theuss

IPC: H01L21/56

CPC classification number: H01L21/563 ,  G01L9/0054 ,  G01L19/0627 ,  G01L19/141 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element.

Abstract translation: 传感器装置及方法。 一个实施例提供了具有感测区域的第一半导体芯片。 多孔结构元件附接到第一半导体芯片。 多孔结构元件的第一区域面向第一半导体芯片的感测区域。 封装材料部分地封装第一半导体芯片和多孔结构元件。

公开(公告)号：US12124655B2

公开(公告)日：2024-10-22

申请号：US18159817

申请日：2023-01-26

Applicant: Infineon Technologies AG

Inventor： Emanuel Stoicescu ,  Matthias Eberl ,  Costin Batrinu ,  Klaus Elian

IPC: G06F3/041 ,  G06F3/043 ,  G06F3/044

CPC classification number: G06F3/04186 ,  G06F3/043 ,  G06F3/044 ,  G06F2203/04105

Abstract: A touch sensor includes a touch structure including a touch interface and an inner interface arranged opposite to the touch interface; a capacitive ultrasonic transmitter arranged inside an enclosed interior volume and configured to transmit an ultrasonic transmit wave towards the touch structure; a capacitive ultrasonic receiver arranged inside the enclosed interior volume and configured to receive at least one ultrasonic reflected wave produced from the ultrasonic transmit wave via internal reflection; a coupling medium that fills an area between the inner interface and the capacitive ultrasonic receiver, wherein an external force applied to the touch interface is configured to impart an internal pressure onto the capacitive ultrasonic receiver through the coupling medium; and a sensor circuit configured to convert the at least one ultrasonic reflected wave into a measurement signal and detect the external force based on the measurement signal.

公开(公告)号：US12086363B2

公开(公告)日：2024-09-10

申请号：US18456754

申请日：2023-08-28

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Christoph Steiner ,  Horst Theuss

IPC: G06F3/043 ,  B06B1/02

CPC classification number: G06F3/0436 ,  B06B1/0292 ,  G06F2203/04103

Abstract: A sensor device contains at least one sensor chip having at least one MEMS structure arranged at a main surface of the at least one sensor chip, wherein the at least one sensor chip is configured to transmit ultrasonic signals and/or to receive ultrasonic signals. The sensor device further contains an acoustic coupling medium arranged selectively on the at least one MEMS structure, wherein the acoustic coupling medium is configured to decouple an ultrasonic signal to be emitted from the at least one MEMS structure and/or to inject a received ultrasonic signal into the at least one MEMS structure. The acoustic coupling medium only partially covers the main surface of the at least one sensor chip.

公开(公告)号：US11795053B2

公开(公告)日：2023-10-24

申请号：US17217488

申请日：2021-03-30

Applicant: Infineon Technologies AG

Inventor： Rainer Markus Schaller ,  Klaus Elian ,  Horst Theuss

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0051 ,  B81C1/00325 ,  B81B2203/033 ,  B81B2207/07 ,  B81B2207/096 ,  B81C2203/0118

Abstract: A sensor device includes a sensor chip with a micro-electromechanical systems (MEMS) structure, wherein the MEMS structure is arranged at a main surface of the sensor chip, and a gas-permeable cover arranged over the main surface of the sensor chip, which covers the MEMS structure and forms a cavity above the MEMS structure.