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    CHIP MODULE AND METHOD FOR FORMING A CHIP MODULE
    21.
    发明申请
    CHIP MODULE AND METHOD FOR FORMING A CHIP MODULE 有权

    公开(公告)号：US20230029248A1

    公开(公告)日：2023-01-26

    申请号：US17866788

    申请日：2022-07-18

    Applicant: Infineon Technologies AG

    Inventor： Frank Pueschner ,  Thomas Spoettl

    IPC: G06K19/077

    Abstract: A chip module having a chip coupled to at least one electrically conductive region including a metal, and a coating of the at least one electrically conductive region with a layer of at least one organic silicon compound and/or a form of carbon in a thickness having an electrical surface contact resistance of not more than 500 mΩ according to ISO 7810 in a measurement in accordance with ISO 10373-1.

    Smart card module, smart card body, smart card and smart card production method
    26.
    发明申请
    Smart card module, smart card body, smart card and smart card production method 有权
    智能卡模块，智能卡机身，智能卡和智能卡生产方式

    公开(公告)号：US20150317553A1

    公开(公告)日：2015-11-05

    申请号：US14697664

    申请日：2015-04-28

    Applicant: Infineon Technologies AG

    Inventor： Frank Pueschner ,  Thomas Spoettl ,  Jens Pohl ,  Gottfried Beer

    IPC: G06K19/077 ,  H01L25/00 ,  G06K19/07

    CPC classification number: G06K19/07705 ,  G06K19/0716 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/07754 ,  H01L21/48 ,  H01L23/488 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16238

    Abstract: In various embodiments, a smart card module is provided. The smart card module includes a carrier having a first main surface and a second main surface opposite the first main surface. The carrier has at least one plated-through hole. The smart card module further includes a contact array arranged above the first main surface of the carrier and having a plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts is electrically connected to the plated-through hole. The smart card module further includes a chip arranged above the second main surface. The chip is electrically coupled to at least one electrical contact of the plurality of electrical contacts by the plated-through hole. The smart card module further includes at least one optoelectronic component arranged above the second main surface and electrically conductively connected to the chip.

    Abstract translation: 在各种实施例中，提供智能卡模块。 智能卡模块包括具有第一主表面和与第一主表面相对的第二主表面的载体。 载体具有至少一个电镀通孔。 智能卡模块还包括布置在载体的第一主表面上方并具有多个电触点的接触阵列。 多个电触点中的至少一个电接触电连接到电镀通孔。 智能卡模块还包括布置在第二主表面上方的芯片。 芯片通过电镀通孔与多个电触点的至少一个电接触电耦合。 所述智能卡模块还包括布置在所述第二主表面上方并与所述芯片导电连接的至少一个光电子部件。

    Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for producing a smart card
    27.
    发明申请
    Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for producing a smart card 审中-公开
    智能卡模块布置，智能卡，用于制造智能卡模块布置的方法和用于制造智能卡的方法

    公开(公告)号：US20150069132A1

    公开(公告)日：2015-03-12

    申请号：US14483174

    申请日：2014-09-11

    Applicant: Infineon Technologies AG

    Inventor： Frank PUESCHNER ,  Thomas Spoettl ,  Jens POHL ,  Peter STAMPKA

    IPC: G06K19/077 ,  H01L23/00

    CPC classification number: G06K19/07728 ,  G06K19/07722 ,  G06K19/07747 ,  G06K19/07775 ,  H01L21/56 ,  H01L23/3121 ,  H01L24/83 ,  H01L2224/83201 ,  H01L2224/83902 ,  H01L2924/06 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/00

    Abstract: A method for producing a smart card module arrangement includes: arranging a smart card module on a first carrier layer, wherein the first carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module. The smart card module includes: a substrate; a chip on the substrate; a first mechanical reinforcement structure between the chip and the substrate. The first mechanical reinforcement structure covers at least one part of a surface of the chip. The method further includes applying a second carrier layer to the smart card module, wherein the second carrier layer is free of a prefabricated smart card module receptacle cutout for receiving the smart card module; and at least one of laminating or pressing the first carrier layer with the second carrier layer, such that the smart card module is enclosed by the first carrier layer and the second carrier layer.

    Abstract translation: 一种用于制造智能卡模块装置的方法包括：将智能卡模块布置在第一载体层上，其中第一载体层没有用于接收智能卡模块的预制智能卡模块插座切口。 智能卡模块包括：基板; 衬底上的芯片; 在芯片和衬底之间的第一机械加强结构。 第一机械加强结构覆盖芯片表面的至少一部分。 该方法还包括将第二载体层应用于智能卡模块，其中第二载体层没有用于接收智能卡模块的预制智能卡模块插座切口; 以及将第一载体层与第二载体层层压或压制中的至少一个，使得智能卡模块被第一载体层和第二载体层包围。

    CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING THE SAME
    28.
    发明申请
    CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING THE SAME 审中-公开
    芯片布置及其制造方法

    公开(公告)号：US20140205128A1

    公开(公告)日：2014-07-24

    申请号：US13747496

    申请日：2013-01-23

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： Thomas Spoettl ,  Horst Theuss

    IPC: H04R3/00

    CPC classification number: H04R3/00 ,  H04R19/005 ,  H04R31/00

    Abstract: In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip including a microphone structure, depositing adhesive material laterally disposed from the microphone structure, and arranging the microphone structure into a cavity of a second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier.

    Abstract translation: 在各种实施例中，一种用于制造芯片布置的方法，所述方法包括将麦克风芯片接合到第一载体，麦克风芯片包括麦克风结构，沉积从麦克风结构侧向设置的粘合剂材料，以及将麦克风结构布置成腔 的第二载体，使得粘合剂材料将麦克风芯片固定到第二载体的空腔。

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