摘要:
A method manufacturing a semiconductor integrated circuit device includes providing a substrate; sequentially forming a layer to be etched, a first layer, and a second layer on the substrate; forming on the first and second layers a first etch mask having a plurality of first line patterns separated from each other by a first pitch and extending in a first direction; sequentially performing first etching on the second layer and the first layer using the first etch mask to form an intermediate mask pattern with second and first patterns; forming on the intermediate mask pattern a second etch mask including a plurality of second line patterns separated from each other by a second pitch and extending in a second direction other than the first direction; performing second etching using the second etch mask on a portion of the second pattern so that the remaining portion of the second pattern is left on the first pattern; performing third etching using the second etch mask under different conditions than the second etching on the first pattern and the remaining portion of second pattern of the intermediate mask pattern and forming a final mask pattern; and patterning the layer to be etched using the final mask pattern.
摘要:
A charge pump for a DC-DC converter includes an input terminal receiving an input voltage, an output terminal outputting an output voltage, a plurality of charge pumping stages connected in series between the input terminal and the output terminal, and a voltage level shifter shifting voltage levels of first and second gate clock signals so that received first and second gate clock signals have a predetermined amplitude. Therefore, the charge pump can increase power efficiency by maximizing a magnitude of VGS. A DC-DC converter using the charge pump can also be applied to a portable device, for minimizing power consumption, and a method for improving power efficiency of the DC-DC converter is provided.
摘要:
Methods for forming an interconnection line and interconnection line structures are disclosed. The method includes forming an interlayer insulating layer on a semiconductor substrate, wherein the interlayer insulating layer is formed of a carbon-doped low-k dielectric layer. An oxidation barrier layer is formed on the interlayer insulating layer. An oxide capping layer is formed on the oxidation barrier layer. A via hole is in the oxide capping layer, the oxidation barrier, and the interlayer insulating layer. A conductive layer pattern is formed within the via hole.
摘要:
A test apparatus includes a plurality of pairs of test contacts on a semiconductor substrate; a first test structure which includes a plurality of first test interconnection layers and a first body interconnection layer that is electrically connected to the first test interconnection layers, each of the first test interconnection layers being electrically connected to at least one test contact; and a second test structure which includes a plurality of second test interconnection layers and a second body interconnection layer that is electrically connected to the second test interconnection layers, each of the second test interconnection layers being electrically connected to at least one test contact.
摘要:
A method of fabricating a MOS transistor, and a MOS transistor fabricated by the method. The method can include forming a gate pattern on a semiconductor substrate. The gate pattern can be formed by sequentially stacking a gate electrode and a capping layer pattern. The capping layer pattern is formed to have a lower capping layer pattern and an upper capping layer pattern. The lower capping layer pattern is formed to a smaller width than the upper capping layer pattern.
摘要:
In a method of manufacturing a semiconductor device, a first insulation layer on the substrate is patterned to form a first opening having a first width. A lower electrode is formed along an inner contour of the first opening. A second insulation layer on the first insulation layer is patterned to form a second opening that has a second width greater than the first width and is connected to the first opening with a stepped portion. A dielectric layer is formed on the lower electrode in the first opening, a sidewall of the second opening and a first stepped portion between the first insulation layer and the second insulation layer, so that the electrode layer is covered with the dielectric layer. An upper electrode is formed on the dielectric layer. Accordingly, a leakage current between the lower and upper electrodes is suppressed.
摘要:
A display device, which includes a plurality of pixels; a data driver for outputting data signals to the pixels; a bias current outputting unit for outputting a bias current having a predetermined magnitude; a plurality of driving current outputting units for outputting driving currents to the pixels; and a first switch connected between the bias current outputting unit and the driving current outputting units for selecting one of the driving current outputting units to connect to the bias current outputting unit, wherein the magnitudes of the driving currents are substantially the same as a magnitude of the bias current.
摘要:
A charge pump for a DC-DC converter includes an input terminal receiving an input voltage, an output terminal outputting an output voltage, a plurality of charge pumping stages connected in series between the input terminal and the output terminal, and a voltage level shifter shifting voltage levels of first and second gate clock signals so that received first and second gate clock signals have a predetermined amplitude. Therefore, the charge pump can increase power efficiency by maximizing a magnitude of VGS. A DC-DC converter using the charge pump can also be applied to a portable device, for minimizing power consumption, and a method for improving power efficiency of the DC-DC converter is provided.
摘要:
A method of fabricating a semiconductor device having a low dielectric constant is disclosed. According to the method, a silicon oxycarbide layer is formed, treated with plasma, and patterned. The silicon oxycarbide layer is formed by a coating method or a CVD method such as a PECVD method. Treating the silicon oxycarbide layer with plasma is performed by supplying at least one gas selected from a group of He, H2, N2O, NH3, N2, O2 and Ar. It is desirable that plasma be applied at the silicon oxycarbide layer in a PECVD device by an in situ method after forming the silicon oxycarbide layer. In a case in which a capping layer is further stacked and patterned, it is desirable to treat with H2-plasma. Even in a case in which an interlayer insulation is formed of the silicon oxycarbide layer and a coating layer of an organic polymer group for a dual damascene process, it is desirable to perform the plasma treatment before forming the coating layer.
摘要翻译:公开了一种制造具有低介电常数的半导体器件的方法。 根据该方法,形成碳氧化硅层,用等离子体处理并图案化。 碳硅氧化物层通过涂布法或CVD法如PECVD法形成。 用等离子体处理碳氧化硅层是通过供给至少一种选自He,H 2 H 2,N 2 O,NH 3, N 2,N 2,O 2和Ar。 希望在形成硅碳化硅层之后,通过原位法将等离子体施加在PECVD器件中的碳氧化硅层。 在封盖层进一步堆叠和图案化的情况下,希望用H 2 - 等离子体处理。 即使在由硅碳化硅层和双镶嵌工艺的有机聚合物基团的涂层形成层间绝缘的情况下,期望在形成涂层之前进行等离子体处理。
摘要:
A display device, which includes a plurality of pixels; a data driver for outputting data signals to the pixels; a bias current outputting unit for outputting a bias current having a predetermined magnitude; a plurality of driving current outputting units for outputting driving currents to the pixels; and a first switch connected between the bias current outputting unit and the driving current outputting units for selecting one of the driving current outputting units to connect to the bias current outputting unit, wherein the magnitudes of the driving currents are substantially the same as a magnitude of the bias current.