摘要:
A substrate includes a pair of surfaces opposing to each other in a direction. First electronic components are provided on one surface. Second electronic components lower than a maximum value of the height of the first electronic components in a direction are provided on the other surface. Insulating resin includes a covering part adhering and covering the second electronic components and the other surface, and side surface part extending from the periphery of the substrate to a side of the second electronic components along the direction. A lid covers the first electronic components from an opposite side of the substrate, and is fixed to the side surface part from the opposite side of the substrate.
摘要:
A technique for suppressing the bowing of an epitaxial wafer is provided. The epitaxial wafer is prepared by successively epitaxially growing a target group III-nitride layer, an interlayer and another group III-nitride layer on a substrate with a buffer layer. The interlayer is mainly composed of a mixed crystal of GaN and InN expressed in a general formula (GaxIny)N (0≦x≦1, 0≦y≦1, x+y=1) (or a crystal of GaN), and does not contain Al. The interlayer is epitaxially formed at a lower growth temperature than those of the group III-nitride layers, more specifically at a temperature in a range of at least 350° C. to not more than 1000° C.
摘要翻译:提供了抑制外延晶片弯曲的技术。 通过在具有缓冲层的衬底上连续外延生长目标III族氮化物层,中间层和另一III族氮化物层来制备外延晶片。 中间层主要由通式(GaxIny)N(0 <= x <= 1,0 <= y <= 1,x + y = 1)表示的GaN和InN的混合晶体(或 GaN),不含Al。 中间层在比III族氮化物层低的生长温度下外延形成,更具体地在至少350℃至不超过1000℃的温度下外延形成。
摘要:
A method for manufacturing a nitride film including a high-resistivity GaN layer includes a step of allowing a Group-III source gas containing an organic metal compound, a Group-V source gas containing ammonia, a carrier gas for the Group-III source gas, and a carrier gas for the Group-V source gas to flow over a predetermined monocrystalline wafer maintained at 1,000° C. or more and also includes a step of epitaxially growing a nitride film, including a GaN layer, on the monocrystalline wafer by a vapor phase reaction of the source gases. At least one of the carrier gases contains nitrogen while the wafer temperature is being increased before the reaction is carried out. At least one of the carrier gases contains hydrogen and nitrogen and has a total hydrogen and nitrogen content of 90 percent by volume or more in at least one part of the epitaxially growing step.
摘要:
A method for fabricating a Group III nitride film is provided, including the steps of preparing a substrate, forming an underfilm and then forming the Group III nitride film on the underfilm. The underfilm is a Group III nitride including at least 50 atomic percent of elemental Al for each of the Group III elements of the underfilm Group III nitride. The surface of the underfilm includes a contoured portion and a flat region, and less than 50% of the surface is occupied by the flat region.
摘要:
An object of the present invention is to provide a semiconductor light-emitting device that reduces dislocation density and has a high luminous efficiency. A semiconductor light-emitting device 20 has an underlayer 13 made of nitride semiconductor containing Al and a dislocation density of 1011/cm2 or less. The device further has an n-type conductive layer 14 and p-type conductive layer 17 each composed of nitride semiconductor having an Al content smaller than that of the nitride semiconductor constituting the underlayer and having a dislocation density of 1×1010/cm2 or less. The device still further has a light emitting layer 15 composed of nitride semiconductor having an Al content smaller than that of the nitride semiconductor constituting the underlayer and having a dislocation density of 1×1010/m2 or less, as well.
摘要翻译:本发明的目的在于提供减少位错密度,发光效率高的半导体发光元件。 半导体发光器件20具有由含有Al的氮化物半导体和位移密度为10 11 / cm 2以下的底层13。 该器件还具有n型导电层14和p型导电层17,它们各自由氮化物半导体构成,Al氮化物半导体的Al含量低于构成底层的氮化物半导体,其位错密度为1×10 10 / 2>以下。 该装置还具有由氮化物半导体构成的发光层15,该氮化物半导体的Al含量比构成底层的氮化物半导体的Al含量小,并且具有1×10 10 / m 2以下的位错密度。
摘要:
A light-emitting element includes a transparent substrate, a III-V nitride semiconductor layer including rare earth metal elements which is formed on said transparent substrate, and an irradiation source of electron beam which is disposed within 5 mm from the surface of said III-V nitride semiconductor layer so as to be opposite to said III-V nitride semiconductor layer. Then, the rare earth metal elements in the III-V nitride semiconductor layer are excited by electron beams from the irradiation source and a given fluorescence inherent to the rare earth metal elements are emitted.
摘要:
A substrate is set on a susceptor installed in a reactor and arranged horizontally. A cooling jacket is provided at a portion of the inner wall of the reactor that is opposite to the substrate. By flowing a given cooling medium through the cooling jacket with a pump connected to the jacket, at least the opposite portion of the inner wall is cooled down, which inhibits the reaction between raw material gases introduced into the reactor. As a result, in fabricating a III-V nitride film, the film growth rate is developed and the crystal quality is developed.
摘要:
An epitaxial wafer includes a base material made of sapphire-SiC single crystal or the like, a III nitride underfilm including at least Al epitaxially grown on the base material and a GaN film, preferably having a thickness of 50 Å or more, formed on the underfilm. In fabricating III nitride films on the epitaxial wafer, the oxidized surface layer of the GaN film is removed through an etching process, and subsequently, another III nitride film is formed thereon.
摘要:
A surface acoustic wave matched filter for use in a spread spectrum communication system is disclosed. The surface acoustic wave matched filter includes a substrate having dispersity and is composed of a sapphire main body and a piezoelectric aluminum nitride. A tap distance L of an output side electrode is designed on the basis of a group velocity vg instead of a phase velocity vs in order to match the tap distance L with an input spread spectrum signal and to improve a correlation peak level of an output demodulated signal. When the tap distance L is set to satisfy a condition of vg/f1×0.97≦L≦vg/f1×1.02, a decrease in the correlation peak level of the matched filter can be improved from 7 dB to a value smaller than 3 dB, and S/N of the output demodulated signal can be increased. Thus, the disclosed device renders it no longer necessary to process the output demodulated signal by a complicated and power consuming circuit.
摘要:
A surface acoustic wave device including a substrate and an electrode structure formed on the substrate, said substrate being made of a doubly rotated Y-cut (&agr;X-&thgr;Y cut) Langasite (La3Ga5SiO14), a rotation angle &agr; from the X axis being substantially 50°±5° and a rotation angle &thgr; from the Y axis being substantially 19°-30°. The device further includes a normal type electrode structure which reveals a natural single-phase unidirectional transducer property together with an anisotropy of the substrate. The device further has a double electrode type electrode structure which cancels the directionality, or a floating type electrode structure which reverses the directionality. The electrode structure is formed to constitute a surface acoustic wave filter having a low insertion loss and an excellent phase property.