公开(公告)号：US08274158B2

公开(公告)日：2012-09-25

申请号：US12877661

申请日：2010-09-08

申请人： Junichi Kasai ,  Junji Tanaka ,  Naomi Masuda

发明人： Junichi Kasai ,  Junji Tanaka ,  Naomi Masuda

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/05 ,  H01L22/24 ,  H01L23/544 ,  H01L24/06 ,  H01L24/17 ,  H01L24/81 ,  H01L2223/5442 ,  H01L2223/5448 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/06051 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/17051 ,  H01L2224/81121 ,  H01L2224/8121 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/20106 ,  H01L2924/351 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/53022 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： Structures, methods, and systems for assessing bonding of electrodes in FCB packaging are disclosed. In one embodiment, a method comprises mounting a semiconductor chip with a plurality of first electrodes of a first shape to a mounted portion with a second electrode of a second shape, wherein the second shape is different from the first shape, bonding a respective one of the plurality of first electrodes and the second electrode using a first solder bump, generating an X-ray image of the first solder bump, and determining an acceptability of the bonding of the respective one of the plurality of first electrodes and the second electrode based on the X-ray image of the first solder bump.

摘要翻译： 公开了用于评估FCB封装中电极接合的结构，方法和系统。 在一个实施例中，一种方法包括将具有第一形状的多个第一电极的半导体芯片安装到具有第二形状的第二电极的安装部分，其中第二形状与第一形状不同， 所述多个第一电极和所述第二电极使用第一焊料凸块，产生所述第一焊料凸块的X射线图像，以及基于所述多个第一电极和所述第二电极中的相应一个的接合，基于 第一焊锡凸块的X射线图像。

公开(公告)号：US07846771B2

公开(公告)日：2010-12-07

申请号：US12166293

申请日：2008-07-01

申请人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

发明人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06593 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other.

摘要翻译： 叠层型半导体器件的载体包括用于容纳堆叠的半导体器件的容纳部分，引导堆叠的半导体器件的引导部分和流体可以通过该沟槽流动到容纳部分和堆叠的半导体器件的侧面的沟槽。 这些凹槽有助于容纳部分侧面上的气体或液体的流动，因此预期在清洗过程中回流过程中的热风和清洗液体的流动可以被方便。 这提高了产量和清洁效果。 用于将容纳部分连接到外部的孔可以设置在容纳部分的角部。 气体可以从容纳部分的下侧引导，使得可以有效地将热量施加到半导体器件，并且可以减少它们之间的接合故障。 此外，可以设置连接相邻孔的槽，用于容纳彼此相邻的部分。

公开(公告)号：US20100240426A1

公开(公告)日：2010-09-23

申请号：US12677509

申请日：2008-09-04

申请人： Junji Tanaka ,  Minoru Taneda

发明人： Junji Tanaka ,  Minoru Taneda

IPC分类号： H04W88/02

CPC分类号： H04M1/0237 ,  H04M1/22 ,  H04M19/04 ,  H04M19/048

摘要： In the sliding portable telephone of the present invention, on the surface of the base housing, a photoconductive member is placed along a boundary line between a first surface region which is exposed when the slide housing is placed at the open position and a second surface region which is covered by the slide housing, a light emitting element for emitting light toward an end part of the photoconductive member on the second surface region side is arranged inside the base housing. The slide housing is provided with a reflecting plate reflecting light which has passed through the photoconductive member toward an end part of the photoconductive member on the first surface region side at a position opposed to a surface of the photoconductive member when the slide housing is placed at the open position.

摘要翻译： 在本发明的滑动式便携式电话机中，在基座壳体的表面上，沿着在滑动壳体位于打开位置时露出的第一表面区域与第二表面区域之间的边界线放置感光体， 其被滑动壳体覆盖，用于在第二表面区域侧朝向感光体的端部发射光的发光元件设置在基座壳体的内部。 滑动壳体设置有反射板，其反射光，当反射板将滑动壳体放置在与感光体表面相对的位置处时，反射光已经穿过光电导体朝向第一表面区域侧的感光体的端部 开仓。

公开(公告)号：US20090311831A1

公开(公告)日：2009-12-17

申请号：US12332146

申请日：2008-12-10

申请人： Junji Tanaka ,  Kouichi Meguro ,  Yasuhiro Shinma

发明人： Junji Tanaka ,  Kouichi Meguro ,  Yasuhiro Shinma

IPC分类号： H01L21/50

CPC分类号： H01L21/561 ,  H01L24/97 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device is disclosed. As a part of the method, one surface of a substrate is molded with resin where the substrate and the resin are heated in a first heating process and maintained in a flat condition. The substrate and the resin are returned to room temperature while being maintained in the flat condition after the first heating process. The resin is cut after the substrate and the resin are returned to room temperature from a surface of the resin that is opposite the surface of the resin where the substrate contacts the resin. The substrate is left intact when the resin is cut. Thereafter, the substrate is separated.

摘要翻译： 公开了一种制造半导体器件的方法。 作为该方法的一部分，基板的一个表面用树脂模制，其中基板和树脂在第一加热过程中被加热并保持在平坦的状态。 在第一加热处理之后，将基板和树脂恢复到室温，同时保持在平坦状态。 在基板之后切割树脂，树脂从与树脂接触的树脂表面相对的树脂表面返回到室温。 当切割树脂时，基材保持不变。 此后，分离基板。

公开(公告)号：US07489029B2

公开(公告)日：2009-02-10

申请号：US11214630

申请日：2005-08-30

申请人： Masanori Onodera ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Koji Taya ,  Junji Tanaka

发明人： Masanori Onodera ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Koji Taya ,  Junji Tanaka

IPC分类号： H01L23/02 ,  H01L23/34 ,  H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/67336 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/3511

摘要： A carrier structure for fabricating a stacked-type semiconductor device includes: a lower carrier that has laminated thin plates and has first openings for mounting first semiconductor packages thereon; and an upper carrier having second openings for mounting second semiconductor packages on the first semiconductor packages. The lower carrier composed of the laminated thin plates realizes an even plate thickness and reduces warps because stress is distributed to the thin plates. This results in an improved production yield. A pattern of the openings in the thin plates of the lower carrier may be formed by etching or electric discharging. The openings thus formed have reduced warps and burrs.

摘要翻译： 用于制造层叠型半导体器件的载体结构包括：具有叠层薄板并具有用于在其上安装第一半导体封装的第一开口的下载体; 以及具有用于将第二半导体封装安装在第一半导体封装上的第二开口的上载体。 由层压薄板构成的下部载体由于应力分布在薄板上，因此实现了均匀的板厚度并且减少了翘曲。 这导致提高的产量。 下载体的薄板中的开口的图案可以通过蚀刻或放电形成。 如此形成的开口减少了经纱和毛刺。

公开(公告)号：US20080318214A1

公开(公告)日：2008-12-25

申请号：US11574948

申请日：2004-09-08

申请人： Junji Tanaka

发明人： Junji Tanaka

IPC分类号： C12Q1/68 ,  C12M1/34

CPC分类号： G16B20/00

摘要： This invention makes it possible to perform analysis for estimating the characteristics of a population using sample data. By obtaining sample data, embedding genetic (statistical) knowledge in a first and second state variable that have duality, and having the first and second state variables converge to the original value, the characteristics of the population of the sample data are estimated, and the estimated results of the characteristics of the population are output. By doing so, it is possible to perform analysis for estimating characteristics of a population using sample data.

摘要翻译： 本发明使得可以使用样本数据来进行用于估计群体的特征的分析。 通过获取样本数据，将遗传（统计）知识嵌入到具有二元性的第一和第二状态变量中，并将第一和第二状态变量收敛到原始值，估计样本数据的群体的特征， 输出人口特征的估计结果。 通过这样做，可以使用样本数据来进行用于估计群体特征的分析。

公开(公告)号：US07414305B2

公开(公告)日：2008-08-19

申请号：US11341984

申请日：2006-01-27

申请人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

发明人： Koji Taya ,  Kouichi Meguro ,  Junichi Kasai ,  Yasuhiro Shinma ,  Masanori Onodera ,  Junji Tanaka ,  Murugasan Manikam Achari

IPC分类号： H01L23/02

CPC分类号： H01L21/6835 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06593 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： A carrier for a stacked-type semiconductor device includes an accommodating section for accommodating stacked semiconductor devices, guide portions guiding the stacked semiconductor devices, and grooves through which a fluid may flow to the accommodating section and to sides of the stacked semiconductor devices. These grooves facilitate the flow of gas or liquid on the sides of the accommodating sections, and it is thus expected that the flow of hot wind during the reflow process and cleaning liquid during the cleaning process can be facilitated. This improves the production yield and the cleaning effects. Holes for connecting the accommodating section to the outside may be provided at corners of the accommodating section. Gas may be guided from the lower side of the accommodating section, so that heat can be efficiently applied to the semiconductor devices and bonding failures therebetween can be reduced. Further, grooves connecting adjacent holes may be provided for accommodating sections adjacent to each other.

摘要翻译： 叠层型半导体器件的载体包括用于容纳堆叠的半导体器件的容纳部分，引导堆叠的半导体器件的引导部分和流体可以通过该沟槽流动到容纳部分和堆叠的半导体器件的侧面的沟槽。 这些凹槽有助于容纳部分侧面上的气体或液体的流动，因此预期在清洗过程中回流过程中的热风和清洗液体的流动可以被方便。 这提高了产量和清洁效果。 用于将容纳部分连接到外部的孔可以设置在容纳部分的角部。 气体可以从容纳部分的下侧引导，使得可以有效地将热量施加到半导体器件，并且可以减少它们之间的接合故障。 此外，可以设置连接相邻孔的槽，用于容纳彼此相邻的部分。

公开(公告)号：US20060170090A1

公开(公告)日：2006-08-03

申请号：US11339352

申请日：2006-01-25

申请人： Yasuhiro Shinma ,  Masanori Onodera ,  Kouichi Meguro ,  Koji Taya ,  Junji Tanaka ,  Junichi Kasai

发明人： Yasuhiro Shinma ,  Masanori Onodera ,  Kouichi Meguro ,  Koji Taya ,  Junji Tanaka ,  Junichi Kasai

IPC分类号： H01L23/02

CPC分类号： H05K1/144 ,  H01L23/49827 ,  H01L23/5387 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/01004 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A stacked type semiconductor device includes semiconductor devices, interposers by which the semiconductor devices are stacked, the interposers having electrodes provided on sides thereof, and a connection substrate connecting the electrodes together. The electrodes provided on the sides of the interposers may be connected to the connection substrate by one of an electrically conductive adhesive or an anisotropically conductive film.

摘要翻译： 堆叠型半导体器件包括半导体器件，半导体器件堆叠的插入器，具有设置在其侧面上的电极的插入器以及将电极连接在一起的连接基板。 设置在插入件侧面的电极可以通过导电粘合剂或各向异性导电膜中的一种连接到连接基板。

公开(公告)号：US06517699B2

公开(公告)日：2003-02-11

申请号：US09938579

申请日：2001-08-27

申请人： Tetsuji Shimohira ,  Tatsuya Andoh ,  Junji Tanaka ,  Keigo Watanabe ,  Yasunori Nanri

发明人： Tetsuji Shimohira ,  Tatsuya Andoh ,  Junji Tanaka ,  Keigo Watanabe ,  Yasunori Nanri

IPC分类号： C25B300

CPC分类号： D21C11/0078 ,  D21C11/0057

摘要： The present invention has an object to obtain a cooking liquor containing polysulfide-sulfur at a high concentration by minimizing by-production of thiosulfate ions. The present invention is a method for producing polysulfides, which comprises introducing a solution containing sulfide ions into an anode compartment of an electrolytic cell comprising the anode compartment provided with a porous anode, a cathode compartment provided with a cathode, and a diaphragm partitioning the anode compartment and the cathode compartment, for electrolytic oxidation to obtain polysulfide ions, characterized in that the porous anode is disposed so that a space is provided at least partly between the porous anode and the diaphragm, and the apparent volume of the porous anode is from 60% to 99% based on the volume of the anode compartment.

摘要翻译： 本发明的目的是通过使硫代硫酸根离子的副产物最小化来获得含有高浓度的多硫化物 - 硫的蒸煮液。 本发明是一种多硫化物的制造方法，其特征在于，将包含硫化物离子的溶液引入到电解槽的阳极室内，所述电解槽包括设有多孔阳极的阳极室，设有阴极的阴极室和分隔阳极的隔膜 隔室和阴极室，用于电解氧化以获得多硫化物离子，其特征在于，所述多孔阳极被设置为使得至少部分地在所述多孔阳极和所述隔膜之间提供空间，并且所述多孔阳极的表观体积为60 基于阳极室的体积％至99％。

公开(公告)号：US06337838B1

公开(公告)日：2002-01-08

申请号：US09421856

申请日：1999-10-20

申请人： Hiroshi Hikima ,  Junji Tanaka

发明人： Hiroshi Hikima ,  Junji Tanaka

IPC分类号： G11B390

CPC分类号： G11B7/005

摘要： A prepit detection unit for detecting prepits in an optical recording and reproducing apparatus for recording and reproducing information on a recordable, optical record medium including preinformation such as address information in a prepit form. In the prepit detection unit, for first and second divisional RF signals output from a pickup being divided into a first divisional light reception part and a second divisional light reception part by a division line optically parallel to the tangential direction of an information track for receiving reflected light from the optical record medium, mark sections and space sections are clamped by potential correction circuits and a difference is found by a radial push-pull circuit.

摘要翻译： 一种用于在光学记录和再现装置中检测预凹坑的预凹坑检测单元，用于在可记录的光学记录介质上记录和再现信息，包括诸如预制图形的地址信息之类的预信息。 在预处理检测单元中，对于从拾取器输出的第一和第二分频RF信号，通过与用于接收反射的信息轨迹的切线方向光学平行的划分线分成第一分光接收部分和第二分光接收部分 来自光学记录介质的光，标记部分和空间部分被电位校正电路钳位，并且通过径向推挽电路发现差异。