公开(公告)号：US06331451B1

公开(公告)日：2001-12-18

申请号：US09434546

申请日：1999-11-05

申请人： James M. Fusaro ,  Robert F. Darveaux ,  Pablo Rodriguez

发明人： James M. Fusaro ,  Robert F. Darveaux ,  Pablo Rodriguez

IPC分类号： H01L2158

CPC分类号： H01L24/32 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T29/49128 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： Methods of making integrated circuit device packages and substrates for making the packages are disclosed. An embodiment of a method of making a substrate includes providing an unpatterned sheet of polyimide material having a first surface and an opposite second surface. A planar metal layer is attached to the second surface of the polyimide sheet. The metal layer is patterned to form an array of package sites, with each site including a planar die pad and planar leads. Apertures are formed through the polyimide sheet, either before or after attaching the metal layer. Each aperture is juxtaposed with a lead allowing access thereto. A method of making a package using the substrate includes mounting an integrated circuit device above the die pad (e.g., on the substrate or on the die pad through an aperture in the substrate). Bond wires are connected between the integrated circuit device and the leads through the apertures. An insulative encapsulant is applied so as to cover the integrated circuit device and fill the apertures. A method of making multiple packages includes a final step of cutting an encapsulated array of package sites with a saw to separate individual packages.

摘要翻译： 公开了制造集成电路器件封装和制造封装的衬底的方法。 制造基板的方法的实施例包括提供具有第一表面和相对的第二表面的未图案化的聚酰亚胺材料片。 平面金属层附接到聚酰亚胺片的第二表面。 将金属层图案化以形成封装位置的阵列，其中每个位置包括平面管芯焊盘和平面引线。 在安装金属层之前或之后，通过聚酰亚胺片形成孔。 每个孔与一个允许进入其的引线并置。 使用衬底制造封装的方法包括将集成电路器件安装在管芯焊盘之上（例如，在衬底上或通过衬底中的孔的芯片焊盘上）。 接合线通过孔连接在集成电路器件和引线之间。 施加绝缘密封剂以覆盖集成电路器件并填充孔。 制造多个包装的方法包括用锯切割封装位置的封装阵列以分离单独包装的最后步骤。

公开(公告)号：US06201305B1

公开(公告)日：2001-03-13

申请号：US09591705

申请日：2000-06-09

申请人： Robert F. Darveaux ,  Barry M. Miles ,  Alexander W. Copia

发明人： Robert F. Darveaux ,  Barry M. Miles ,  Alexander W. Copia

IPC分类号： H01L2348

CPC分类号： H05K1/111 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/13006 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H05K1/113 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00012

摘要： The invention discloses a method of making solder ball mounting pads on a substrate that have better ball shear performance, ball thermal cycle reliability, ball attach yield, and ball positional tolerances, than the solder ball mounting pads of the prior art. The method includes providing a sheet of material having a layer of metal thereon, and patterning the layer to define a solder ball mounting pad therein. The pad includes a central pad having at least two spokes radiating outward from it. An insulative mask is formed over the metal layer, and an opening is formed in the mask such that the central pad and an inner portion of each of the spokes is exposed therethrough, and an outer portion of each of the spokes is covered by the mask. In one embodiment, the central pad, spokes, and opening in the mask are shaped and arranged with respect to each other such that the pad and exposed portion of the spokes form a radially symmetrical pattern within the opening.

摘要翻译： 本发明公开了一种在衬底上制造焊球安装衬垫的方法，其具有比现有技术的焊球安装垫更好的球剪切性能，球热循环可靠性，​​球附着屈服和球位置公差。 该方法包括提供在其上具有金属层的材料片，并且图案化该层以在其中限定焊球安装垫。 垫包括具有从其向外辐射的至少两个辐条的中心衬垫。 在金属层上形成绝缘掩模，并且在掩模中形成开口，使得中心焊盘和每个辐条的内部暴露在其中，并且每个辐条的外部被掩模覆盖 。 在一个实施例中，掩模中的中心焊盘，辐条和开口相对于彼此成形和布置，使得焊盘和辐条的暴露部分在开口内形成径向对称的图案。

公开(公告)号：US5455446A

公开(公告)日：1995-10-03

申请号：US268368

申请日：1994-06-30

申请人： Anthony B. Suppelsa ,  Robert F. Darveaux ,  Michael L. Weiss

发明人： Anthony B. Suppelsa ,  Robert F. Darveaux ,  Michael L. Weiss

IPC分类号： H01L23/495 ,  H05K1/02 ,  H05K3/34 ,  H01L29/41 ,  H01L29/43

CPC分类号： H05K3/3426 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0271 ,  H05K2201/10689 ,  H05K2201/10909 ,  Y02P70/613

摘要： A plastic leaded semiconductor package (20) has a semiconductor device (614) encapsulated in the package and mounted to a lead frame (612). The lead frame has a plurality of leads (622) that extend beyond the body (610) of the encapsulated package. Each of the plurality of leads is made from a metal having a predetermined coefficient of thermal expansion. A second metal (627) with a different coefficient of thermal expansion is disposed on at least one portion of each of the leads.

摘要翻译： 塑料引线半导体封装（20）具有封装在封装中并安装到引线框架（612）的半导体器件（614）。 引线框架具有延伸超过封装封装体（610）的多个引线（622）。 多个引线中的每一个由具有预定热膨胀系数的金属制成。 具有不同热膨胀系数的第二金属（627）设置在每个引线的至少一部分上。

公开(公告)号：US5325265A

公开(公告)日：1994-06-28

申请号：US819571

申请日：1992-01-07

申请人： Iwona Turlik ,  Arnold Reisman ,  Deepak Nayak ,  Lih-Tyng Hwang ,  Giora Dishon ,  Scott L. Jacobs ,  Robert F. Darveaux ,  Neil M. Poley

发明人： Iwona Turlik ,  Arnold Reisman ,  Deepak Nayak ,  Lih-Tyng Hwang ,  Giora Dishon ,  Scott L. Jacobs ,  Robert F. Darveaux ,  Neil M. Poley

IPC分类号： H01L23/373 ,  H01L23/473 ,  H01L23/538 ,  H01L25/065 ,  H05K7/20

CPC分类号： H01L24/32 ,  H01L23/3736 ,  H01L23/473 ,  H01L23/5383 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/83051 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351

摘要： A high performance integrated circuit chip package includes a support substrate having conductors extending from one face to the opposite face thereof and a multilayer wiring substrate on the opposite face of the support substrate for connecting chips mounted thereon to one another and to the conductors. A heat sink includes microchannels at one face thereof, with thermally conductive cushions connecting the one face of the heat sink with the exposed back sides of the chips, to provide a high density chip package with high heat dissipation. The support substrate and heat sink may be formed of blocks of material having thermal expansion matching silicon. The cushions are a low melting point solder, preferably pure indium, and are sufficiently thick to absorb thermal stresses, but sufficiently thin to efficiently conduct heat from the chips to the heat sink.

摘要翻译： 高性能集成电路芯片封装包括：支撑基板，其具有从一个面向其相对面延伸的导体，以及在该支撑基板的相对面上的多层布线基板，用于将安装在其上的芯片彼此连接并连接至导体。 散热器包括在其一个面上的微通道，其中导热垫将散热片的一个面与芯片的暴露的背面连接起来，以提供具有高散热性的高密度芯片封装。 支撑衬底和散热器可以由具有热膨胀匹配硅的材料块形成。 垫子是低熔点焊料，优选纯铟，并且足够厚以吸收热应力，但是足够薄以有效地将热量从芯片传导到散热器。