公开(公告)号：US06201305B1

公开(公告)日：2001-03-13

申请号：US09591705

申请日：2000-06-09

申请人： Robert F. Darveaux ,  Barry M. Miles ,  Alexander W. Copia

发明人： Robert F. Darveaux ,  Barry M. Miles ,  Alexander W. Copia

IPC分类号： H01L2348

CPC分类号： H05K1/111 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/13006 ,  H01L2224/13027 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H05K1/113 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00012

摘要： The invention discloses a method of making solder ball mounting pads on a substrate that have better ball shear performance, ball thermal cycle reliability, ball attach yield, and ball positional tolerances, than the solder ball mounting pads of the prior art. The method includes providing a sheet of material having a layer of metal thereon, and patterning the layer to define a solder ball mounting pad therein. The pad includes a central pad having at least two spokes radiating outward from it. An insulative mask is formed over the metal layer, and an opening is formed in the mask such that the central pad and an inner portion of each of the spokes is exposed therethrough, and an outer portion of each of the spokes is covered by the mask. In one embodiment, the central pad, spokes, and opening in the mask are shaped and arranged with respect to each other such that the pad and exposed portion of the spokes form a radially symmetrical pattern within the opening.

摘要翻译： 本发明公开了一种在衬底上制造焊球安装衬垫的方法，其具有比现有技术的焊球安装垫更好的球剪切性能，球热循环可靠性，​​球附着屈服和球位置公差。 该方法包括提供在其上具有金属层的材料片，并且图案化该层以在其中限定焊球安装垫。 垫包括具有从其向外辐射的至少两个辐条的中心衬垫。 在金属层上形成绝缘掩模，并且在掩模中形成开口，使得中心焊盘和每个辐条的内部暴露在其中，并且每个辐条的外部被掩模覆盖 。 在一个实施例中，掩模中的中心焊盘，辐条和开口相对于彼此成形和布置，使得焊盘和辐条的暴露部分在开口内形成径向对称的图案。

公开(公告)号：US5831832A

公开(公告)日：1998-11-03

申请号：US905009

申请日：1997-08-11

申请人： Joseph G. Gillette ,  Barry M. Miles ,  Sivakumar Muthuswamy

发明人： Joseph G. Gillette ,  Barry M. Miles ,  Sivakumar Muthuswamy

IPC分类号： H01L23/13 ,  H01L23/24 ,  H05K3/34 ,  H01L27/00

CPC分类号： H01L24/16 ,  H01L23/13 ,  H01L23/24 ,  H05K3/3436 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/854 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2201/09045 ,  H05K3/3484 ,  Y02P70/613

摘要： An improved leadless semiconductor device package consists of a molded plastic carrier (30) with a plurality of C5 bumps (52) integrally molded into the bottom side of the carrier. The bumps are made of the same plastic as the carrier and are monolithic to the carrier. The C5 bumps are coated with a solderable material (50) so that they can be connected to pads on a PCB with solder paste. The top side of the plastic carrier has a metallization pattern containing a plurality of bond pads (44) that correspond to pads on the semiconductor die, and the bond pads are electrically connected to the C5 bumps by an electrically conductive structure. A semiconductor die (38) is mounted on the carrier top side and electrically connected to the plurality of bond pads, either by wire bonds (54) or by flip chip bonding. C4 bumps (70) can also be molded into the carrier for flip chip attachment.

摘要翻译： 一种改进的无引线半导体器件封装由具有整体模制在载体底部的多个C5凸块（52）的模制塑料载体（30）组成。 凸起由与载体相同的塑料制成，并且与载体成一体。 C5凸块涂覆有可焊接材料（50），使得它们可以用焊膏连接到PCB上的焊盘。 塑料载体的顶侧具有包含与半导体管芯上的焊盘相对应的多个接合焊盘（44）的金属化图案，并且接合焊盘通过导电结构电连接到C5凸块。 半导体管芯（38）通过引线接合（54）或倒装芯片接合而安装在载体顶侧并与多个接合焊盘电连接。 C4凸块（70）也可以模制成用于倒装芯片附接的载体。

公开(公告)号：US5696666A

公开(公告)日：1997-12-09

申请号：US540995

申请日：1995-10-11

申请人： Barry M. Miles ,  Glenn E. Gold

发明人： Barry M. Miles ,  Glenn E. Gold

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H05K1/18

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/3128 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165

摘要： An integrated circuit package (10) comprises a semiconductor die (12), and a substrate (14) having a through-cavity opening (22) for receiving the semiconductor die. The bottom side of the substrate has solder pads (24) arranged as a peripheral pad grid array. The semiconductor die is wire bonded (26) to the to the top side of the substrate. An encapsulant (16) seals the top surface of the semiconductor die and circuitry, and portions of the top side of the substrate. The bottom surface of the semiconductor die remains exposed to the atmosphere, eliminating moisture-related die attach delamination issues and improving heat transfer away from the semiconductor die. Furthermore, the reduced contribution of the semiconductor die to overall package height results in an ultra low profile package.

摘要翻译： 集成电路封装（10）包括半导体管芯（12）和具有用于接收半导体管芯的通孔开口（22）的衬底（14）。 衬底的底侧具有布置为外围衬垫格栅阵列的焊盘（24）。 半导体管芯与衬底的顶侧线接合（26）。 密封剂（16）密封半导体管芯和电路的顶表面以及衬底顶部的部分。 半导体芯片的底表面保持暴露于大气中，消除与水分相关的芯片附着分层问题并改善离开半导体管芯的热传递。 此外，半导体管芯对整体封装高度的贡献降低导致超薄型封装。

公开(公告)号：US5166772A

公开(公告)日：1992-11-24

申请号：US658810

申请日：1991-02-22

申请人： Keith D. Soldner ,  Frank J. Juskey ,  Bruce J. Freyman ,  Barry M. Miles

发明人： Keith D. Soldner ,  Frank J. Juskey ,  Bruce J. Freyman ,  Barry M. Miles

IPC分类号： H01L23/31 ,  H01L23/552 ,  H01L23/60

CPC分类号： H01L23/3121 ,  H01L23/552 ,  H01L23/60 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025

摘要： A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a substrate (10) having a metallization pattern (12, 13), with one portion of the metallization pattern being a circuit ground (13). A semiconductor device (16) is electrically interconnected (17) to the metallization pattern (12). A perforated metal shield or screen (18) covers the semiconductor device (16) and is electrically and mechanically attached to the metallization circuit ground (13) in order to shield the semiconductor device (16) from radio frequency energy. A resin material (14) is transfer molded about the semiconductor device, the electrical interconnections, and the metal screen to form the completed package.

摘要翻译： 提供一种屏蔽半导体封装及其制造方法。 屏蔽半导体封装包括具有金属化图案（12,13）的衬底（10），金属化图案的一部分是电路接地（13）。 半导体器件（16）与金属化图案（12）电互连（17）。 穿孔的金属屏蔽或屏蔽（18）覆盖半导体器件（16）并且电气和机械地附接到金属化电路接地（13），以便屏蔽半导体器件（16）与射频能量。 树脂材料（14）围绕半导体器件，电互连和金属屏蔽传递模制以形成完成的封装。

公开(公告)号：US5153385A

公开(公告)日：1992-10-06

申请号：US670648

申请日：1991-03-18

申请人： Frank J. Juskey ,  Lonnie L. Bernardoni ,  Thomas J. Swirbel ,  Barry M. Miles

发明人： Frank J. Juskey ,  Lonnie L. Bernardoni ,  Thomas J. Swirbel ,  Barry M. Miles

IPC分类号： B29C45/02 ,  B29L31/34 ,  H01L21/56 ,  H01L21/58 ,  H01L23/00 ,  H01L23/12 ,  H01L23/29 ,  H01L23/31 ,  H01L23/556

CPC分类号： H01L23/564 ,  H01L23/3121 ,  H01L23/556 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/8592 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01092 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  Y10S428/901

摘要： A transfer molded pad array chip carrier is formed by mounting and wirebonding a semiconductor device (12) on a printed circuit board (10). The bottom side of the printed circuit board may have an array of solderable surfaces (24). A polymer coating (18) is applied over the semiconductor device (12), the wirebonds (16), and the top side of the printed circuit board (10) and cured. The coating (18) is then sputter etched in a partial vacuum to enhance the adhesion of the transfer molding compound (20) to the printed circuit board (10). The semiconductor device is encapsulated by a transfer molding process. The polymer coating (18) also provides a barrier to alpha particle emission, improves the moisture resistance of the completed package and reduces stress at the surface of the device.

摘要翻译： 通过将半导体器件（12）安装和引线接合在印刷电路板（10）上而形成传送模压焊盘阵列芯片载体。 印刷电路板的底侧可以具有可焊接表面（24）的阵列。 将聚合物涂层（18）施加在半导体器件（12），引线键（16）和印刷电路板（10）的顶侧上并固化。 然后在部分真空中溅射蚀刻涂层（18），以增强传递模塑料（20）与印刷电路板（10）的粘合性。 半导体器件通过传递模制工艺进行封装。 聚合物涂层（18）还提供了对α粒子发射的屏障，提高了完成的封装的耐湿性，并降低了器件表面的应力。

公开(公告)号：US5134462A

公开(公告)日：1992-07-28

申请号：US728822

申请日：1991-07-09

申请人： Bruce J. Freyman ,  Barry M. Miles ,  Jill L. Flaugher

发明人： Bruce J. Freyman ,  Barry M. Miles ,  Jill L. Flaugher

IPC分类号： H01L23/10 ,  H01L23/24 ,  H01L23/498

CPC分类号： H01L23/24 ,  H01L23/10 ,  H01L23/4985 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181

摘要： A flexible film is made into a substrate (100) having metallization patterns. A semiconductor device (106) is affixed to the substrate, and the assembly is heated to expand the substrate. A cover (110) is attached to the substrate, over the device (106). Upon cooling, the substrate (100) shrinks and becomes taut and planar within the reinforced area. Alternatively, a reinforcing ring (210) can be attached to the substrate (200) either before or after attachment of the semiconductor device (206).

摘要翻译： 将柔性膜制成具有金属化图案的基板（100）。 将半导体器件（106）固定到衬底上，并且加热组件以使衬底膨胀。 覆盖物（110）在装置（106）上连接到基底。 在冷却时，衬底（100）在加强区域内收缩并且变得绷紧和平坦。 或者，可以在半导体器件（206）的附接之前或之后，将加强环（210）附接到基板（200）。

公开(公告)号：US5006673A

公开(公告)日：1991-04-09

申请号：US447349

申请日：1989-12-07

申请人： Bruce J. Freyman ,  Barry M. Miles ,  Jill L. Flaugher

发明人： Bruce J. Freyman ,  Barry M. Miles ,  Jill L. Flaugher

IPC分类号： H01L21/48 ,  H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40

CPC分类号： H01L21/486 ,  H05K1/0287 ,  H05K1/0306 ,  H05K2201/09945 ,  H05K3/0097 ,  H05K3/4053 ,  Y10T29/49155

摘要： A method of manufacturing a chip carrier from a universal ceramic substrate provides for a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes. On the first side, wire bond pads and conductors connected to the conductively filled through-holes are provided as required. Similarly, on the second side, solder pads on the conductively filled through-holes are provided as required. Finally, at least one insulating layer is provided over part of the first side for die attachment.

摘要翻译： 从通用陶瓷基板制造芯片载体的方法提供了具有第一和第二相对侧的通用陶瓷基板和导电填充的通孔阵列。 在第一面上，根据需要提供连接到导电填充通孔的导线接合焊盘和导体。 类似地，在第二面上，根据需要提供导电填充的通孔上的焊盘。 最后，在第一侧的一部分上设置至少一个绝缘层用于管芯附接。

公开(公告)号：US5721450A

公开(公告)日：1998-02-24

申请号：US489573

申请日：1995-06-12

申请人： Barry M. Miles

发明人： Barry M. Miles

IPC分类号： H01L21/60 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/02 ,  H01L23/48

CPC分类号： H01L24/85 ,  H01L23/3128 ,  H01L23/564 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/48475 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15312 ,  H01L2924/181

摘要： An integrated circuit package (10) comprises a semiconductor die (14) having a top surface and a bottom surface, and a substrate (16) for receiving the semiconductor die. The substrate should have an aperture(s) (18) below the semiconductor die for providing moisture relief during temperature excursions. An adhesive (20) applied to the substrate allows for mounting the semiconductor die to the substrate. Then, the semiconductor die is wirebonded to the substrate. Finally, an encapsulant (12) for sealing the top surface of the semiconductor die is formed over the semiconductor die and portions of the substrate.

摘要翻译： 集成电路封装（10）包括具有顶表面和底表面的半导体管芯（14）和用于接收半导体管芯的衬底（16）。 衬底应在半导体管芯下方具有一个（18）的孔口，用于在温度偏移期间提供湿气释放。 施加到基板上的粘合剂（20）允许将半导体管芯安装到基板上。 然后，半导体管芯与引线接合。 最后，在半导体管芯和衬底的部分之上形成用于密封半导体管芯的顶表面的密封剂（12）。

公开(公告)号：US5198264A

公开(公告)日：1993-03-30

申请号：US584958

申请日：1990-09-19

申请人： Leonard F. Altman ,  Jill L. Flaugher ,  Barry M. Miles

发明人： Leonard F. Altman ,  Jill L. Flaugher ,  Barry M. Miles

IPC分类号： B05D3/10 ,  H05K1/03 ,  H05K3/16 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/382 ,  B05D3/104 ,  H05K3/16 ,  B05D2505/50 ,  H05K1/0306 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/2063 ,  H05K2203/072 ,  H05K3/4644

摘要： A method of adhering a polyimide to a substrate includes first placing the substrate in a dilute acid solution. The substrate is then placed in a palladium and tin solution followed by a rinse with water. The rinsed substrate is placed in an accelerator solution to substantially remove the tin from the substrate. The palladium which remains on the substrate surface provides nucleation sites for adhesion promotion and enhanced wetting of polyimide which is applied in a liquid form as by spraying or spinning. Adhesion of polyimide to metals such as gold, ceramics, alumina or polyimide is thereby provided.

摘要翻译： 将聚酰亚胺粘附到基板的方法包括首先将基板放置在稀酸溶液中。 然后将底物置于钯和锡溶液中，然后用水冲洗。 将冲洗的基材置于促进剂溶液中以从基材中基本上除去锡。 保留在基材表面上的钯提供用于粘合促进的成核位点和增强的通过喷雾或纺丝以液体形式施加的聚酰亚胺的润湿性。 因此，提供了聚酰亚胺与金，陶瓷，氧化铝或聚酰亚胺等金属的粘附性。

公开(公告)号：US5019673A

公开(公告)日：1991-05-28

申请号：US570751

申请日：1990-08-22

申请人： Frank J. Juskey ,  Barry M. Miles ,  Marc V. Papageorge

发明人： Frank J. Juskey ,  Barry M. Miles ,  Marc V. Papageorge

IPC分类号： H01L23/28 ,  H01L21/60 ,  H01L23/12 ,  H01L23/485

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14

摘要： A flip-chip package for integrated circuits is provided by over-molding an integrated circuit assembly which includes a flip-chip mounted to a very thin chip carrier. The flip-chip includes an array of bumped pads which fill an array of matching conductive through holes on the chip carrier and securely couple thereto. The chip carrier includes an array of bumped contacts on its back surface which correspond to the bumped pads of the flip-chip. The transfer over molding of the integrated circuit assembly provides a layer of epoxy around the exposed surfaces of the flip-chip providing an environmentally protected and removable integrated circuit package.

摘要翻译： 用于集成电路的倒装芯片封装通过覆盖模制集成电路组件来提供，集成电路组件包括安装到非常薄的芯片载体上的倒装芯片。 倒装芯片包括一组凸起的焊盘，其填充芯片载体上匹配的导电通孔的阵列并且牢固地耦接到芯片载体上。 芯片载体在其后表面上包括与倒装芯片的凸起焊盘相对应的凸起触点阵列。 集成电路组件的成型转移在倒装芯片的暴露表面周围提供环氧树脂层，其提供环境保护和可移除的集成电路封装。