摘要:
Disclosed is a semiconductor device capable of stabilizing a gate voltage at high voltage and high current, protecting the device from breakdown by preventing current nonuniformity and oscillations and the like, thereby improving reliability, and a method for controlling the semiconductor device. The semiconductor device comprises an n-type base layer, a p-type emitter layer, which is formed on a surface of the n-type base layer, a collector electrode, formed on a surface of the p-type emitter layer, a p-type base layer, formed on a surface on the n-type base layer which is opposite to the p-type emitter layer, an n-type source layer, formed in a surface of the p-type base layer, an emitter electrode, formed on the n-type source layer and the p-type base layer, and a gate electrode, contacting the n-type source layer, the p-type base layer and the n-type base layer, with a gate insulating film interposed therebetween, wherein when a voltage is applied between the collector electrode and the emitter electrode, the capacitance of the gate electrode is always a positive value or zero.
摘要:
A composition comprising an organogermanium compound represented by the formula ##STR1## wherein n is an integer of 1 or more, R is hydrogen, alkyl, --COOH, --COOR', phenyl, ##STR2## and R' is a lower alkyl and a high molecular carrier, as well as an immunity adjusting agent comprising the composition. The treatment of hepatitis with compositions containing this germanium derivative.
摘要:
Fittings for connecting columns and beams of a steel frame construction, each comprising a substantially rectangular base plate to be connected to the column by means of high strength bolts and having centrally a horizontally continuous thicker portion from which the base plate is tapered toward upper and lower edges, a horizontal protrusion projecting from the thicker portion in opposition to a flange of the beam and vertical protrusion in opposition to a web of the beam and projecting from the base plate to form with the horizontal protrusion a T-shaped protrusion.
摘要:
The electroconductive composite ceramics composed of an independent phase conglomerates having a particle diameter of at least 20.mu. and a continuous phase connecting mutually the independent phase of conglomerates. Particularly, electroconductive composite ceramics composed of (A) 50-98% by weight of an independent phase of conglomerates having a particle diameter of at least 20 which consists essentially of a phase of insulating or semiconductive ceramics having a high melting point or a mixture thereof and (B) 50-2% by weight of a continuous phase of an electroconductive substance connecting mutually the independent phase of conglomerates. The electroconductive composite ceramics exhibit stable electroconductivity-temperature characteristics at a temperature of 1000.degree. C. or higher and have excellent thermal shock resistance, mechanical strength and chemical resistance.
摘要:
A semiconductor device comprises a first base layer of a first conductivity type; a plurality of second base layers of a second conductivity type, provided on a part of a first surface of the first base layer; trenches formed on each side of the second base layers, and formed to be deeper than the second base layers; an emitter layer formed along the trench on a surface of the second base layers; a collector layer of the second conductivity type, provided on a second surface of the first base layer opposite to the first surface; an insulating film formed on an inner wall of the trench, the insulating film being thicker on a bottom of the trench than on a side surface of the trench; a gate electrode formed within the trench, and isolated from the second base layers and the emitter layer by the insulating film; and a space section provided between the second base layers adjacent to each other, the space section being deeper than the second base layers and being electrically isolated from the emitter layer and the second base layers.
摘要:
This disclosure concerns a semiconductor device that includes a first base layer; second base layers provided on a part of a first surface of the first base layer; trenches formed on each side of the second base layers; an emitter layer formed on a surface of the second base layers; a collector layer provided below a second surface of the first base layer, an insulating film formed on an inner wall of the trench, the insulating film being thicker on a bottom of the trench than on a side surface of the trench; a gate electrode formed within the trench, and isolated by the insulating film; and a space section provided between the second base layers adjacent to each other, the space section being electrically isolated from the emitter layer and the second base layers, wherein the space section includes a semiconductor layer being deeper than the second base layers.
摘要:
A semiconductor device includes a base layer of a first conductivity type, a barrier layer of a first conductivity type formed on the base layer, a trench formed from the surface of the barrier layer to such a depth as to reach a region in the vicinity of an interface between the barrier layer and the base layer, a gate electrode formed in the trench via a gate insulating film, a contact layer of a second conductivity type selectively formed in a surface portion of the barrier layer, a source layer of the first conductivity type selectively formed in the surface portion of the barrier layer so as to contact the contact layer and a side wall of the gate insulating film in the trench, and a first main electrode formed so as to contact the contact layer and the source layer.
摘要:
A power semiconductor device according to the present invention comprises: a first conductive type base layer; a second conductive type base layer selectively formed on the first conductive type base layer; an insulation layer formed in the region on the first conductive type base layer on which the second conductive type base layer is not formed; a gate insulation film formed on the inner surface of a trench formed between the second conductive type base layer and the insulation layer so as to separate them from each other and to reach the first conductive type base layer from the surface of the second conductive type base layer; a first conductive type source layer selectively formed on the surface of the second conductive type base layer in contact with the gate insulation film; a gate electrode formed in the trench and insulated from the first conductive type base layer, the second conductive type base layer, and the first conductive type source layer by the gate insulation film; a main electrode electrically connected to the first conductive type base layer and the second conductive type base layer; and a first conductive type or second conductive type floating layer formed on the bottom of the insulation layer.
摘要:
A power semiconductor device includes trenches disposed in a first base layer of a first conductivity type at intervals to partition main and dummy cells, at a position remote from a collector layer of a second conductivity type. In the main cell, a second base layer of the second conductivity type, and an emitter layer of the first conductivity type are disposed. In the dummy cell, a buffer layer of the second conductivity type is disposed. A gate electrode is disposed, through a gate insulating film, in a trench adjacent to the main cell. A buffer resistor having an infinitely large resistance value is inserted between the buffer layer and emitter electrode. The dummy cell is provided with an inhibiting structure to reduce carriers of the second conductivity type to flow to and accumulate in the buffer layer from the collector layer.
摘要:
It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered. The high-frequency module according to the present invention includes a main module including a first high-frequency circuit at least a part of which is constituted by a conductive pattern built in a multi-layered substrate and a sub-module including a second high-frequency circuit, and the sub-module is inserted into a cavity formed in the main module. According to the present invention, the main module including the first high-frequency circuit and the sub-module including the second high-frequency circuit are constituted as separate components and the main module and the sub-module are integrated by inserting the sub-module into the cavity formed in the main module. Therefore, it is possible to use only a main module and sub-module that have been inspected after manufacture and found to be non-defective. Accordingly, it is possible to markedly increase the yield of the high-frequency module as a whole.