公开(公告)号：US20120319259A1

公开(公告)日：2012-12-20

申请号：US13235176

申请日：2011-09-16

申请人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

发明人： Kwang Soo Kim ,  Ji Hyun Park ,  Young Ki Lee ,  Seog Moon Choi

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L24/43 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：布置成彼此面对的第一和第二引线框架，第一和第二框架中的任一个或第二框架由铝制成; 阳极氧化层形成在第一和第二引线框架中由铝制成的引线框架的部分上; 以及安装在第一和第二引线框架的第一表面上的半导体器件。

公开(公告)号：US09105611B2

公开(公告)日：2015-08-11

申请号：US13610671

申请日：2012-09-11

申请人： Kwang Soo Kim ,  Yong Hoon Kwak ,  Sun Woo Yun ,  Young Ki Lee ,  Kyu Hwan Oh ,  Jin Suk Son

发明人： Kwang Soo Kim ,  Yong Hoon Kwak ,  Sun Woo Yun ,  Young Ki Lee ,  Kyu Hwan Oh ,  Jin Suk Son

IPC分类号： H01L23/495 ,  H01L23/433

CPC分类号： H01L23/4334 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49575 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed herein is a power module package including: a substrate having a ceramic layer formed in one surface thereof; a circuit pattern formed on the ceramic layer; a first lead frame having one side contacting the circuit pattern and the other side protruding toward the outside; and a first semiconductor chip mounted on one side of the first lead frame.

摘要翻译： 本文公开了一种功率模块封装，包括：具有在其一个表面中形成的陶瓷层的基板; 形成在陶瓷层上的电路图案; 第一引线框架，其一侧接触电路图案，另一侧向外突出; 以及安装在所述第一引线框架的一侧上的第一半导体芯片。

公开(公告)号：US08792239B2

公开(公告)日：2014-07-29

申请号：US13280866

申请日：2011-10-25

申请人： Jin Suk Son ,  Kwang Soo Kim ,  Young Ki Lee ,  Sun Woo Yun ,  Sung Keun Park

发明人： Jin Suk Son ,  Kwang Soo Kim ,  Young Ki Lee ,  Sun Woo Yun ,  Sung Keun Park

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：由金属材料制成的基底; 形成为允许冷却材料在基底基板的内部部分流动的冷却通道; 阳极化层，形成在所述基底基板的外表面上; 金属层，其形成在具有阳极氧化层的基底基板的第一表面上，并且包括电路和连接焊盘; 以及安装在金属层上的半导体器件。

公开(公告)号：US08729692B2

公开(公告)日：2014-05-20

申请号：US13353128

申请日：2012-01-18

申请人： Kwang Soo Kim ,  Young Hoon Kwak ,  Young Ki Lee

发明人： Kwang Soo Kim ,  Young Hoon Kwak ,  Young Ki Lee

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/473 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path.

摘要翻译： 本文公开了一种功率模块封装，包括：第一散热板，包括顺序地形成的第一流路，第二流路和第三流路，第一流路和第三流路形成为具有台阶 之间; 以及形成在所述第一散热板下方的第二散热板，具有一个面和另一个面，在其一个面上形成有半导体器件安装槽，并且包括第四流路，其一端连接到所述第二流路 并且另一端连接到第三流动路径，其中通过第一流动路径引入的冷却材料基于第二流动路径分配到第三流动路径和第四流动路径。

公开(公告)号：US20130233599A1

公开(公告)日：2013-09-12

申请号：US13484188

申请日：2012-05-30

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Bum Seok Suh

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Bum Seok Suh

IPC分类号： H05K1/05

CPC分类号： H01L23/3735 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a substrate for a power module. The substrate may include a metal base substrate, an insulating layer formed on the metal base substrate and including a plurality of insulating adhesion layers and a ceramic filler layer formed on a joining interface between the plurality of insulating adhesion layers, and a circuit layer formed on the insulating layer.

摘要翻译： 本文公开了一种用于功率模块的基板。 基板可以包括金属基底基板，形成在金属基底基板上的绝缘层，并且包括多个绝缘粘合层和形成在多个绝缘粘合层之间的接合界面上的陶瓷填充层，以及形成在 绝缘层。

公开(公告)号：US20130062743A1

公开(公告)日：2013-03-14

申请号：US13304230

申请日：2011-11-23

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Young Hoon Kwak

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Young Hoon Kwak

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/473 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L25/071 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/40227 ,  H01L2224/48227 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a heat dissipation plate including a first heat dissipation plate and a second heat dissipation plate disposed to be spaced apart from each other; insulating layers formed on the heat dissipation plate; metal layers formed on the insulating layers, semiconductor devices mounted on the metal layers; and lead spacers formed to connect the metal layer of the first heat dissipation plate side or the metal layer of the second heat dissipation plate side with the semiconductor layers, wherein the semiconductor devices formed on the metal layers of the first heat dissipation plate side and the semiconductor devices formed on the metal layer of the second heat dissipation plate side are disposed in a multi-layered type.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：散热板，包括第一散热板和设置成彼此间隔开的第二散热板; 形成在散热板上的绝缘层; 形成在绝缘层上的金属层，安装在金属层上的半导体器件; 以及将所述第一散热板侧的金属层或所述第二散热板侧的金属层与所述半导体层连接的引线间隔件，其中，形成在所述第一散热板侧的所述金属层和 形成在第二散热板侧的金属层上的半导体器件设置为多层型。

公开(公告)号：US20120319260A1

公开(公告)日：2012-12-20

申请号：US13484160

申请日：2012-05-30

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

摘要翻译： 本文公开了一种功率模块封装，包括：第一衬底，其上安装有第一半导体芯片; 以及具有安装在其上的第二半导体芯片的第二基板，所述第二基板与所述第一基板结合，使得其厚度方向的侧表面设置在所述第一基板的上表面上。

公开(公告)号：US09034916B2

公开(公告)日：2015-05-19

申请号：US14009526

申请日：2011-11-28

申请人： Won Gon Kim ,  Baek Soo Han ,  Kyoung Shim Kim ,  Kwang Soo Kim ,  Young Mi Kang ,  Yu Jin Kim ,  Chun Hyung Kim ,  Mi Jin Sohn ,  Hoe Yune Jung

发明人： Won Gon Kim ,  Baek Soo Han ,  Kyoung Shim Kim ,  Kwang Soo Kim ,  Young Mi Kang ,  Yu Jin Kim ,  Chun Hyung Kim ,  Mi Jin Sohn ,  Hoe Yune Jung

IPC分类号： A01N43/02 ,  A61K31/335 ,  A01N43/08 ,  A61K31/34 ,  A01N37/00 ,  A61K31/21 ,  A01N31/14 ,  A61K31/075 ,  A01N31/00 ,  A61K31/045 ,  A61K31/357 ,  A61K36/83

CPC分类号： A61K31/357 ,  A61K36/83

摘要： The present invention relates to: a pharmaceutical composition or a Nurr1 activating composition for the prevention or treatment of a neurodegenerative disease or a disease induced by impaired Nurr1 function, wherein the composition comprises an active ingredient in the form of genkwanin N or yuanhuacine, a Daphne genkwa extract comprising one or more of the above compounds, or a fraction thereof; or a functional food additive for preventing or alleviating a neurodegenerative disease or a disease induced by impaired Nurr1 function, wherein the additive comprises genkwanin N or yuanhuacine, a Daphne genkwa extract comprising one or more of the above compounds, or a fraction thereof; and a method for the prevention or treatment of a neurodegenerative disease or a disease induced by impaired Nurr1 function, wherein the method comprises the step of administering the pharmaceutical composition.

摘要翻译： 本发明涉及：用于预防或治疗神经退行性疾病或由Nurr1功能受损引起的疾病的药物组合物或Nurr1活化组合物，其中所述组合物包含以genkwanin N或元花胺形式的活性成分，达芙妮 genkwa提取物包含一种或多种上述化合物或其一部分; 或用于预防或减轻神经退行性疾病或由Nurr1功能受损引起的疾病的功能性食品添加剂，其中所述添加剂包括genkwanin N或元华辛，包含一种或多种上述化合物的Daphne genkwa提取物或其一部分; 以及用于预防或治疗由Nurr1功能受损引起的神经变性疾病或疾病的方法，其中所述方法包括施用所述药物组合物的步骤。

公开(公告)号：US08785810B2

公开(公告)日：2014-07-22

申请号：US13279716

申请日：2011-10-24

申请人： Jeong Woo Hyun ,  Jung Sub Lee ,  Sung Jin Lee ,  Sang Kyu Lim ,  Kwang Soo Kim ,  Jae Kwang Lee

发明人： Jeong Woo Hyun ,  Jung Sub Lee ,  Sung Jin Lee ,  Sang Kyu Lim ,  Kwang Soo Kim ,  Jae Kwang Lee

IPC分类号： B23K26/02 ,  B23K26/08 ,  G02B7/02

CPC分类号： B23K26/02 ,  B23K26/0648 ,  B23K26/08 ,  B23K26/082 ,  G02B7/02 ,  G02F1/1303 ,  G02F1/1309

摘要： According to example embodiments, a laser optical system includes a laser generator, at least one scan module, an objective lens, a relay lens, a review optical system, and a control device. The laser generator is configured to generate a laser beam. The at least one scan module is configured to reflect the laser beam generated by the laser generator and to direct the laser beam in different directions. The objective lens is configured to focus the laser beam on a substrate. The relay lens is configured to guide the laser beam scanned by the at least one scan module to within an incident range of the objective lens. The review optical system is configured to monitor, in real time, repair of the substrate using the laser beam. The control device is configured to control the at least one scan module.

摘要翻译： 根据示例实施例，激光光学系统包括激光发生器，至少一个扫描模块，物镜，中继透镜，复查光学系统和控制装置。 激光发生器被配置为产生激光束。 所述至少一个扫描模块被配置为反射由激光发生器产生的激光束并且将激光束引向不同的方向。 物镜配置成将激光束聚焦在基板上。 中继透镜被配置为将由至少一个扫描模块扫描的激光束引导到物镜的入射范围内。 检查光学系统被配置为实时地监视使用激光束修复衬底。 所述控制装置被配置为控制所述至少一个扫描模块。

公开(公告)号：US08616755B2

公开(公告)日：2013-12-31

申请号：US13233834

申请日：2011-09-15

申请人： Sang Pil Kim ,  Chang Ik Hwang ,  Hee Cheong Lee ,  Sang Hoon Lee ,  Jun Sang Park ,  Kwang Soo Kim

发明人： Sang Pil Kim ,  Chang Ik Hwang ,  Hee Cheong Lee ,  Sang Hoon Lee ,  Jun Sang Park ,  Kwang Soo Kim

IPC分类号： F21V7/04

CPC分类号： G02B6/0061 ,  G02B5/0231 ,  G02B6/0036 ,  G02B6/0038 ,  G02F1/133615

摘要： A light guide plate for a surface light source device is provided, which includes an incident surface configured to have light from lamps disposed along a predetermined axis, be incident thereon, an emitting surface configured to have the incident light emitted therefrom, a back surface configured to face the emitting surface, and a plurality of unit cells configured to have microprism patterns engraved thereon and distributed and arranged on the back surface. A crossing angle of a microprism arrangement axis, formed by a ridge direction of the microprism patterns, and of an arrangement axis of the lamps is disposed in an alternate angle. The light guide plate has a high front brightness and an excellent uniformity in brightness and does not have a moire phenomenon. In a backlight unit, the use of optical sheets stacked on the light guide plate can be reduced.

摘要翻译： 提供了一种面光源装置用导光板，其包括配置成具有沿着预定轴设置的灯的入射面的入射面入射在其上的入射面，被配置为具有从其射出的入射光的发射面， 面对发光面，多个单元电池被配置为具有刻在其上的微棱镜图案并且分布并布置在背面上。 通过微棱镜图案的脊方向形成的微棱镜排列轴线和灯的排列轴线的交叉角以交替的角度设置。 导光板具有高的正面亮度和优异的亮度均匀性，并且不具有莫尔条纹现象。 在背光单元中，可以减少层叠在导光板上的光学片的使用。