公开(公告)号：US20170373455A1

公开(公告)日：2017-12-28

申请号：US15631503

申请日：2017-06-23

Applicant: NICHIA CORPORATION

Inventor： Naoto MORIZUMI ,  Akinori YONEDA

IPC: H01S3/02 ,  H01S3/05

CPC classification number: H01S3/02 ,  H01S3/05 ,  H01S5/005 ,  H01S5/02212 ,  H01S5/02296 ,  H01S5/32341

Abstract: A light emitting device includes a base member, a laser element, a retaining member, a fluorescent member, and first and second fixing members. The retaining member has a first surface on a laser element side and a second surface not on the laser element side. The fluorescent member is fixed to a through hole of the retaining member. The first and second fixing members clamp the retaining member. The first and second fixing members have first and second contact surfaces in contact with the first and second surfaces of the retaining member, respectively. A distance between the first and second contact surfaces becomes smaller as the first and second contact surfaces become farther from the through hole. The retaining member, the first and second fixing members are arranged such that a space surrounded by the retaining member, and the first and second fixing members exists around the retaining member.

公开(公告)号：US20170301844A1

公开(公告)日：2017-10-19

申请号：US15641231

申请日：2017-07-04

Applicant: NICHIA CORPORATION

Inventor： Akinori YONEDA ,  Yoshiyuki AIHARA ,  Shinji NAKAMURA

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/54 ,  H01L2224/94 ,  H01L2933/0033

Abstract: A manufacturing method of a light emitting device includes preparing a wafer that is provided by arranging a plurality of semiconductor light emitting elements including semiconductor stacks and electrodes provided on first surfaces of the semiconductor stacks. A metal wire is wired in an arc shape between the electrodes of the plurality of semiconductor light emitting elements that are arranged in one direction on the wafer so as to connect each of the electrodes and the metal wire. A resin layer is provided on a side of the first surfaces of the semiconductor stacks in such a way that the metal wire is accommodated inside the resin layer. The wafer is cut along a boundary line to segment the plurality of semiconductor light emitting elements so as to singulate the plurality of semiconductor light emitting elements.

公开(公告)号：US20170062686A1

公开(公告)日：2017-03-02

申请号：US15350979

申请日：2016-11-14

Applicant: NICHIA CORPORATION

Inventor： Akinori YONEDA ,  Hirofumi KAWAGUCHI ,  Kouichiroh DEGUCHI

IPC: H01L33/62 ,  H01L33/44 ,  H01L33/38 ,  H01L33/40 ,  H01L33/06 ,  H01L33/32

Abstract: A manufacturing method of a flip-chip nitride semiconductor light emitting element includes a step of providing a nitride semiconductor light emitting element structure; a protective layer forming step; a first resist pattern forming step; a protective layer etching step; a first metal layer forming step; a first resist pattern removing step; a third metal layer forming step; a second resist pattern forming step; a second metal layer forming step; a second resist pattern removing step; and a third metal layer removing step.

Abstract translation: 倒装芯片氮化物半导体发光元件的制造方法包括：提供氮化物半导体发光元件结构的工序; 保护层形成步骤; 第一抗蚀图案形成步骤; 保护层蚀刻步骤; 第一金属层形成步骤; 第一抗蚀剂图案去除步骤; 第三金属层形成步骤; 第二抗蚀图案形成步骤; 第二金属层形成步骤; 第二抗蚀剂图案去除步骤; 和第三金属层去除步骤。

公开(公告)号：US20160276562A1

公开(公告)日：2016-09-22

申请号：US15169066

申请日：2016-05-31

Applicant: Nichia Corporation

Inventor： Akinori YONEDA ,  Yoshiyuki AIHARA

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/54 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/38 ,  H01L33/486 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/4813 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A light emitting device is constituted with a semiconductor light emitting element on which a support member is disposed on one surface provided with a p-side electrode and an n-side electrode and a fluorescent material layer is disposed on the other surface which is an opposite side of the one surface. The support member includes a resin layer, an electrode for p-side external connection and an electrode for n-side external connection disposed exposed at a surface opposite side of a surface where the resin layer is in touch with a light emitting element, and internal wirings disposed in the resin layer and electrically connecting between a p-side electrode and the electrode for p-side external connection respectively. The internal wirings include a metal wire and a metal plated layer, and a metal wire and a metal plated layer respectively connected in series.

Abstract translation: 发光装置由在其上设置有p侧电极和n侧电极的一个表面上设置有支撑构件的半导体发光元件构成，并且荧光材料层设置在相反的另一个表面上 一面。 支撑构件包括树脂层，用于p侧外部连接的电极和用于n侧外部连接的电极，暴露在树脂层与发光元件接触的表面的相反侧的表面处，以及内部 布线设置在树脂层中，分别电连接p侧电极和p侧外部电极用电极。 内部布线包括金属线和金属镀层，以及分别串联连接的金属线和金属镀层。

公开(公告)号：US20150187995A1

公开(公告)日：2015-07-02

申请号：US14581639

申请日：2014-12-23

Applicant: Nichia Corporation

Inventor： Akinori YONEDA ,  Yoshiyuki AIHARA

IPC: H01L33/38 ,  H01L33/54 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L33/0095 ,  H01L33/38 ,  H01L33/486 ,  H01L33/507 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/4813 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A light emitting device is constituted with a semiconductor light emitting element on which a support member is disposed on one surface provided with a p-side electrode and an n-side electrode and a fluorescent material layer is disposed on the other surface which is an opposite side of the one surface. The support member includes a resin layer, an electrode for p-side external connection and an electrode for n-side external connection disposed exposed at a surface opposite side of a surface where the resin layer is in touch with a light emitting element, and internal wirings disposed in the resin layer and electrically connecting between a p-side electrode and the electrode for p-side external connection respectively. The internal wirings include a metal wire and a metal plated layer, and a metal wire and a metal plated layer respectively connected in series.

Abstract translation: 发光装置由在其上设置有p侧电极和n侧电极的一个表面上设置有支撑构件的半导体发光元件构成，并且荧光材料层设置在相反的另一个表面上 一面。 支撑构件包括树脂层，用于p侧外部连接的电极和用于n侧外部连接的电极，暴露在树脂层与发光元件接触的表面的相反侧的表面处，以及内部 布线设置在树脂层中，分别电连接p侧电极和p侧外部电极用电极。 内部布线包括金属线和金属镀层，以及分别串联连接的金属线和金属镀层。

公开(公告)号：US20140027804A1

公开(公告)日：2014-01-30

申请号：US13953288

申请日：2013-07-29

Applicant: Nichia Corporation

Inventor： Akinori YONEDA ,  Shinji Nakamura ,  Yoshiyuki Aihara ,  Hirokazu Sasa

IPC: H01L33/58 ,  H01L33/46

CPC classification number: H01L33/507 ,  H01L24/18 ,  H01L33/38 ,  H01L33/46 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/12041 ,  H01L2924/15788 ,  H01L2933/005 ,  H01L2924/00

Abstract: To provide a method of manufacturing at low cost a light emitting device that converts the wavelength of light radiated by a light emitting element and emits, the method includes: forming a phosphor layer on a translucent substrate; arranging a plurality of light emitting elements with a predetermined spacing, the light emitting elements having an electrode formed face provided with positive and negative electrodes respectively and arranged with the electrode formed faces on the top; embedding a resin containing phosphor particles so that an upper face of the embedded resin does not bulge over a plane containing the electrode formed faces; and curing the resin, and then cutting and dividing the cured resin, the phosphor layer and the translucent substrate into a plurality of light emitting devices each including one or more of the light emitting elements.

Abstract translation: 为了提供低成本地制造发光装置的方法，该发光装置转换由发光元件辐射的光的波长并发射，所述方法包括：在透光性基板上形成荧光体层; 以规定的间隔配置多个发光元件，所述发光元件具有分别设置有正极和负极的电极形成面，并且将电极形成面布置在顶部; 包埋含有荧光体颗粒的树脂，使得嵌入树脂的上表面不会在包含电极形成面的平面上凸出; 并固化树脂，然后将固化树脂，荧光体层和透光性基板切割分割成多个发光器件，每个发光器件包括一个或多个发光元件。