公开(公告)号：US11757078B2

公开(公告)日：2023-09-12

申请号：US17398860

申请日：2021-08-10

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a package in which a recess is defined; a light emitting element mounted on a bottom surface defining the recess; a first reflecting layer covering lateral surfaces defining the recess; and a second reflecting layer covering the bottom surface defining the recess, wherein the second reflecting layer is in contact with the first reflecting layer, wherein at least a portion of lateral surfaces of the light emitting element is exposed from the second reflecting layer.

公开(公告)号：US11362248B2

公开(公告)日：2022-06-14

申请号：US16928233

申请日：2020-07-14

Applicant: NICHIA CORPORATION

Inventor： Atsushi Kojima ,  Kenji Ozeki ,  Chinami Nakai

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/56 ,  H01L33/60 ,  H01L33/48

Abstract: A method of manufacturing a light-emitting device includes: providing a wiring board that includes: a substrate, and a wiring pattern comprising: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which a light-emitting element is to be mounted, and a plating layer having a groove that surrounds the first region; mounting the light-emitting element in the first region; supplying a first resin that contains a first reflective material into the groove; forming a first covering member, at least a portion of which is located in the groove and comprises: a reflective material containing layer containing the first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and forming a light-transmissive member on the first covering member and the light-emitting element.

公开(公告)号：US10910515B2

公开(公告)日：2021-02-02

申请号：US16666698

申请日：2019-10-29

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Chinami Nakai

IPC: H01L33/00 ,  H01L33/56 ,  H01L51/56 ,  H01L25/13 ,  H01L23/31

Abstract: A method of manufacturing a light-emitting device includes providing a package having an upper surface and defining a recess, the recess having an opening at the upper surface. A light-emitting element is placed on a bottom surface of the recess of the package, and the recess of the package is filled with an uncured sealing member containing a silicone resin. The package is held in a liquid in a state in which the uncured sealing member is filled in the recess of the package, and the uncured sealing member is cured by heating the package in which the uncured sealing member is filled in the recess.

公开(公告)号：US10424705B2

公开(公告)日：2019-09-24

申请号：US15800072

申请日：2017-11-01

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Shimpei Maeda

IPC: H01L33/00 ,  H01L33/60 ,  H01L25/075 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62 ,  H01L33/54

Abstract: A light emitting device includes a light emitting element, a first light transmissive member, and a second light transmissive member. A first lower face of the first light transmissive member is bonded to a light extraction face of the light emitting element and has a first lower face perimeter positioned outside of a light extraction face perimeter of the light extraction face when viewed in a height direction of the light emitting device. A second lower face of the second light transmissive member has a second lower face perimeter that coincides with or is inside of the first upper face perimeter when viewed in the height direction. A second upper face of the second light transmissive member is positioned inside of the first upper face perimeter when viewed in the height direction.

公开(公告)号：US10186633B2

公开(公告)日：2019-01-22

申请号：US15683238

申请日：2017-08-22

Applicant: NICHIA CORPORATION

Inventor： Satoshi Shichijo ,  Kunihito Sugimoto ,  Kenji Ozeki ,  Shogo Abe

IPC: H01L33/20 ,  H01L33/60 ,  H01L33/50 ,  H01L25/075 ,  H01L25/16 ,  H01L33/54 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device includes: forming a light-transmissive member that is substantially rectangular in a plan view to cover an upper surface of a light emitting element mounted on a base member; and forming a frame body so as to surround the light-transmissive member, wherein, in the step of forming the frame body, the frame body is formed such that a distance from an upper surface of the base member to an upper end of the frame body is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member.

公开(公告)号：US10141491B2

公开(公告)日：2018-11-27

申请号：US15450571

申请日：2017-03-06

Applicant: NICHIA CORPORATION

Inventor： Tomonori Miyoshi ,  Kenji Ozeki

IPC: H01L33/58 ,  H01L33/64 ,  H01L33/08 ,  H01L33/48 ,  H01L33/60 ,  H01L25/075 ,  H01L23/00 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: A method of manufacturing a light emitting device includes: providing an undivided base having a first main surface and a second main surface on the opposite side from the first main surface, the undivided base having conductive patterns disposed on the first main surface and conductive patterns disposed on the second main surface; mounting a plurality of light emitting elements on the conductive patterns on the first main surface; forming a light reflecting member that integrally covers side surfaces of the light emitting elements and the first main surface of the undivided base; and, after the forming of the light reflecting member, forming at least one groove on the second main surface of the undivided base at a position corresponding to a space between the light emitting elements so that the groove reaches the first main surface and the undivided base is divided into a plurality of base members.

公开(公告)号：US09379294B2

公开(公告)日：2016-06-28

申请号：US14582323

申请日：2014-12-24

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Tomonori Miyoshi

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/48 ,  H01L33/60 ,  H01L33/58

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L33/507 ,  H01L33/508 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00012

Abstract: A light emitting device includes a substrate, a light emitting element mounted on the substrate, a light transmissive member placed on an upper surface of the light emitting element, and a sealing member which seals the light emitting element and the light transmissive member. The light transmissive member is a plate-shaped member not containing a phosphor and is larger than the light emitting element when viewed from above. The sealing member includes a first sealing member which is formed of a light reflecting member for reflecting light emitted from the light emitting element and covers side surfaces of the light emitting element, and a second sealing member which contains a phosphor for converting the light emitted from the light emitting element into light having wavelength different from wavelength of the light emitted from the light emitting element and covers at least an upper surface of the light transmissive member.

公开(公告)号：US09276181B2

公开(公告)日：2016-03-01

申请号：US14731290

申请日：2015-06-04

Applicant: Nichia Corporation

Inventor： Tomonori Miyoshi ,  Kenji Ozeki ,  Tomoaki Tsuruha

IPC: H01L33/62 ,  H01L33/54 ,  H01L27/15 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L25/075 ,  H01L25/16

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/483 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/16

Abstract: A light emitting apparatus includes an electrically insulating base member having a longitudinal direction; a pair of electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the pair of electrically conductive pattern portions; and a resin portion that surrounds at least a side surface of the at least one light emitting device with at least an upper surface of the at least one light emitting device being exposed from the resin portion and partially covers the pair of electrically conductive pattern portions. Each of the pair of electrically conductive pattern portions extends toward a periphery of the base member from resin-covered parts of the electrically conductive pattern portions. Each of the electrically conductive pattern portions forms a narrower area and a wider area in the longitudinal direction.

Abstract translation: 发光装置包括具有纵向方向的电绝缘基底构件; 形成在所述基底构件的上表面上的一对导电图案部分; 至少一个电连接到所述一对导电图案部分的发光器件; 以及树脂部分，其至少围绕所述至少一个发光器件的侧表面，所述至少一个发光器件的至少一个上表面从所述树脂部分露出并且部分地覆盖所述一对导电图案部分。 一对导电图案部分中的每一个从导电图案部分的树脂覆盖部分向基部构件的周边延伸。 每个导电图案部分在纵向上形成较窄的区域和更宽的区域。

公开(公告)号：US12119434B2

公开(公告)日：2024-10-15

申请号：US18358657

申请日：2023-07-25

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/507 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a package having an upper surface defining a recess; a light emitting element and a protection device respectively disposed on a bottom surface of the recess; a first reflecting layer covering a lateral surface of the recess; and a second reflecting layer covering the bottom surface of the recess. The first reflecting layer is apart from the light emitting element and covers the protection device. The second reflecting layer contacts with a lower portion of a lateral surface of the light emitting element. An upper surface of the light emitting element and an upper portion of the lateral surface of the light emitting element are exposed from the second reflecting layer.

公开(公告)号：US12080835B2

公开(公告)日：2024-09-03

申请号：US18174703

申请日：2023-02-27

Applicant: NICHIA CORPORATION

Inventor： Kenji Ozeki ,  Atsushi Kojima ,  Chinami Nakai

IPC: H01L33/60 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L29/866 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.