公开(公告)号：US20190206847A1

公开(公告)日：2019-07-04

申请号：US16292151

申请日：2019-03-04

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/502 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0091

Abstract: A light emitting device includes: a first light emitting element configured to emit light of a first peak wavelength; a second light emitting element configured to emit light of a second peak wavelength that is different from the first peak wavelength; a first light reflecting member disposed in contact with at least one lateral surface of the first light emitting element, the first light reflecting member having an upper surface from which an upper surface of the first light emitting element is exposed; a wavelength conversion member covering the upper surface of the first light emitting element; and a second light reflecting member disposed on the upper surface of the first light reflecting member, the second light reflecting member being located between the second light emitting element and the wavelength conversion member in a plan view.

公开(公告)号：US20190067536A1

公开(公告)日：2019-02-28

申请号：US16112143

申请日：2018-08-24

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA ,  Nami ABE

IPC: H01L33/50 ,  H01L33/38 ,  H01L33/52 ,  H01L33/62 ,  H01L33/60 ,  H01L25/075

Abstract: A light-emitting device includes a plurality of light-emitting elements, a plurality of light-transmissive members, and a covering member. The light-emitting elements each has a light-extracting surface. The light-emitting elements each includes a layered structure including a semiconductor layer, and a plurality of electrodes connected to the layered structure. The light-transmissive members each has a lower surface facing the light-extracting surface of at least one of the light-emitting elements, and an upper surface opposite to the lower surface and having an area smaller than an area of the lower surface. The upper surface of each of the light transmissive members collectively constitutes a light-emitting part having an outermost periphery with a square shape or a circular shape. The covering member integrally covers lateral surfaces of the light-emitting elements and lateral surfaces of the light-transmissive members.

公开(公告)号：US20180130935A1

公开(公告)日：2018-05-10

申请号：US15805917

申请日：2017-11-07

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA ,  Masatsugu ICHIKAWA

IPC: H01L33/64 ,  H01L25/075 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00014

Abstract: A method of manufacturing a semiconductor device includes disposing a substrate metal film on an upper surface of a substrate made of a metal; disposing a first element metal film on a lower surface of a first element; disposing a second element metal film on a lower surface of a second element; bonding the first element and the second element to the substrate so that an upper surface of the substrate metal film is in contact with a lower surface of the first element metal film and a lower surface of the second element metal film; oxidizing at least a portion of a region of the upper surface of the substrate metal film other than regions in contact with the first element metal film and the second element metal film; and disposing a wiring electrically connecting the first element and the second element, across and above the region oxidized.

公开(公告)号：US20180130776A1

公开(公告)日：2018-05-10

申请号：US15806192

申请日：2017-11-07

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA

IPC: H01L25/075 ,  H01L33/60 ,  H01L33/54 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/502 ,  H01L33/508 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0091

Abstract: A light emitting device includes: a first light emitting element configured to emit light of a first peak wavelength; a second light emitting element configured to emit light of a second peak wavelength that is different from the first peak wavelength; a first light reflecting member disposed in contact with at least one lateral surface of the first light emitting element, the first light reflecting member having an upper surface from which an upper surface of the first light emitting element is exposed; a wavelength conversion member covering the upper surface of the first light emitting element; and a second light reflecting member disposed on the upper surface of the first light reflecting member, the second light reflecting member being located between the second light emitting element and the wavelength conversion member in a plan view.

公开(公告)号：US20170179355A1

公开(公告)日：2017-06-22

申请号：US15385581

申请日：2016-12-20

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA

IPC: H01L33/62 ,  H01L33/48 ,  H01R24/66

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01R24/66 ,  H01R2103/00 ,  H01L2924/00014

Abstract: A light-emitting device includes a support having a primary surface; a power supply connector located on the primary surface of the support and including one or more wire pads; a light-emitting element located on the primary surface of the support; one or more wires connecting the light-emitting element and the wire pads; and a cover member located on the primary surface of the support and covering the light-emitting element and the wire pads.

公开(公告)号：US20150280052A1

公开(公告)日：2015-10-01

申请号：US14671099

申请日：2015-03-27

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA

IPC: H01L33/00

CPC classification number: H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A manufacturing method for a light emitting device can include providing a bonding layer over a base, and disposing a shim plate with an opening over the bonding layer. A light emitting body is disposed over the bonding layer exposed from the opening of the shim plate. A lens is formed by approaching a die having a concave portion at its surface, to the shim plate, covering an upper surface of the light emitting body and an upper surface of the shim plate with a lens formation material within the concave portion, and then hardening the lens formation material.

Abstract translation: 发光器件的制造方法可以包括在基底上设置接合层，并且在结合层上设置具有开口的垫板。 发光体设置在从垫片的开口露出的接合层的上方。 透镜通过在其表面接近具有凹部的模具，到垫片上，覆盖发光体的上表面和垫板的上表面，在凹部内具有透镜形成材料，然后 硬化透镜形成材料。

公开(公告)号：US20150263250A1

公开(公告)日：2015-09-17

申请号：US14657474

申请日：2015-03-13

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA

IPC: H01L33/56 ,  H01L33/38 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/16225 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/0939 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2203/048 ,  Y02P70/611

Abstract: Provided is an illumination device that includes a light emitting device having a first electrode and a second electrode and a mounting substrate including a first wiring pattern and a second wiring pattern. The first wiring pattern and the second wiring pattern face and are bonded to the first electrode and the second electrode, respectively, through a bonding material. The second electrode and the second wiring pattern are configured to be at least partially overlapped with each other in a plan view irrespective of an orientation of the light emitting device, under condition that the first electrode and the first wiring pattern are at least partially overlapped with each other in the plan view.

Abstract translation: 提供一种照明装置，其包括具有第一电极和第二电极的发光装置和包括第一布线图案和第二布线图案的安装基板。 第一布线图案和第二布线图案分别通过接合材料接合到第一电极和第二电极。 在第一电极和第一布线图案至少部分地与第一电极和第二布线图案重叠的条件下，第二电极和第二布线图案被配置为在平面图中至少部分地彼此重叠，而与发光器件的取向无关 在平面图中彼此相处。

公开(公告)号：US20150155450A1

公开(公告)日：2015-06-04

申请号：US14552602

申请日：2014-11-25

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA

IPC: H01L33/50 ,  H01L33/60

CPC classification number: H01L33/504 ,  H01L25/167 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Provided is a light emitting device capable of further improving light extraction efficiency while reducing leakage of wavelength unconverted light or color unevenness of the light. The light emitting device includes: a base member; a light emitting element mounted on the base member; a light reflecting member disposed at a side surface side of the light emitting element; and a light-transmissive stacked layer covering at least an upper surface of the light emitting element, wherein the light-transmissive stacked layer includes a first light-transmissive layer, a first wavelength conversion layer disposed on the first light-transmissive layer, a second light-transmissive layer disposed on the first wavelength conversion layer, and a second wavelength conversion layer disposed on the second light-transmissive layer.

Abstract translation: 提供一种能够进一步提高光提取效率同时减少未转换的光的透射或光的颜色不均匀性的发光装置。 发光装置包括：基座部件; 安装在所述基座构件上的发光元件; 设置在所述发光元件的侧面侧的光反射部件; 以及覆盖所述发光元件的至少上表面的透光性层叠层，其中，所述透光性层叠层包括第一透光层，配置在所述第一透光层上的第一波长转换层， 设置在第一波长转换层上的透光层，以及设置在第二透光层上的第二波长转换层。