公开(公告)号：US09299897B2

公开(公告)日：2016-03-29

申请号：US14428333

申请日：2013-09-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Lutz Höppel ,  Alexander F. Pfeuffer

IPC: H01L33/00 ,  H01L33/56 ,  H01L33/08 ,  H01L33/40 ,  H01L33/60 ,  H01L27/15 ,  H01L33/44

CPC classification number: H01L33/56 ,  H01L27/156 ,  H01L33/0016 ,  H01L33/08 ,  H01L33/405 ,  H01L33/44 ,  H01L33/60

Abstract: An optoelectronic semiconductor chip is disclosed. The optoelectronic semiconductor chip includes a semiconductor layer sequence having an active zone suitable for emitting radiation, a carrier substrate, and a mirror layer, the mirror layer being arranged between the semiconductor layer sequence and the carrier substrate, wherein the semiconductor layer sequence is subdivided into a plurality of active regions arranged alongside one another, wherein the plurality of active regions are separated from one another in each case by a trench in the semiconductor layer sequence, wherein the trench in each case severs the semiconductor layer sequence and the mirror layer, wherein the mirror layer has side surfaces facing a trench and side surfaces facing an outer side of the semiconductor chip, wherein the side surfaces of the mirror layer that face an outer side of the semiconductor chip have a metallic encapsulation layer.

Abstract translation: 公开了一种光电半导体芯片。 光电子半导体芯片包括具有适于发射辐射的有源区的半导体层序列，载体衬底和镜像层，镜层布置在半导体层序列和载体衬底之间，其中半导体层序列被细分为 多个有源区域彼此并排布置，其中多个有源区域在每种情况下都分别由半导体层序列中的沟槽分开，其中沟槽在每种情况下都分开半导体层序列和镜面层，其中 镜层具有面向沟槽的侧表面和面向半导体芯片的外侧的侧表面，其中面对半导体芯片的外侧的镜面层的侧表面具有金属封装层。

公开(公告)号：US20150236070A1

公开(公告)日：2015-08-20

申请号：US14702807

申请日：2015-05-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Norwin von Malm ,  Patrick Rode ,  Lutz Höppel ,  Karl Engl

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/38

CPC classification number: H01L27/15 ,  H01L25/167 ,  H01L33/005 ,  H01L33/02 ,  H01L33/08 ,  H01L33/382 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2924/00

Abstract: A radiation-emitting semiconductor chip includes a carrier and a semiconductor body having a semiconductor layer sequence, wherein an emission region and a protective diode region are formed in the semiconductor body having the semiconductor layer sequence; the semiconductor layer sequence includes an active region that generates radiation and is arranged between a first semiconductor layer and a second semiconductor layer; the first semiconductor layer is arranged on a side of the active region facing away from the carrier; the emission region has a recess extending through the active region; the first semiconductor layer, in the emission region, electrically conductively connects to a first connection layer, wherein the first connection layer extends in the recess from the first semiconductor layer toward the carrier; the second semiconductor layer, in the emission region, electrically conductively connects to a second connection layer.

Abstract translation: 辐射发射半导体芯片包括具有半导体层序列的载体和半导体本体，其中在具有半导体层序列的半导体主体中形成发光区域和保护二极管区域; 半导体层序列包括产生辐射并且被布置在第一半导体层和第二半导体层之间的有源区; 第一半导体层布置在有源区域背离载体的一侧; 发射区域具有延伸穿过有源区域的凹部; 发射区域中的第一半导体层导电地连接到第一连接层，其中第一连接层在凹部中从第一半导体层向载体延伸; 在发射区域中的第二半导体层导电地连接到第二连接层。

公开(公告)号：US20150129901A1

公开(公告)日：2015-05-14

申请号：US14415117

申请日：2013-06-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Lutz Höppel ,  Norwin von Malm

IPC: H01L27/15 ,  H01S5/022 ,  H01L33/00 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L27/15 ,  H01L27/156 ,  H01L33/005 ,  H01L33/38 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01S5/022 ,  H01L2924/00

Abstract: An optoelectronic semiconductor chip and a method for producing an optoelectronic semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a support having a support top side, a semiconductor layer sequence having an active layer for generating electromagnetic radiation, wherein the active layer is located between an n-type n-layer and a p-type p-layer of the semiconductor layer sequence, wherein the semiconductor layer sequence, as seen in a plan view of the support top side, is patterned into emitter regions arranged next to one another and electrical conductor tracks located on a side of the semiconductor layer sequence facing away from the support, where the electrical conductor tracks include contact surfaces. The chip further includes an n-contact point and a p-contact point for electrically contacting the semiconductor chip, wherein the emitter regions are electrically connected in series via the at least two conductor tracks.

Abstract translation: 公开了一种光电半导体芯片及其制造方法。 在一个实施例中，光电子半导体芯片包括具有支撑顶侧的支撑件，具有用于产生电磁辐射的有源层的半导体层序列，其中有源层位于n型n层和p型p- 半导体层序列的层，其中如在支撑顶侧的平面图中看到的半导体层序列被图案化成彼此相邻布置的发射极区域和位于半导体层序列侧面上的电导体轨迹 从支撑件，其中电导体轨迹包括接触表面。 芯片还包括用于电接触半导体芯片的n接触点和p接触点，其中发射极区域经由至少两个导体轨迹串联电连接。

公开(公告)号：US12295192B2

公开(公告)日：2025-05-06

申请号：US17609256

申请日：2020-05-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander F. Pfeuffer ,  Tobias Berthold ,  Lutz Höppel ,  Tobias Meyer ,  Korbinian Perzlmaier

IPC: H01L25/00 ,  H01L25/04 ,  H01L25/075 ,  H10F71/00 ,  H10F77/00 ,  H10H20/857 ,  H10H20/01

Abstract: In an embodiment a method for producing a component having a carrier and at least one component part electrically conductively connected to the carrier and mechanically fixed to the carrier by an electrically insulating bonding layer includes providing the carrier having a connection layer, wherein the bonding layer is disposed on the carrier and has at least one opening, wherein a connection surface of the connection layer is exposed, and wherein the bonding layer projects vertically beyond the exposed connection surface or vice versa, applying the component part having a contact layer on the carrier in such that, in top view of the carrier, an exposed contact surface of the contact layer covers the opening and the connection surface located therein, wherein the exposed contact surface is spaced apart from the exposed connection surface by a vertical distance and reducing the vertical distance by changing a volume of the bonding layer such that the exposed contact surface and the exposed connection surface are brought together, such that they are directly adjacent to each other and such that a direct electrical contact is formed between the contact layer and the connection layer.

公开(公告)号：US20220238773A1

公开(公告)日：2022-07-28

申请号：US17609256

申请日：2020-05-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Alexander F. Pfeuffer ,  Tobias Berthold ,  Lutz Höppel ,  Tobias Meyer ,  Korbinian Perzlmaier

IPC: H01L33/62 ,  H01L25/04 ,  H01L25/075 ,  H01L31/02 ,  H01L31/18

Abstract: In an embodiment a method for producing a component having a carrier and at least one component part electrically conductively connected to the carrier and mechanically fixed to the carrier by an electrically insulating bonding layer includes providing the carrier having a connection layer, wherein the bonding layer is disposed on the carrier and has at least one opening, wherein a connection surface of the connection layer is exposed, and wherein the bonding layer projects vertically beyond the exposed connection surface or vice versa, applying the component part having a contact layer on the carrier in such that, in top view of the carrier, an exposed contact surface of the contact layer covers the opening and the connection surface located therein, wherein the exposed contact surface is spaced apart from the exposed connection surface by a vertical distance and reducing the vertical distance by changing a volume of the bonding layer such that the exposed contact surface and the exposed connection surface are brought together, such that they are directly adjacent to each other and such that a direct electrical contact is formed between the contact layer and the connection layer.

公开(公告)号：US20190393376A1

公开(公告)日：2019-12-26

申请号：US16485414

申请日：2018-03-20

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Lutz Höppel

IPC: H01L33/00 ,  H01L33/62 ,  H01L31/02 ,  H01L33/50 ,  H01L31/0232 ,  H01L31/18

Abstract: A method for producing a component and a component are disclosed. In an embodiment a method includes providing a substrate, applying a composite of components to the substrate, forming an anchoring layer on the composite of components, attaching a carrier to the anchoring layer, wherein the anchoring layer is disposed between the substrate and the carrier and removing the substrate, wherein the composite of components is divided into a plurality of components by forming a plurality of separating trenches, wherein, after removing the substrate, the components continue to be held on the carrier by the anchoring layer, and wherein the anchoring layer comprises at least one predetermined breaking layer having at least one predetermined breaking position, the predetermined breaking position being laterally surrounded by the separating trenches and—in a plan view of the carrier—being covered by one of the components.

公开(公告)号：US10381521B2

公开(公告)日：2019-08-13

申请号：US16069129

申请日：2017-01-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Lutz Höppel ,  Dominik Scholz

IPC: H01L33/46 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44 ,  H01L31/0216 ,  H01L31/0224 ,  H01L31/0232 ,  H01L31/0304 ,  H01L31/0352 ,  H01L31/18 ,  H01L33/00 ,  H01L33/06 ,  H01L33/24 ,  H01L33/30 ,  H01L33/32 ,  H01L33/42 ,  H01L33/20 ,  H01L33/62

Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a component includes a semiconductor layer sequence having a first semiconductor layer, an active layer, a second semiconductor layer and a top side stacked in the recited order, a first contact layer arranged at the first semiconductor layer, a mirror layer arranged on the top side and a recess in the semiconductor layer sequence which extends from the top side through the entire second semiconductor layer and the active layer, wherein the recess has a bottom surface in a region of the first semiconductor layer, wherein the mirror layer covers a portion of the recess in plan view, wherein the first contact layer is in direct electrical and mechanical contact with a contact pin, and wherein the contact pin extends from the first contact layer to the top side of the semiconductor layer sequence.

公开(公告)号：US10355174B2

公开(公告)日：2019-07-16

申请号：US15738427

申请日：2016-07-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Maute ,  Lutz Höppel ,  Jürgen Moosburger ,  Thomas Schwarz ,  Matthias Sabathil ,  Ralph Wirth ,  Alexander Linkov ,  Johannes Baur

IPC: H01L33/20 ,  H01L33/24 ,  H01L33/30 ,  H01L33/38 ,  H01L33/40 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62

Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.

公开(公告)号：US20190019921A1

公开(公告)日：2019-01-17

申请号：US16081159

申请日：2017-03-15

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Lutz Höppel

IPC: H01L33/46 ,  H01L33/40

CPC classification number: H01L33/46 ,  H01L33/20 ,  H01L33/405

Abstract: A light-emitting semiconductor chip and a method for producing a light-emitting semiconductor chip are disclosed. In an embodiment a light-emitting chip includes a semiconductor body having an active region designed to generate light, a dielectric mirror including an electrically insulating material and a first metallic mirror including an electrically conductive material, wherein the semiconductor body expands towards a light exit side, wherein the dielectric mirror is arranged on a side of the semiconductor body facing away from the light exit side, wherein the first metallic mirror is arranged on a side of the dielectric mirror facing away from the semiconductor body, wherein the first metallic mirror electrically contacts the semiconductor body through at least one opening in the dielectric mirror, and wherein the dielectric mirror, apart from the at least one opening, completely covers the semiconductor body on the side facing away from the light exit side.

公开(公告)号：US10115868B2

公开(公告)日：2018-10-30

申请号：US14906581

申请日：2014-07-23

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Lutz Höppel

IPC: H01L33/48 ,  H01L33/22 ,  H01L33/60 ,  H01L33/62

Abstract: An optoelectronic semiconductor chip includes a carrier and a semiconductor body having an active layer that generates electromagnetic radiation, wherein the semiconductor body is arranged on the carrier, the semiconductor body has a first main surface facing away from the carrier and a second main surface facing the carrier, the semiconductor chip has a side surface having an anchoring structure, and the second main surface is arranged between the first main surface and the anchoring structure.