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公开(公告)号：US10411157B2
公开(公告)日：2019-09-10
申请号：US15649987
申请日：2017-07-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Christian Gatzhammer , Martin Brandl , Tobias Gebuhr
Abstract: An optoelectronic component includes an optoelectronic semiconductor chip including first and second electrical contacts, a first leadframe section including a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad, and a second leadframe section including a second chip contact pad and a second soldering contact pad situated opposite the second chip contact pad, wherein the first electrical contact electrically conductively connects to the first chip contact pad and the second electrical contact electrically conductively connects to the second chip contact pad, the first and second leadframe sections are embedded into a housing such that at least parts of the first and second soldering contact pads are accessible at an underside, and a solder stop element is arranged at the underside of the housing, the solder stop element extending between the first soldering contact pad and the second soldering contact pad.
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公开(公告)号：US10049967B2
公开(公告)日：2018-08-14
申请号：US15737525
申请日：2016-06-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Brandl , Ion Stoll , Michael Wittmann
IPC: H01L33/00 , H01L23/495 , H01L33/62 , H01L33/48 , H01L25/16 , H01L33/60 , H01L25/075 , H01L33/50 , H01L31/0203
Abstract: A method of producing an optoelectronic component includes providing a lead frame having an upper side including a contact region and a chip reception region raised relative to the contact region; arranging an electrically conductive element on the contact region; embedding the lead frame in a molded body, wherein the contact region is covered by the molded body, and the chip reception region and the electrically conductive element remain accessible on an upper side of the molded body; arranging an optoelectronic semiconductor chip on the chip reception region; and connecting the optoelectronic semiconductor chip and the electrically conductive element by a bonding wire.
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公开(公告)号：US20180114883A1
公开(公告)日：2018-04-26
申请号：US15565523
申请日：2016-04-07
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Richter , Martin Brandl , Markus Burger , Günter Spath
IPC: H01L33/50
CPC classification number: H01L33/50 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/58 , H01L2933/0025 , H01L2933/0041 , H01L2933/0058 , H01L2933/0091
Abstract: A converter component for an opto-electronic lighting device includes an auxiliary carrier, wherein a layer stack including a base layer and a converter layer is formed on a surface of the auxiliary carrier. An opto-electronic lighting device includes a light-emitting semiconductor component and the converter component for an opto-electronic light device including an auxiliary carrier, wherein a layer stack including a base layer and a converter layer is formed on a surface of the auxiliary carrier with a removed auxiliary carrier.
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公开(公告)号：US09520539B2
公开(公告)日：2016-12-13
申请号：US14784879
申请日：2014-04-04
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Brandl , Michael Zitzlsperger
CPC classification number: H01L33/483 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic component includes a plastics housing, wherein a first leadframe section is embedded into the plastics housing, a chip landing face and a soldering contact face of the first leadframe section are at least partly not covered by the plastics housing, the soldering contact face has a groove, and the groove is not covered by the material of the plastics housing.
Abstract translation: 光电子部件包括塑料壳体，其中第一引线框架部分嵌入到塑料壳体中，第一引线框架部分的芯片着陆面和焊接接触面至少部分地不被塑料壳体覆盖，焊接接触面具有 凹槽，并且凹槽不被塑料外壳的材料覆盖。
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公开(公告)号：US20160240747A1
公开(公告)日：2016-08-18
申请号：US15027482
申请日：2014-10-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Pindl , Martin Brandl
CPC classification number: H01L33/502 , H01L27/15 , H01L33/0095 , H01L33/483 , H01L33/486 , H01L33/56 , H01L33/58 , H01L2224/48091 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0083 , H01L2924/00014
Abstract: An optoelectronic component includes a housing body, wherein a cavity is formed on the upper side of the housing body, and a channel extending from the cavity to an outer edge of the upper side of the housing body is formed on the upper side of the housing body; and a method of producing an optoelectronic component including providing a flat panel of a multiplicity of housing bodies, each housing body having a cavity opening onto an upper side of the panel wherein the cavities of neighboring housing bodies connect by channels and open onto the upper side of the panel, arranging an encapsulation material in the cavities of the housing bodies, and dividing the panel.
Abstract translation: 光电子部件包括壳体，其中腔体形成在壳体的上侧上，并且从腔体延伸到壳体主体上侧的外边缘的通道形成在壳体的上侧 身体; 以及一种制造光电子部件的方法，包括提供多个壳体的平板，每个壳体具有通向所述面板的上侧的空腔，其中相邻的壳体的空腔通过通道连接并向上开放 在壳体的空腔中布置封装材料，并分割面板。
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Patent Agency Ranking
公开(公告)号：US20160133808A1
公开(公告)日：2016-05-12
申请号：US14900699
申请日：2014-06-25
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Martin Brandl , Tobias Gebuhr
CPC classification number: H01L33/62 , B29C45/0055 , B29C45/02 , B29C45/14221 , B29C45/14655 , B29K2063/00 , B29K2101/10 , B29K2101/12 , B29L2031/3406 , H01L33/486 , H01L33/52 , H01L33/54 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A method of manufacturing an optoelectronic component includes providing a leadframe, wherein the leadframe has a first leadframe section and a second leadframe section, and the first leadframe section and the second leadframe section are physically separate from one another; embedding the leadframe into a plastic material by a molding process to form a casing body, wherein the first leadframe section and the second leadframe section are embedded into the plastic material at a physical interval; and reshaping of the plastic material to at least partially close a gap between the plastic material and the leadframe, wherein the plastic material is reshaped in a region arranged between the first leadframe section and the second leadframe section.
Abstract translation: 制造光电子部件的方法包括提供引线框架，其中所述引线框架具有第一引线框架部分和第二引线框架部分，并且所述第一引线框架部分和所述第二引线框架部分在物理上彼此分离; 通过模制工艺将引线框嵌入塑料材料以形成壳体，其中第一引线框架部分和第二引线框架部分以物理间隔嵌入塑料材料; 以及塑造塑料材料的重塑，至少部分地封闭塑料材料与引线框架之间的间隙，其中塑料材料在布置在第一引线框架部分和第二引线框架部分之间的区域中重新成形。
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公开(公告)号：US11322662B2
公开(公告)日：2022-05-03
申请号：US16398889
申请日：2019-04-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Brandl , Alexander Baumgartner , Ion Stoll
Abstract: The optoelectronic device including a radiation emitting semiconductor chip emitting electromagnetic radiation of a first wavelength range from a radiation exit surface, and a conversion element converting electromagnetic radiation of the first wavelength range into electromagnetic radiation of a second wavelength range at least partially and emitting electromagnetic radiation from a light coupling-out surface, wherein the light coupling-out surface of the conversion element is smaller than the radiation exit surface of the semiconductor chip.
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公开(公告)号：US11069844B2
公开(公告)日：2021-07-20
申请号：US16382008
申请日：2019-04-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Luca Haiberger , Sam Chou , Martin Brandl
Abstract: A light-emitting device and a method for manufacturing a light emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip having a light-outcoupling surface and an optical element arranged on the light-outcoupling surface, wherein the light-emitting semiconductor chip is laterally surrounded by a frame element in a form-locking manner, wherein the optical element is mounted on the frame element, wherein the frame element projects beyond the light-outcoupling surface in a vertical direction such that a gas-filled gap is present at least in a partial region between the light-outcoupling surface and the optical element, and wherein the frame element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.
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公开(公告)号：US11031531B2
公开(公告)日：2021-06-08
申请号：US16478996
申请日：2018-01-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Brandl , Markus Pindl
Abstract: An optoelectronic component includes a housing including a first cavity bounded by a first wall, wherein a circumferentially extending first step is formed at an inner side of the first wall, the first step circumferentially extends around the first cavity obliquely with respect to a bottom of the first cavity, a first optoelectronic semiconductor chip is arranged at the bottom of the first cavity, the first optoelectronic semiconductor chip is embedded into a first potting material arranged in the first cavity and extending from the bottom of the first cavity as far as the first step, and a first potting surface of the first potting material is formed at the first step.
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公开(公告)号：US10930829B2
公开(公告)日：2021-02-23
申请号：US16348015
申请日：2018-02-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Brandl
Abstract: A method of producing side-emitting components includes providing a plurality of semiconductor chips on an auxiliary carrier, wherein the semiconductor chips on the auxiliary carrier are spaced apart from each other and each have a side surface provided with a transparent protective layer; covering the semiconductor chips with a radiation-reflecting molding compound so that in a plan view of the auxiliary carrier, the semiconductor chips are completely covered by the molding compound; and singulating the molding compound and the semiconductor chips into a plurality of components so that the components each include a semiconductor chip, wherein the components are singulated at the associated transparent protective layer, as a result of which the components each have a radiation exit surface exposed by the molding compound and formed by a surface of the remaining or exposed transparent protective layer.
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