中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

51 records (took 0.034 seconds)

    METHOD OF EMBEDDING OPTO-ELECTRONIC COMPONENTS IN A LAYER
    21.
    发明申请
    METHOD OF EMBEDDING OPTO-ELECTRONIC COMPONENTS IN A LAYER 审中-公开

    公开(公告)号：US20190193314A1

    公开(公告)日：2019-06-27

    申请号：US16227789

    申请日：2018-12-20

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Peter Nagel ,  Tobias Gebuhr

    IPC: B29C45/14 ,  B29C45/26

    CPC classification number: B29C45/14639 ,  B29C45/26 ,  B29L2031/34

    Abstract: A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.

    HOUSING ARRANGEMENT, METHOD OF PRODUCING A HOUSING AND METHOD OF PRODUCING AN ELECTRONIC ASSEMBLY
    27.
    发明申请
    HOUSING ARRANGEMENT, METHOD OF PRODUCING A HOUSING AND METHOD OF PRODUCING AN ELECTRONIC ASSEMBLY 有权
    住房安排，生产房屋的方法和生产电子装配的方法

    公开(公告)号：US20150228562A1

    公开(公告)日：2015-08-13

    申请号：US14424539

    申请日：2013-08-28

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tobias Gebuhr ,  Thomas Schwarz

    IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

    CPC classification number: H01L23/49541 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3157 ,  H01L23/49503 ,  H01L25/0753 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2933/0033 ,  Y10T29/49158 ,  H01L2924/00

    Abstract: A housing arrangement includes a plurality of interconnected housings for electronic components, each housing including a leadframe section of a leadframe, wherein the leadframe section is formed from an electrically conductive material and has a receiving region that receives the electronic component and/or a contact region that contacts the electronic component, a molding material into which the leadframe section is embedded and which has at least one receiving opening in which the receiving region and/or the contact region are exposed, and at least one stress reduction opening formed in the molding material and free of the receiving region and/or the contact region, wherein the housings connect to one another via the leadframe and the molding material, the stress reduction openings are formed at transitions from in each case one of the housings to another of the housings.

    Abstract translation: 壳体布置包括用于电子部件的多个互连壳体，每个壳体包括引线框架的引线框架部分，其中所述引线框架部分由导电材料形成并且具有容纳所述电子部件和/或接触区域的接收区域 其与所述电子部件接触，所述引线框架部分嵌入所述模制材料中，并且所述模制材料具有至少一个接收区域和/或所述接触区域露出的接收开口，以及形成在所述模制材料中的至少一个应力消除开口 并且没有接收区域和/或接触区域，其中壳体经由引线框和模制材料彼此连接，所述应力减小开口形成在从壳体中的一个壳体到另一壳体的过渡处。

    HOUSING FOR AN ELECTRONIC COMPONENT, ELECTRONIC ASSEMBLY, METHOD FOR PRODUCING A HOUSING FOR AN ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY
    28.
    发明申请
    HOUSING FOR AN ELECTRONIC COMPONENT, ELECTRONIC ASSEMBLY, METHOD FOR PRODUCING A HOUSING FOR AN ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC ASSEMBLY 有权
    用于电子元件的住房，电子总成，用于制造用于电子元件的住房的方法和用于生产电子组件的方法

    公开(公告)号：US20150221585A1

    公开(公告)日：2015-08-06

    申请号：US14423835

    申请日：2013-08-28

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tobias Gebuhr ,  Thomas Schwarz ,  Michael Zitzlsperger

    IPC: H01L23/495 ,  H01L21/48

    CPC classification number: H01L23/49586 ,  H01L21/4839 ,  H01L23/49861 ,  H01L33/486 ,  H01L33/647 ,  H01L51/5212 ,  H01L51/5228 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0033 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/4554

    Abstract: A housing includes a lead frame formed from electrically conductive material having first and second sides, a contact section contacting an electronic component at the first side, and at least one receiving section arranging the electronic component at the first side, wherein the contact and receiving sections are separated and the contact section is formed thinner than the receiving section in a direction perpendicular, a molding material having an opening, the receiving and contact regions exposed in the opening, and into which the leadframe is embedded such that part of the molding material is formed between the contact and receiving sections and the second side is covered by the molding material in the contact section, and the second side is free of molding material in the receiving section, wherein the molding material at the second side has at least one opening filled with the electrically insulating material.

    Abstract translation: 壳体包括由导电材料形成的引线框架，该引线框架具有第一和第二侧面，接触部分与第一侧面处的电子部件接触，以及至少一个接收部分，其在第一侧布置电子部件，其中接触部分和接收部分 被分离，并且接触部分在垂直方向上比接收部分形成得更薄，具有开口的成型材料，接触和接触区域暴露在开口中，并且引线框架被嵌入其中，使得部分成型材料为 形成在接触部分和接收部分之间的第二面被接触部分中的成型材料覆盖，并且第二侧在接收部分中没有成型材料，其中第二侧的成型材料具有至少一个开口 与电绝缘材料。

    Method for producing an optoelectronic device with wireless contacting
    29.
    发明授权
    Method for producing an optoelectronic device with wireless contacting 有权
    无线接触光电子器件制造方法

    公开(公告)号：US08975102B2

    公开(公告)日：2015-03-10

    申请号：US14348585

    申请日：2012-09-27

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tobias Gebuhr ,  Hans-Christoph Gallmeier

    IPC: H01L21/00 ,  H01L33/62 ,  H01L23/00 ,  H01L33/44 ,  H01L33/50

    CPC classification number: H01L33/62 ,  H01L24/24 ,  H01L24/82 ,  H01L33/44 ,  H01L33/50 ,  H01L2924/01029 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: A method for producing an optoelectronic device is provided, in which a luminescent diode chip (10) is mounted on a base surface (8) on the first terminal area (1) of a carrier (3). An electrically insulating layer (4) is applied to side faces (17) of the luminescent diode chip (10). An electrically conductive layer (5), which leads from a second terminal contact (12) of the luminescent diode chip (10) over the electrically insulating layer (4) to a second terminal area (2) on the carrier (3), is subsequently applied. A photoresist layer (7) is applied to the electrically conductive layer (5), which photoresist layer (7) is exposed by application of an electrical voltage to the luminescent diode chip (10) so that the luminescent diode chip (10) emits radiation (23). After development of the photoresist layer (7), a portion of the electrically conductive layer (5) arranged on the radiation exit surface (9) is removed by means of an etching process, in which the photoresist layer (7) serves as a mask.

    Abstract translation: 提供了一种制造光电子器件的方法，其中发光二极管芯片（10）安装在载体（3）的第一端子区域（1）上的基底表面（8）上。 将电绝缘层（4）施加到发光二极管芯片（10）的侧面（17）。 导电层（5）从发光二极管芯片（10）的第二端子触点（12）穿过电绝缘层（4）引导到载体（3）上的第二端子区域（2），是 随后应用。 光致抗蚀剂层（7）被施加到导电层（5）上，该光致抗蚀剂层（7）通过向发光二极管芯片（10）施加电压而暴露，使得发光二极管芯片（10）发射辐射 （23）。 在光致抗蚀剂层（7）的显影之后，通过蚀刻工艺除去布置在辐射出射表面（9）上的导电层（5）的一部分，其中光致抗蚀剂层（7）用作掩模 。

    METHOD FOR PRODUCING AN OPTOELECTRONIC DEVICE WITH WIRELESS CONTACTING
    30.
    发明申请
    METHOD FOR PRODUCING AN OPTOELECTRONIC DEVICE WITH WIRELESS CONTACTING 有权
    用无线接触制造光电器件的方法

    公开(公告)号：US20140227811A1

    公开(公告)日：2014-08-14

    申请号：US14348585

    申请日：2012-09-27

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Tobias Gebuhr ,  Hans-Christoph Gallmeier

    IPC: H01L33/62

    CPC classification number: H01L33/62 ,  H01L24/24 ,  H01L24/82 ,  H01L33/44 ,  H01L33/50 ,  H01L2924/01029 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: A method for producing an optoelectronic device is provided, in which a luminescent diode chip (10) is mounted on a base surface (8) on the first terminal area (1) of a carrier (3). An electrically insulating layer (4) is applied to side faces (17) of the luminescent diode chip (10). An electrically conductive layer (5), which leads from a second terminal contact (12) of the luminescent diode chip (10) over the electrically insulating layer (4) to a second terminal area (2) on the carrier (3), is subsequently applied. A photoresist layer (7) is applied to the electrically conductive layer (5), which photoresist layer (7) is exposed by application of an electrical voltage to the luminescent diode chip (10) so that the luminescent diode chip (10) emits radiation (23). After development of the photoresist layer (7), a portion of the electrically conductive layer (5) arranged on the radiation exit surface (9) is removed by means of an etching process, in which the photoresist layer (7) serves as a mask.

    Abstract translation: 提供了一种制造光电子器件的方法，其中发光二极管芯片（10）安装在载体（3）的第一端子区域（1）上的基底表面（8）上。 将电绝缘层（4）施加到发光二极管芯片（10）的侧面（17）。 导电层（5）从发光二极管芯片（10）的第二端子触点（12）穿过电绝缘层（4）引导到载体（3）上的第二端子区域（2），是 随后应用。 光致抗蚀剂层（7）被施加到导电层（5）上，该光致抗蚀剂层（7）通过向发光二极管芯片（10）施加电压而暴露，使得发光二极管芯片（10）发射辐射 （23）。 在光致抗蚀剂层（7）的显影之后，通过蚀刻工艺除去布置在辐射出射表面（9）上的导电层（5）的一部分，其中光致抗蚀剂层（7）用作掩模 。

Patent Agency Ranking