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公开(公告)号：US20180083063A1
公开(公告)日：2018-03-22
申请号：US15825003
申请日：2017-11-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Groetsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
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公开(公告)号：US09190394B2
公开(公告)日：2015-11-17
申请号：US14346687
申请日：2012-09-21
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Michael Zitzlsperger , Stefan Groetsch
CPC classification number: H01L25/0753 , F21S41/141 , H01L24/73 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2224/32245 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2924/00014 , H01L2924/19107 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
Abstract: An LED module has an electrically insulating main body, a base surface and a mounting surface located opposite the base surface. A number of electrical connection contacts are arranged at the mounting surface. The connection contacts do not adjoin the base surface. A heat sink is arranged in the main body. The heat sink extends from the mounting surface as far as the base surface. Furthermore, the LED module has a number of LED chips, each having an electrically insulating carrier substrate at a chip underside and two chip contacts at a chip top side. The LED chips are arranged with the electrically insulating carrier substrate on the heat sink.
Abstract translation: LED模块具有电绝缘主体，基面和与基面相对的安装面。 多个电连接触点设置在安装表面。 连接触点不与基面相邻。 散热器布置在主体中。 散热片从安装表面延伸到基面最远处。 此外，LED模块具有多个LED芯片，每个LED芯片在芯片下侧具有电绝缘载体基板，在芯片顶侧具有两个芯片触点。 LED芯片布置有散热器上的电绝缘载体衬底。
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公开(公告)号：US20250096206A1
公开(公告)日：2025-03-20
申请号：US18970720
申请日：2024-12-05
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael BRANDL , Andreas Dobner , Matthias Goldbach , Sebastian Wittmann , Uli Hiller , Markus Klein , Thomas Schwarz , Andreas Waldschik , Michael Wittmann , Matthias Bruckschloegl , Stefan Groetsch , Rainer Huber , Peter Brick , Ludwig Hofbauer
IPC: H01L25/075 , B60K35/00 , H01L33/60
Abstract: An optoelectronic device, in particular an at least partially transparent pane for example of a vehicle, comprises a first layer, in particular an intermediate layer arranged between a cover layer and a carrier layer, at least one electronic or optoelectronic component, which is at least partially or completely embedded in the first layer and at least one structured conductor layer. A first portion of the conductor layer is arranged on an upper surface of the first layer and a second portion of the conductor layer is arranged on a top surface of the electronic or optoelectronic component and is in contact with an electric contact of the electronic or optoelectronic component. The electric contact, in particular a contact pad, is arranged on the top surface.
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公开(公告)号：US12095015B2
公开(公告)日：2024-09-17
申请号：US17414861
申请日：2019-12-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Andreas Dobner , Frank Singer , Stefan Groetsch
IPC: H01L33/60 , H01L25/075 , H01L33/00 , H01L33/50
CPC classification number: H01L33/60 , H01L25/0753 , H01L33/005 , H01L33/50 , H01L2933/0058 , H01L2933/0091
Abstract: An optoelectronic light emitting device includes a pixel with a transparent or translucent carrier substrate, on which a semiconductor light emitting arrangement with at least one micro LED is arranged. The micro LED extends over a partial area of the pixel. The main radiation direction of the semiconductor light emitting arrangement is directed onto a backscattering surface element arranged behind the transparent carrier substrate in viewing direction. The semiconductor light emitting arrangement includes a beam shaping element.
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公开(公告)号：US12040317B2
公开(公告)日：2024-07-16
申请号：US17541761
申请日：2021-12-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Brandl , Andreas Dobner , Matthias Goldbach , Sebastian Wittmann , Uli Hiller , Markus Klein , Thomas Schwarz , Andreas Waldschik , Michael Wittmann , Matthias Bruckschloegl , Stefan Groetsch , Rainer Huber , Peter Brick , Ludwig Hofbauer
IPC: H04W72/20 , H01L25/075 , H01L33/46 , H01L33/62 , H01L33/64 , H04W72/51 , B60J3/00 , B60K35/00 , B60K35/60 , B62J50/22
CPC classification number: H01L25/0756 , H01L33/46 , H01L33/62 , H01L33/641 , H04W72/20 , H04W72/51 , B60J3/00 , B60K35/00 , B60K35/60 , B60K2370/785 , B62J50/22
Abstract: An optoelectronic device comprises a plurality of optoelectronic light sources being arranged on a first layer, in particular an intermediate layer being arranged between a cover layer and a carrier layer. The first layer comprises or consists of an at least partially transparent material and each optoelectronic light source of the plurality of optoelectronic light sources comprises an individual light converter for converting light emitted by the associated light source into converted light. The light converter of each optoelectronic light source is arranged on the first layer and/or the associated optoelectronic light source.
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Patent Agency Ranking
公开(公告)号：US20160380172A1
公开(公告)日：2016-12-29
申请号：US15039861
申请日：2014-11-25
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Michael Brandl , Stefan Groetsch , Tobias Gebuhr , Michael Zitzlsperger , Thomas Schwarz
IPC: H01L33/62 , F21S8/10 , H01L25/075
CPC classification number: H01L33/62 , F21S41/141 , F21S43/14 , H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2924/0002 , H01L2924/15311 , H01L2933/0033 , H01L2924/00014
Abstract: Various embodiments may relate to a component arrangement with at least two electrical components arranged next to one another in a product configuration. Each of the electrical components have at least two electrical terminal contacts and the components arranged next to one another are mechanically connected to one another by an adhesive arranged between the components, and the component arrangement is designed for the individual components of the component arrangement to be applied together to a circuit carrier.
Abstract translation: 各种实施例可以涉及具有在产品配置中彼此相邻布置的至少两个电气部件的部件布置。 每个电气部件具有至少两个电气端子触点，并且彼此相邻布置的部件通过布置在部件之间的粘合剂彼此机械连接，并且部件布置被设计用于部件布置的各个部件为 一起应用于电路载体。
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公开(公告)号：US09997559B2
公开(公告)日：2018-06-12
申请号：US15825003
申请日：2017-11-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Groetsch , Matthias Kiessling , Michael Wittmann , Stefan Gruber
CPC classification number: H01L27/15 , H05B33/0803 , H05B33/0815 , H05B33/083
Abstract: An optoelectronic semiconductor component includes a first functional region having an active zone provided for generating radiation or for receiving radiation, and a second functional region, which is suitable for contributing to the driving of the first functional region. The first functional region and the second functional region are integrated on the same carrier substrate.
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公开(公告)号：US09551479B2
公开(公告)日：2017-01-24
申请号：US14418924
申请日：2013-07-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Stefan Groetsch , Frank Singer
IPC: H01L21/00 , H01L33/00 , H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40 , F21V19/00 , H01L33/48 , F21S8/10 , F21V29/70 , H01L25/075
CPC classification number: F21V19/0015 , F21S41/147 , F21S41/19 , F21S43/14 , F21S43/19 , F21S45/47 , F21V29/70 , H01L25/0753 , H01L33/486 , H01L2224/48 , H01L2924/0002 , Y10T29/41 , H01L2924/00
Abstract: A method for producing an illuminant is specified, in which a positioning device (3) holds an optoelectronic semiconductor component (1) inside a tolerance range (4) on the upper side of a connection carrier (2) during the mechanical fixation and electrical connecting of the optoelectronic semiconductor component (1) to the connection carrier (2).
Abstract translation: 规定了用于制造发光体的方法，其中定位装置（3）在机械固定和电连接期间将光电子半导体部件（1）保持在连接载体（2）的上侧的公差范围（4）内 的光电子半导体部件（1）连接到连接载体（2）。
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公开(公告)号：US20150144985A1
公开(公告)日：2015-05-28
申请号：US14607993
申请日：2015-01-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Michael Zitzlsperger , Stefan Groetsch
IPC: H05K1/18 , H01L31/0203 , H01L33/48
CPC classification number: H05K1/181 , H01L31/0203 , H01L33/486 , H01L33/62 , H01L2224/16057 , H01L2224/16105 , H01L2224/48091 , H01L2224/48247 , H05K3/3442 , H05K2201/09181 , H05K2201/10106 , H05K2201/1084 , Y02P70/613 , H01L2924/00012 , H01L2924/00014
Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.
Abstract translation: 电子设备包括基体，该基体具有顶侧，并且还具有与顶侧相对的下侧。 基体在其下侧具有连接位置。 在基体的顶侧设置有电子部件。 基体具有至少一个具有至少一个检查点的侧面区域，具有第一区域和第二区域。 第二个地区体现为第一个地区的缩进。 第一和第二区域包含不同的材料。
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公开(公告)号：US10468317B2
公开(公告)日：2019-11-05
申请号：US16047873
申请日：2018-07-27
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Stefan Groetsch , Joerg Erich Sorg , Christoph Koller
IPC: H01L23/14 , H01L29/866 , H01L31/02 , H01L31/024 , H01L33/48 , H01L33/62 , H01L33/64 , H05K1/02 , H05K1/05 , H01L23/60 , H01L23/00 , H01L25/16
Abstract: Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical protection element is electrically conductively connected to the third electrically conductive structure and the first or second electrically conductive structure.
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