公开(公告)号：US20180248068A1

公开(公告)日：2018-08-30

申请号：US15969908

申请日：2018-05-03

Applicant: STMicroelectronics Pte Ltd

Inventor： Yonggang Jin ,  Wee Chin Judy Lim

IPC: H01L31/16 ,  H01L31/18 ,  H01L31/0232 ,  H01L25/16

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  G01V8/12 ,  H01L21/568 ,  H01L25/167 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167 ,  H01L31/18 ,  H01L31/186 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2924/3511 ,  H03K17/941 ,  H03K17/9631 ,  H03K17/9638 ,  H03K2217/96023 ,  Y10T156/1052 ,  Y10T156/1064

Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.

公开(公告)号：US09991409B2

公开(公告)日：2018-06-05

申请号：US14968359

申请日：2015-12-14

Applicant: STMicroelectronics Pte Ltd

Inventor： Yonggang Jin ,  Wee Chin Judy Lim

IPC: H01L31/16 ,  H01L31/0232 ,  H01L31/18 ,  H03K17/94 ,  H03K17/96 ,  H01L31/167 ,  G01S17/02 ,  G01S7/481 ,  H01L25/16 ,  G01V8/12

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  G01V8/12 ,  H01L21/568 ,  H01L25/167 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167 ,  H01L31/18 ,  H01L31/186 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2924/3511 ,  H03K17/941 ,  H03K17/9631 ,  H03K17/9638 ,  H03K2217/96023 ,  Y10T156/1052 ,  Y10T156/1064

Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.

公开(公告)号：US09851328B2

公开(公告)日：2017-12-26

申请号：US14462432

申请日：2014-08-18

Applicant: STMicroelectronics Pte Ltd

Inventor： Jerome Teysseyre ,  Yonggang Jin ,  Suman Cherian

IPC: G01N27/28 ,  G01N27/403 ,  G01N27/413 ,  G01N27/406 ,  G01N27/407 ,  H05K1/18

CPC classification number: G01N27/4065 ,  G01N27/4062 ,  G01N27/4071 ,  G01N27/4077 ,  H05K1/185 ,  H05K2201/09118 ,  H05K2201/10151

Abstract: A compact microelectronic gas sensor module includes electrical contacts formed in such a way that they do not consume real estate on an integrated circuit chip. Using such a design, the package can be miniaturized further. The gas sensor is packaged together with a custom-designed Application Specific Integrated Circuit (ASIC) that provides circuitry for processing sensor signals to identify gas species within a sample under test. In one example, the output signal strength of the sensor is enhanced by providing an additional metal surface area in the form of pillars exposed to an electrolytic gas sensing compound, while reducing the overall package size. In some examples, bottom side contacts are formed on the underside of the substrate on which the gas sensor is formed. Sensor electrodes may be electrically coupled to the ASIC directly, or indirectly by vias.

公开(公告)号：US09780080B2

公开(公告)日：2017-10-03

申请号：US14510433

申请日：2014-10-09

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang Jin

IPC: H01L25/00 ,  H01L25/16 ,  G06F1/32 ,  H03K17/94 ,  G06F3/01

CPC classification number: H01L25/50 ,  G06F1/3231 ,  G06F3/017 ,  H01L25/165 ,  H01L25/167 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2217/94108 ,  H04M2250/12 ,  H01L2924/00

Abstract: A method for making an optical proximity sensor includes forming a package top plate having an optical transmit opening and an optical receive opening extending therethrough, attaching an optical transmit element to the package top plate adjacent the optical transmit opening, and attaching an optical receive element to the package top plate adjacent the optical receive opening. A package body is formed onto the package top plate to define an optical transmit cavity receiving the optical transmit element and an optical receive cavity receiving the optical receive element.

公开(公告)号：US09448216B2

公开(公告)日：2016-09-20

申请号：US14511280

申请日：2014-10-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang Jin ,  Ravi Shankar

IPC: G01N27/12 ,  G01N33/00

CPC classification number: G01N33/0009 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A gas sensor device may include a gas sensor integrated circuit (IC) having a gas sensing surface, and bond pads adjacent to the gas sensing surface, and a frame having gas passageways extending therethrough adjacent the gas sensing surface. The gas sensor device may include leads, each having a proximal end spaced from the frame and bonded to a respective bond pad, and a distal end extending downwardly from the proximal end, and encapsulation material filling the space between the proximal ends of the leads and the frame.

Abstract translation: 气体传感器装置可以包括具有气体检测表面的气体传感器集成电路（IC）和与气体感测表面相邻的接合焊盘，以及具有在气体感测表面附近延伸穿过的气体通道的框架。 气体传感器装置可以包括引线，每个引线具有与框架间隔开并且接合到相应的接合焊盘的近端和从近端向下延伸的远端，以及填充引线的近端之间的空间的封装材料和 框架。

公开(公告)号：US20160099373A1

公开(公告)日：2016-04-07

申请号：US14968359

申请日：2015-12-14

Applicant: STMicroelectronics Pte Ltd

Inventor： Yonggang Jin ,  Wee Chin Judy Lim

IPC: H01L31/16 ,  H01L31/18 ,  H01L31/0232 ,  H01L25/16

CPC classification number: H01L31/16 ,  G01S7/4813 ,  G01S17/026 ,  G01V8/12 ,  H01L21/568 ,  H01L25/167 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167 ,  H01L31/18 ,  H01L31/186 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2924/3511 ,  H03K17/941 ,  H03K17/9631 ,  H03K17/9638 ,  H03K2217/96023 ,  Y10T156/1052 ,  Y10T156/1064

Abstract: An optical detection sensor functions as a proximity detection sensor that includes an optical system and a selectively transmissive structure. Electromagnetic radiation such as laser light can be emitted through a transmissive portion of the selectively transmissive structure. A reflected beam can be detected to determine the presence of an object. The sensor is formed by encapsulating the transmissive structure in a first encapsulant body and encapsulating the optical system in a second encapsulant body. The first and second encapsulant bodies are then joined together. In a wafer scale assembling the structure resulting from the joined encapsulant bodies is diced to form optical detection sensors.

Abstract translation: 光学检测传感器用作包括光学系统和选择性透射结构的接近检测传感器。 诸如激光的电磁辐射可以通过选择性透射结构的透射部分发射。 可以检测反射光束以确定物体的存在。 传感器通过将透射结构封装在第一密封体中并将光学系统封装在第二密封体内而形成。 然后将第一和第二密封剂体接合在一起。 在晶片规模中组装由连接的密封体产生的结构被切割以形成光学检测传感器。

公开(公告)号：US20150060891A1

公开(公告)日：2015-03-05

申请号：US14013507

申请日：2013-08-29

Applicant: STMicroelectronics Pte Ltd.

Inventor： Yonggang Jin

IPC: H01L31/173 ,  H01L23/00

CPC classification number: H01L31/173 ,  H01L21/568 ,  H01L24/14 ,  H01L24/19 ,  H01L24/20 ,  H01L24/81 ,  H01L24/96 ,  H01L27/14678 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00

Abstract: An electronics assembly includes a semiconductor die assembly, an enclosure affixed to the semiconductor die assembly, the enclosure defining first and second chambers over the semiconductor die assembly, and first and second optical elements mounted in the first and second chambers, respectively. The semiconductor die assembly includes a semiconductor die encapsulated in a molded material, an encapsulation layer located on the top surface of the semiconductor die, and at least one patterned metal layer and at least one dielectric layer over the encapsulation layer. Conductive pillars extend through the encapsulation layer for electrical connection to the semiconductor die. The encapsulation layer blocks optical crosstalk between the first and second chambers. A method is provided for making the electronics assembly.

Abstract translation: 电子组件包括半导体管芯组件，固定到半导体管芯组件的外壳，在半导体管芯组件上限定第一和第二腔室的外壳，以及安装在第一和第二腔室中的第一和第二光学元件。 半导体管芯组件包括封装在模制材料中的半导体管芯，位于半导体管芯的顶表面上的封装层，以及至少一个图案化金属层和封装层上的至少一个介电层。 导电柱延伸穿过封装层，以与半导体管芯电连接。 封装层阻止第一和第二腔室之间的光学串扰。 提供了一种用于制造电子组件的方法。

公开(公告)号：US20140353788A1

公开(公告)日：2014-12-04

申请号：US13907280

申请日：2013-05-31

Applicant: STMicroelectronics R&D Limited ,  STMicroelectronics Pte Ltd.

Inventor： Yonggang Jin ,  David Lawson ,  Colin Campbell ,  Anandan Ramasamy

IPC: H01L31/0216

CPC classification number: H01L31/02165 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02327 ,  H01L31/1013 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.

Abstract translation: 本公开的实施例涉及具有封装主体的光学封装，该封装主体在透明材料的至少一个表面上包括防光涂层。 防光涂层包括一个或多个开口，以允许光被传输到封装主体内的光学装置。 在一个实施例中，光保护涂层和开口允许基本上垂直的辐射被引导到封装主体内的光学装置。 在一个示例性实施例中，防光涂层位于透明材料的外表面上。 在另一个实施例中，防光涂层位于包装体内部的透明材料的内表面上。

公开(公告)号：US08796139B2

公开(公告)日：2014-08-05

申请号：US13722776

申请日：2012-12-20

Applicant: STMicroelectronics Pte Ltd.

Inventor： Anandan Ramasamy ,  Yonggang Jin ,  Yun Liu

IPC: H01L21/44

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/19 ,  H01L24/96 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/96 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/03 ,  H01L2924/00

Abstract: A bar formed from a reconstituted wafer and containing one or more conductive material filled voids is used to electrically and physically connect the top and bottom packages in a package-on-package (PoP) package. The bar is disposed in the fan out area of the lower package forming the PoP package.

Abstract translation: 由重构的晶片形成并包含一个或多个导电材料填充的空隙的条被用于电和物理地连接封装在封装（PoP）封装中的顶部和底部封装。 该条被布置在形成PoP包装的下部包装的扇形区域中。