摘要:
A clock data recovery circuit includes: a demodulation filter that receives a transmission signal transmitted by two orthogonal carrier waves having I and Q phases and executes demodulation to obtain a demodulated wave having an phase and a demodulated wave having a Q phase from the transmission signal; a first determination circuit that determines whether an absolute value of one of the two demodulated waves is greater than an eye opening maximum value at an ideal clock phase of the transmission signal; a second determination circuit that determines whether the one demodulated wave is greater than zero; a third determination circuit that determines whether the other one of the two demodulated waves is greater than zero; and a phase comparison unit that detects whether a phase of a clock signal included in the transmission signal is leading a phase of a data signal included in the transmission signal, based on determination results obtained by the first to third determination circuits.
摘要:
Precoded data transmitted from transmitting apparatus (101) is received by receiving apparatus (102) as duobinary data being ternary data via transmission path (103), and the duobinary data is converted into differential data being binary data by absolute value converter (121) comprising an AND gate and an OR gate.
摘要:
Function distinguishing marks are efficiently displayed which correspond to a plurality of functions assigned to a single operation key, respectively.A mobile phone (1) changes in accordance with the number of functions assigned to a single operation key the number of the function distinguishing marks to be displayed which indicate functions.
摘要:
A data receiving device comprises amplifying circuit 41 that amplifies received duobinary data with a given gain into an output signal, offset canceler 56, 57 that cancel an offset of the output signal from amplifying circuit 41, data determiner 43, 44 that sample the output signal from amplifying circuit 41 based on a first reference voltage and a second reference voltage which is of a lower level than the first reference voltage to determine which one of three levels of the duobinary data the received duobinary data have.
摘要:
A partial response signaling system includes a transmitter circuit configured to equalize input data in response to a control signal and to transmit a partial response signal through a transmission medium; and a receiver circuit configured to recover an output data from the partial response signal and to generate the control signal based on the partial response signal and an expected signal to output the control signal to the transmitter circuit.
摘要:
The invention provides a method for manufacturing a soft magnetic powder material covered by oxide layers at surfaces of the powder, by using a soft magnetic alloy powder containing a soft magnetic powder material and a second element such as Si having an oxidizing reactivity higher than iron, and heating the soft magnetic alloy powder in an atmosphere of a weak oxidizing gas by mixing a weak oxidizing gas in an inert gas, and oxidizing selectively the second element at surface layers of the powder while restraining an oxidation of iron to form thin oxide layers with high electrical resistance.
摘要:
A film obtained by heating a coating of a resin composition at a temperature lower than 300° C. but not lower than 40° C. in air or in an inert atmosphere. The resin composition includes a hydrosilylated polymer obtained by reacting at least one hydridosilsesquioxane compound of the following formula (1): (HSiO3/2)n (1) wherein n is an integer of 4-1000, with at least one compound of the following formula (2) R1—C≡C—R2 (2) wherein R1 represents a hydrogen atom, a monovalent organic group or a monovalent organosilicon group and R2 represents a hydrogen atom or a group of the formula: —(R′)q—C≡C—R where R′ represents a divalent organic group or a divalent organometallic group, R represents a monovalent organic group or a monovalent organosilicon group and q is 0 or 1 with the proviso that when R1 is a hydrogen atom R2 is a hydrogen atom.
摘要:
A novel perfluoropolyether-modified aminosilane cures into a film having improved water and oil repellency, parting and anti-staining properties. A surface treating agent comprising the aminosilane, and an article with a coating of the aminosilane are also provided.
摘要:
A fluorine-containing curable composition comprises (A) a linear perfluoro compound having at least two secondary amino groups per molecule and a divalent perfluoroalkylene or divalent perfluoropolyether structure in the main chain, and (B) a crosslinkable fluorinated compound having at least three functional groups which are crosslinkable with the secondary amino groups of (A). This composition readily cures, with standing at room temperature or heating only, to a cured product having excellent solvent and chemical resistance.
摘要:
In a circuit board obtained by providing a metallized layer of wiring on the surface or interior of an insulation substrate, the insulation substrate is, for example, a multi-layer circuit board or a package for semiconductor element, the insutating substrate obtained from a sintered body having a linear expansion coefficient of 8 to 18 ppm/.degree. C. at 40.degree. to 400.degree. C. which is prepared by sintering a molded body containing 20 to 80% of a glass having a liner expansion coefficient of 6 to 18 ppm/.degree. C. at 40.degree. to 400.degree. C. and 80 to 20% of a filler having a linear expansion coefficient of at least 6 ppm/.degree. C. When the circuit board of the present invention is surface mounted on an outer electric circuit substrate such as a printed wiring board having a large linear expansion coefficient, the occurrence of stress due to a difference between the linear expansion coefficients of both is suppressed, and the circuit board and the outer electric circuit can be electrically connected accurately and firmly over a long period of time. Furthermore, a mounted structure of a circuit board having high reliability which can sufficiently dealt with the use of multiple pins due to large sizing of a semiconductor element can be realized. Furthermore, simultaneous sintering with the Cu metallized layer can be performed, and since the binder can be removed efficiently, the product is of high quality and is cheap.