公开(公告)号：US06870272B2

公开(公告)日：2005-03-22

申请号：US10123547

申请日：2002-04-16

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

公开(公告)号：US20050139986A1

公开(公告)日：2005-06-30

申请号：US11064630

申请日：2005-02-24

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/04 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

摘要翻译： 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

公开(公告)号：US06723584B2

公开(公告)日：2004-04-20

申请号：US10255297

申请日：2002-09-26

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC分类号： H01L2148

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49174 ,  H01L2924/00014

摘要： A method of making a microelectronic assembly including a compliant interface includes providing a first support structure such as a flexible dielectric sheet having a first surface and a porous resilient layer on the first surface of the first support structure, stretching the first support structure and bonding the stretched first support structure to a ring structure. A platen is provided in engagement with a second surface of the first support structure. The first surface of a second support structure, such as a semiconductor wafer, is abutted against the porous layer and, after the abutting step, a first curable liquid is disposed between the first and second support structures and within the porous layer. The first curable liquid may be at least partially cured.

摘要翻译： 制造包括柔性界面的微电子组件的方法包括提供第一支撑结构，例如在第一支撑结构的第一表面上具有第一表面和多孔弹性层的柔性电介质片，拉伸第一支撑结构并将 将第一支撑结构拉伸成环结构。 提供与第一支撑结构的第二表面接合的压板。 第二支撑结构（例如半导体晶片）的第一表面抵靠多孔层，并且在邻接步骤之后，第一可固化液体设置在第一和第二支撑结构之间以及多孔层内。 第一可固化液体可以至少部分固化。

公开(公告)号：US4107063A

公开(公告)日：1978-08-15

申请号：US773578

申请日：1977-03-02

申请人： Zlata Kovac ,  Carlos Juan Sambucetti

发明人： Zlata Kovac ,  Carlos Juan Sambucetti

IPC分类号： C09D11/00 ,  C09C1/24 ,  C09D5/23 ,  H01F1/44 ,  H01F41/16 ,  H01F1/28

CPC分类号： C09C1/24 ,  H01F1/44 ,  H01F41/16 ,  C01P2006/42

摘要： Water based magnetic colloidal fluids, useable as inks, when prepared by coating chemically precipitated magnetite (Fe.sub.3 O.sub.4) with an adsorption site providing coating agent including certain organic anions, such as sulfates, sulfonates or amino carboxilates, and then dispersing the coated product with non-ionic, anionic or cationic surfactants may exhibit selectably cationic, anionic or non-ionic charge responsiveness.

摘要翻译： 当通过涂覆化学沉淀的磁铁矿（Fe3O4）的吸附位置提供包括某些有机阴离子（例如硫酸盐，磺酸盐或氨基羧酸盐）的包被剂制备时，可用作油墨的水基磁性胶体液体， 离子，阴离子或阳离子表面活性剂可以显示出选择性的阳离子，阴离子或非离子电荷响应性。

公开(公告)号：US20060049498A1

公开(公告)日：2006-03-09

申请号：US11259398

申请日：2005-10-26

申请人： Zlata Kovac ,  Craig Mitchell ,  Thomas DiStefano ,  John Smith

发明人： Zlata Kovac ,  Craig Mitchell ,  Thomas DiStefano ,  John Smith

IPC分类号： H01L23/02

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

摘要翻译： 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

公开(公告)号：US4239789A

公开(公告)日：1980-12-16

申请号：US37073

申请日：1979-05-08

申请人： Samuel E. Blum ,  Zlata Kovac ,  Robert J. von Gutfeld

发明人： Samuel E. Blum ,  Zlata Kovac ,  Robert J. von Gutfeld

IPC分类号： B23K26/34 ,  C23C18/16 ,  C23C18/31 ,  H05K3/18 ,  H05K3/22 ,  B05D3/06

CPC分类号： C23C18/1612 ,  B23K26/32 ,  B23K26/324 ,  B23K26/34 ,  C23C18/161 ,  H05K3/185 ,  B23K2203/08 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/54

摘要： A method for high resolution maskless electroless plating is described. Preferential plating results from exposing those regions where plating is sought to an energy beam to increase the plating rate by a factor of 10.sup.3 to 10.sup.4. This enhancement is sufficient to make masking unnecessary.

摘要翻译： 描述了一种用于高分辨率无掩蔽化学镀的方法。 优选电镀是将寻求电镀的那些区域暴露于能量束，从而将电镀速率提高103至104倍。这种增强足以使掩蔽不必要。

公开(公告)号：US3990981A

公开(公告)日：1976-11-09

申请号：US507850

申请日：1974-09-20

申请人： Zlata Kovac ,  Barbara A. Gardineer

发明人： Zlata Kovac ,  Barbara A. Gardineer

IPC分类号： H01F41/16 ,  H01F1/00 ,  C09D11/00

CPC分类号： H01F41/16

摘要： Water based magnetic ink containing non-ionic wetting agent and cationic surfactant.

摘要翻译： 含有非离子润湿剂和阳离子表面活性剂的水性磁性油墨。