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48 条记录 (耗时 0.025 秒)

    Shape-variable optical element, optical device and image pickup apparatus
    24.
    发明申请
    Shape-variable optical element, optical device and image pickup apparatus 失效
    形状可变光学元件，光学装置和图像拾取装置

    公开(公告)号：US20070279732A1

    公开(公告)日：2007-12-06

    申请号：US11807667

    申请日：2007-05-30

    申请人： Akira Kosaka ,  Tomoo Izumi ,  Mitsuhiro Fukuda

    发明人： Akira Kosaka ,  Tomoo Izumi ,  Mitsuhiro Fukuda

    IPC分类号： G02B26/00

    CPC分类号： G02B26/0875 ,  G02B26/0825

    摘要： A shape-variable optical element, which includes: a shape-variable section made up of an organic material that can be expanded and contracted by an electric field, in a direction of the electric field; and a pair of electrode layers to sandwich the shape-variable section, wherein amounts of expansion and contraction of the shape-variable section, which are generated by the electric field when a voltage is applied to the pair of electrode layers, have a distribution pattern in a surface perpendicular to the electric field.

    摘要翻译： 一种形状可变光学元件，包括：由电场方向可膨胀和收缩的有机材料构成的形状可变部分; 以及一对夹着形状可变部的电极层，其中，当对一对电极层施加电压时，通过电场产生的形状可变部的膨胀和收缩量具有分布图案 在垂直于电场的表面。

    Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards
    27.
    发明授权
    Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards 有权
    板件，柔性布线板以及制造柔性布线板的工艺

    公开(公告)号：US06596947B1

    公开(公告)日：2003-07-22

    申请号：US09937590

    申请日：2002-01-18

    申请人： Hideyuki Kurita ,  Masanao Watanabe ,  Toshihiro Shinohara ,  Mitsuhiro Fukuda ,  Yukio Anzai

    发明人： Hideyuki Kurita ,  Masanao Watanabe ,  Toshihiro Shinohara ,  Mitsuhiro Fukuda ,  Yukio Anzai

    IPC分类号： H05K103

    CPC分类号： H05K3/363 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/284 ,  H05K3/305 ,  H05K3/3457 ,  H05K3/3473 ,  H05K3/3494 ,  H05K2201/0129 ,  H05K2201/10977 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/065 ,  Y10T428/2804

    摘要： A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.

    摘要翻译： 本发明的板片2包括非热塑性树脂膜11，形成在非热塑性树脂膜11上的热塑性树脂膜10和形成在热塑性树脂膜10的表面上的金属布线8.金属布线8 被部分地暴露在板件2上以形成触点12.在触点12上形成低熔点金属涂层13，并且两个板片2a，2b在加热时被彼此挤压，其触点12a，12b与每个 使得热塑性树脂膜10a，10b软化以将板片2a，2b彼此粘合并且熔融金属涂层13a，13b熔化然后固化以将触点12a，12b彼此连接。 不用于连接的金属布线8的区域是将触点12彼此连接的布线17，并且可以在其表面上设置覆盖膜19。 触点12a，12b也可以通过施加超声波来连接。

    Multilayer flexible wiring boards
    28.
    发明授权
    Multilayer flexible wiring boards 有权
    多层柔性布线板

    公开(公告)号：US06395993B1

    公开(公告)日：2002-05-28

    申请号：US09671260

    申请日：2000-09-28

    申请人： Masayuki Nakamura ,  Mitsuhiro Fukuda

    发明人： Masayuki Nakamura ,  Mitsuhiro Fukuda

    IPC分类号： H05K100

    CPC分类号： H05K3/4635 ,  H01L2224/16237 ,  H05K1/0393 ,  H05K3/28 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/099

    摘要： The present invention aims to manufacture a reliable multilayer flexible wiring board at high yield. Flexible wiring board 10 used for multilayer flexible wiring board 40 of the present invention has metal coating 14 on the surface of metal wiring film 19, and metal coating 14 is exposed within the contact region. A wall member rising above the surface of metal coating 14 is provided around the exposed metal coating 14. The wall member is formed of wall face 23 of opening 17 in resin film 15 at the top of metal wiring film 19, for example. When bump 34 having low-melting metal coating 36 is contacted with metal coating 14 in said contact region and heated above the melting point of the solder metal under pressure, low-melting metal coating 36 melts. The molten low-melting metal is stopped by wall face 23 from overflowing outside the contact region so that any bridge cannot be formed by the solder metal between metal wiring film 19.

    摘要翻译： 本发明旨在以高产量制造可靠的多层柔性布线板。用于本发明的多层柔性布线板40的柔性布线板10在金属布线膜19的表面上具有金属涂层14，金属涂层14暴露 在接触区域内。 在露出的金属涂层14周围设置有在金属涂层14的上方上升的壁部件。壁部件例如由金属布线膜19的顶部的树脂膜15的开口17的壁面23形成。 当具有低熔点金属涂层36的凸块34与所述接触区域中的金属涂层14接触并在压力下加热到焊料金属的熔点以上时，低熔点金属涂层36熔化。 熔融的低熔点金属被壁面23阻止在接触区域外部溢出，使得任何桥接件不能由金属布线膜19之间的焊料金属形成。

    Dye usable for photographic lightsensitive material, fine solid particle dispersion of said dye and silver halide photographic lightsensitive material containing said fine solid particle dispersion of said dye
    29.
    发明授权
    Dye usable for photographic lightsensitive material, fine solid particle dispersion of said dye and silver halide photographic lightsensitive material containing said fine solid particle dispersion of said dye 失效
    用于照相感光材料的染料，所述染料和卤化银照相感光材料的细固体颗粒分散体含有所述染料的所述细固体颗粒分散体

    公开(公告)号：US06187929B1

    公开(公告)日：2001-02-13

    申请号：US09333078

    申请日：1999-06-14

    申请人： Mitsuhiro Fukuda ,  Motoaki Sugino ,  Akira Onishi

    发明人： Mitsuhiro Fukuda ,  Motoaki Sugino ,  Akira Onishi

    IPC分类号： C07D40306

    CPC分类号： C09B23/02 ,  G03C1/832

    摘要： A dye represented by the following formula (1); Formula (1)  wherein A represents an acidic nucleus, L1, L2 and L3 represent a methine group, n represents 0, 1 or 2, Z represents a nonmetalic atom group necessary to form a heterocyclic group by bonding with a nitrogen atom included in the above formula (1), Y represents a substituent represented by the following formula (2) or a heterocyclic group; Formula (2)  wherein R1 and R2 represent an alkyl group, and R1 and R2 may form a ring by bonding with each other, R3 represents a hydrogen atom or an electron withdrawing group: said dye represented by the above formula (1) has at least one carboxy group or one alkylsulfonamide group in an aromatic ring portion of its molecular structure.

    摘要翻译： 由下式（1）表示的染料; A表示酸性核的式（1），L1，L2和L3表示次甲基，n表示0,1或2，Z表示形成 杂环基与上述式（1）所示的氮原子键合，Y表示下述式（2）所示的取代基或杂环基;式（2）中，R 1和R 2表示烷基，R 1和 R2可以通过彼此键合形成环，R3表示氢原子或吸电子基团：由上式（1）表示的所述染料在其分子中的芳环部分中具有至少一个羧基或一个烷基磺酰胺基团 结构体。

    Automotive top coating composition
    30.
    发明授权
    Automotive top coating composition 失效
    汽车顶涂层组成

    公开(公告)号：US5409994A

    公开(公告)日：1995-04-25

    申请号：US118290

    申请日：1993-09-09

    申请人： Yasushi Nakao ,  Toru Ozaki ,  Mitsuhiro Fukuda ,  Motoshi Yabuta

    发明人： Yasushi Nakao ,  Toru Ozaki ,  Mitsuhiro Fukuda ,  Motoshi Yabuta

    IPC分类号： C08L61/28 ,  C09D143/04 ,  C09D161/28 ,  C09D133/14 ,  C09D125/18

    CPC分类号： C09D143/04 ,  C09D161/28 ,  C08L61/28

    摘要： The invention provides an automotive top coating composition, comprising as the main components;: (A) an acrylic polymer prepared by copolymerizing 5 to 40% by weight of an alkoxysilane-containing vinyl monomer which is a compound represented by the formula ##STR1## wherein A is ##STR2## R.sub.1 is a hydrogen atom or a methyl group, R.sub.2 is a bivalent aliphatic saturated hydrocarbon group having 1 to 6 carbon atoms, R.sub.3 and R.sub.4 are the same or different and are each a phenyl group, an alkyl group having 1 to 6 carbon atoms or an alkoxy group having 1 to 10 carbon atoms, R.sub.4 is an alkyl group having 1 to 10 carbon atoms, and n is an integer of 1 to 100, 5 to 50% by weight of a hydroxyl-containing vinyl monomer and 10 to 90% by weight of a vinyl monomer which is copolymerizable with the above vinyl monomers, and (B) an amino resin in an amount of 5 to 50% by weight based on the total amount of resin solids in the coating composition.

    摘要翻译： 本发明提供一种包含作为主要成分的汽车顶涂层组合物;（A）通过共聚5至40重量％的含烷氧基硅烷的乙烯基单体制备的丙烯酸类聚合物，该乙烯基单体是由下式表示的化合物 I）其中A是R 1是氢原子或甲基，R 2是具有1至6个碳原子的二价脂族饱和烃基，R 3和R 4相同或不同，并且各自是苯基，烷基 具有1至6个碳原子的基团或具有1至10个碳原子的烷氧基，R 4是具有1至10个碳原子的烷基，n是1至100的整数，5至50重量％的羟基 - 含有乙烯基单体和10〜90重量％的可与上述乙烯基单体共聚的乙烯基单体，和（B）氨基树脂的量为5-50重量％，基于树脂固体的总量 涂料组合物。