公开(公告)号：US6075427A

公开(公告)日：2000-06-13

申请号：US12304

申请日：1998-01-23

申请人： King Lien Tai ,  Jingsong Zhao

发明人： King Lien Tai ,  Jingsong Zhao

IPC分类号： H01L21/822 ,  H01L23/12 ,  H01L23/64 ,  H01L27/04 ,  H01P7/00 ,  H01P7/08 ,  H03H5/02 ,  H03H7/01 ,  H03H9/05 ,  H05K1/16

CPC分类号： H01P7/082 ,  H01L23/645 ,  H03H7/0115 ,  H01L2224/16 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H03H2001/0085 ,  H05K1/165

摘要： An MCM including a resonator made using conventional MCM fabrication techniques. The MCM's resonator is constructed with overlapping first and second spiral-shaped regions of metallic material separated by a layer of dielectric material. A via disposed in the layer of dielectric material, couples the spiral-shaped regions of metallic material together, thereby utilizing self winding and internal capacitance to gain resonance at frequencies between 500 MHz to 3GHz. The internal capacitance is increased by controlling the overlap between the first and second spiral-shaped regions of metallic material. On a high-resistivity substrate, the monolithic resonator achieves a Q of at least 19 at approximately 900MHz and at least 24 at approximately 2GHz.

摘要翻译： 包括使用常规MCM制造技术制造的谐振器的MCM。 MCM的谐振器由重叠的第一和第二螺旋形的金属材料区域构成，由一层电介质材料隔开。 布置在介电材料层中的通孔将金属材料的螺旋形区域耦合在一起，从而利用自绕组和内部电容来在500MHz至3GHz之间的频率处获得谐振。 通过控制金属材料的第一和第二螺旋形区域之间的重叠来增加内部电容。 在高电阻率基板上，单片谐振器在大约900MHz处获得至少19的Q，在大约2GHz下达到至少24的Q。

公开(公告)号：US5936831A

公开(公告)日：1999-08-10

申请号：US814051

申请日：1997-03-06

申请人： Ratnaji Rao Kola ,  King Lien Tai

发明人： Ratnaji Rao Kola ,  King Lien Tai

IPC分类号： H01G4/33 ,  H01L21/02 ,  H01L21/316 ,  H01L21/822 ,  H01L27/04 ,  H01G4/005 ,  H01G4/06

CPC分类号： H01L28/56 ,  H01L21/31687 ,  H01L28/40

摘要： In accordance with the invention, a thin film capacitor including a dielectric of nitrogen or silicon-doped tantalum oxide and at least one electrode including chromium. Preferably the capacitor is fabricated by anodically oxidizing TaN.sub.x or Ta.sub.2 Si and forming a Cr counterelectrode. The method is fully compatible with MCM processing. It produces anodic Ta.sub.2 O.sub.5 capacitors having exceptionally low leakage currents ( 4 MV/cm) and high capacitance densities (70 nF/cm.sup.2). The devices are stable at 350.degree. C. with excellent capacitor properties and are particularly useful as thin film capacitors of large area (>1 mm.sup.2).

摘要翻译： 根据本发明，一种薄膜电容器，其包括氮或掺硅氧化钽的电介质和至少一个包含铬的电极。 优选地，通过阳极氧化TaNx或Ta2Si并形成Cr反电极来制造电容器。 该方法与MCM处理完全兼容。 它产生具有极低漏电流（10 V时<1 nA / cm2），高击穿电场（> 4 MV / cm）和高电容密度（70 nF / cm2）的阳极氧化钽电容器。 器件在350℃下稳定，具有优异的电容器特性，特别适用于大面积（> 1 mm2）的薄膜电容器。

公开(公告)号：US5834160A

公开(公告)日：1998-11-10

申请号：US586347

申请日：1996-01-16

申请人： Alan E. Ferry ,  Byung Joon Han ,  Maureen Yee Lau ,  Robert T. Scruton, Sr. ,  King Lien Tai

发明人： Alan E. Ferry ,  Byung Joon Han ,  Maureen Yee Lau ,  Robert T. Scruton, Sr. ,  King Lien Tai

IPC分类号： G03F7/20 ,  H05K3/00 ,  H05K3/06 ,  G03C5/00 ,  G03B27/52

CPC分类号： G03F7/70216 ,  G03F7/2002 ,  G03F7/70241 ,  G03F7/70791 ,  H05K3/0082

摘要： The present inventors have discovered that fine patterns of metal or insulator can be formed on printed circuit board using conventional lithographic steppers with inverted projection lenses. The inverted projection lenses act as enlargement lenses rather than reducing lenses and exhibit a large depth of focus sufficient to accommodate the deviations of PC board from planarity. The inverted lens reduces the size of the image needed at the mask, permitting multiple mask levels to be combined on a single glass. This reduces the cost of the mask set and permits the use of smaller glass masks having greater accuracy and dimensional stability than the convention mylar masks used for PC board. By inverting the projection lenses on near-obsolete steppers, applicants were able to form metal patterns on PC board of finer dimension than heretofore reported. Inverting a 5.times. ZEISS lens on a GCA 6300A stepper, applicants were able to form vias of less than 25 .mu.m diameter, pattern metal lines and spaces of less than 25 .mu.m, and obtain overlay registration accuracy of less than 25 .mu.m. The field size was larger than 1 in.sup.2, and the depth of focus was greater than 50 .mu.m.

摘要翻译： 本发明人已经发现，使用具有倒置投影透镜的常规光刻步进器可以在印刷电路板上形成金属或绝缘体的精细图案。 反转的投影透镜作为放大透镜而不是减少透镜并且展现出足够的焦深以适应PC板与平面度的偏差。 倒置的镜头减少了掩模所需的图像的尺寸，允许在单个玻璃上组合多个掩模级别。 这降低了掩模组的成本，并且允许使用比用于PC板的常规聚酯薄膜掩模更大的精度和尺寸稳定性的较小的玻璃面罩。 通过将投影镜片倒置在近陈旧的步进器上，申请人能够在PC板上形成比迄今报告的更细的尺寸的金属图案。 将5x蔡司镜头倒置在GCA 6300A步进机上，申请人能够形成直径小于25微米的通孔，图案金属线和小于25微米的间隙，并获得小于25微米的覆盖对准精度。 场尺寸大于1 in2，焦点深度大于50m。

公开(公告)号：US5747982A

公开(公告)日：1998-05-05

申请号：US761047

申请日：1996-12-05

申请人： Douglas John Dromgoole ,  Anatoly Feygenson ,  Robert Charles Frye ,  Ashraf Wagih Lotfi ,  King Lien Tai

发明人： Douglas John Dromgoole ,  Anatoly Feygenson ,  Robert Charles Frye ,  Ashraf Wagih Lotfi ,  King Lien Tai

IPC分类号： H01L25/16 ,  H05K1/02 ,  G05F5/00 ,  H03H7/00

CPC分类号： H05K1/0256 ,  H01L25/162 ,  H05K1/0262 ,  H05K1/0274 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/1003 ,  Y10S323/902

摘要： A silicon-on-silicon dual MCM apparatus comprising a printed circuit board having a voltage isolation boundary contained therein supporting a pair of multi-chip modules on either side of the voltage isolation boundary. The MCMs safely convey signals across the isolation boundary via discrete optical coupling means or the like. The optical coupling means allow safe and efficient conveyance of signals across the voltage isolation boundary enabling a designer to group high voltage components on one side of the boundary and low voltage components on the other side of the boundary. This obviates to a degree the need for multi-layered PCBs. A relatively large number of passive components (resistors and capacitors) are integrated into a silicon substrate with flip-chip analog integrated circuits (ICs). Operational characteristics of the controller are verified after integration and are compared to the discrete version. High voltage isolation requirements, interference, and noise are all considered to determine the most critical portions of the dual MCM layout and design.

摘要翻译： 一种硅上硅双MCM装置，包括其中包含电压隔离边界的印刷电路板，其在电压隔离边界的两侧支撑一对多芯片模块。 MCM通过离散光耦合装置等将信号安全地传送到隔离边界。 光耦合装置允许跨越电压隔离边界安全有效地传输信号，使得设计人员可以对边界一侧的高压部件和边界另一侧的低电压部件进行分组。 这在一定程度上消除了对多层PCB的需求。 通过倒装芯片模拟集成电路（IC）将相对大量的无源元件（电阻和电容器）集成到硅衬底中。 控制器的操作特性在集成后验证，并与离散版本进行比较。 高电压隔离要求，干扰和噪声都被认为是确定双MCM布局和设计的最关键部分。

公开(公告)号：US5699105A

公开(公告)日：1997-12-16

申请号：US534909

申请日：1995-09-28

申请人： Howard Zehua Chen ,  Michael Gunnar Johnson ,  King Lien Tai

发明人： Howard Zehua Chen ,  Michael Gunnar Johnson ,  King Lien Tai

IPC分类号： H04N5/00 ,  H04N7/16 ,  H04N7/173 ,  H04N21/462

CPC分类号： H04N7/17318

摘要： Only one or only a few channels are sent at a time from circuitry located in a curbside box, via a link such as either a coaxial or a fiber cable, into a customer's home TV set or personal computer. However, many more than a few channels are delivered to the curbside box, via a link such as a fiber or a coaxial cable, from a central office or a central bank of paid video-movies to be selected by the customers. Thus whereas the link from the central office or central bank is relatively broad-band (e.g. 500 MHz to 1,000 MHz), the cable from the curbside to the home (or any other kind of building) can be relatively narrow-band (e.g., 5 MHz to 50 MHz). The curbside box serves a multitude of homes--a separate (narrow-band) cable running to each home from the (same) curbside switch. Each channel can be a free radio or free TV channel, a stored or an on-line newspaper pay channel, or a pay TV channel, or a pay-per-view channel (i.e., the customer must give advance notice per view, and may begin viewing in the middle of a selected program, or may come in at the beginning of a selected program with a short delay, depending on the sender's arrangement). Requests from each TV set in each home (e.g., initiated by means of a hand-held remote control infra-red sending device) can be sent to the curbside box from the home along a link such as a wire or along the same curbside-to-home cable itself. In addition, billing of customers can be accomplished by means of another link connecting a junction in the wire or in the curbside-to-home cable to one or more remote billing centers.

摘要翻译： 一次，通过诸如同轴或光纤电缆的链路将位于路边箱中的电路一次发送到客户的家庭电视机或个人计算机中。 然而，许多不止一些的渠道通过诸如光纤或同轴电缆的链路从中央局或中央银行的付费视频电影传送到路边箱，由客户选择。 因此，从中央局或中央银行的链路相对宽带（例如，500MHz至1,000MHz），从路边到家庭（或任何其他类型的建筑物）的电缆可以是相对窄带的（例如， 5 MHz至50 MHz）。 路边箱供应多个家庭 - 一个单独的（窄带）电缆，从（相同）路边交换机运行到每个家庭。 每个频道可以是免费收音机或免费电视频道，存储或在线报纸付费频道，付费电视频道或按次付费频道（即客户必须按照每个视图提前通知，以及 可以在所选程序的中间开始查看，或者可以根据发送者的安排，在所选节目的开始时以短的延迟进入视频。 每个家庭中的每个电视机的请求（例如，通过手持式遥控红外发射装置发起）可以沿着诸如电线或沿同一路边的链路从家庭发送到路边箱， 家庭电缆本身。 此外，客户的计费可以通过将线路中的路口或路边到家庭电缆连接到一个或多个远程计费中心的另一个链路来实现。

公开(公告)号：US06683384B1

公开(公告)日：2004-01-27

申请号：US08946693

申请日：1997-10-08

申请人： Dean Paul Kossives ,  Fan Ren ,  King Lien Tai

发明人： Dean Paul Kossives ,  Fan Ren ,  King Lien Tai

IPC分类号： H01L2348

CPC分类号： H01L24/10 ,  H01L23/147 ,  H01L23/538 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/00014

摘要： The specification describes integrated circuit air isolated crossover interconnections designed for flip chip multi-chip module interconnection technology. The crossovers are made using a crossover interconnection substrate separate from the interconnection substrate of the integrated circuit. In one embodiment the integrated circuit is flip chip bonded to a multi-chip or multi-component interconnection substrate, and the crossover interconnections are made through solder bumps or balls soldered to a conductive layer on the crossover interconnection substrate. In another embodiment the crossover is made via a crossover substrate flip chip bonded to an integrated circuit mounted on a multi-chip or multi-component interconnection substrate.

摘要翻译： 该规范描述了针对倒装芯片多芯片模块互连技术设计的集成电路空气隔离交叉互连。 使用与集成电路的互连基板分离的交叉互连基板来进行交叉。 在一个实施例中，集成电路被倒装芯片接合到多芯片或多组件互连衬底，并且通过焊接到交叉互连衬底上的导电层的焊料凸块或球形成交叉互连。 在另一个实施例中，通过结合到安装在多芯片或多部件互连基板上的集成电路的交叉基板倒装芯片来进行交叉。

公开(公告)号：US06465336B2

公开(公告)日：2002-10-15

申请号：US09873551

申请日：2001-06-04

申请人： Thaddeus John Gabara ,  King Lien Tai

发明人： Thaddeus John Gabara ,  King Lien Tai

IPC分类号： H01L2144

CPC分类号： H01L23/50 ,  H01L23/5386 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

摘要： A multi-chip module (“MCM”) and methods of operation and manufacture thereof. The MCM includes: (1) a substrate for supporting a plurality of separate integrated circuit (IC) chips thereon, (2) first and second separate IC chips mounted on the substrate, the first separate IC chip including first and second circuit portions coupled together by at least one signal conductor, and (3) interconnecting means that directly couples at least one signal conductor of the first separate IC chip to the second separate IC chip, the interconnecting means bypassing the second circuit portion of the first separate IC chip.

摘要翻译： 多芯片模块（“MCM”）及其操作和制造方法。 MCM包括：（1）用于在其上支撑多个分离的集成电路（IC）芯片的基板，（2）安装在基板上的第一和第二分离IC芯片，第一分离IC芯片包括耦合在一起的第一和第二电路部分 通过至少一个信号导体，以及（3）将第一分离IC芯片的至少一个信号导体直接耦合到第二分离IC芯片的互连装置，互连装置绕过第一分离IC芯片的第二电路部分。

公开(公告)号：US06281590B1

公开(公告)日：2001-08-28

申请号：US08838536

申请日：1997-04-09

申请人： Thaddeus John Gabara ,  King Lien Tai

发明人： Thaddeus John Gabara ,  King Lien Tai

IPC分类号： H01L2348

CPC分类号： H01L23/50 ,  H01L23/5386 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

摘要： A multi-chip module (“MCM”) and methods of operation and manufacture thereof The MCM includes: (1) a substrate for supporting a plurality of separate integrated circuit (IC) chips thereon, (2) first and second separate IC chips mounted on the substrate, the first separate IC chip including first and second circuit portions coupled together by at least one signal conductor, and (3) interconnecting means that directly couples at least one signal conductor of the first separate IC chip to the second separate IC chip, the interconnecting means bypassing the second circuit portion of the first separate IC chip.

摘要翻译： 多芯片模块（“MCM”）及其操作和制造方法MCM包括：（1）用于在其上支撑多个分离的集成电路（IC）芯片的基板，（2）安装有第一和第二分离的IC芯片 在基板上，第一分离IC芯片包括由至少一个信号导体耦合在一起的第一和第二电路部分，以及（3）将第一分离IC芯片的至少一个信号导体直接耦合到第二分离IC芯片的互连装置 互连装置绕过第一分离IC芯片的第二电路部分。

公开(公告)号：US06232047B1

公开(公告)日：2001-05-15

申请号：US09261093

申请日：1999-03-02

申请人： Robert Charles Frye ,  Yee Leng Low ,  King Lien Tai

发明人： Robert Charles Frye ,  Yee Leng Low ,  King Lien Tai

IPC分类号： G03C500

CPC分类号： H05K3/246 ,  H01P11/003 ,  H05K1/0242 ,  H05K3/146 ,  H05K2201/0317

摘要： The specification describes method for improving the edge acuity of conductive metal strips formed by thick film paste techniques. The advantages of the bulk properties of strips formed using thick film technology are realized while the drawback of poor edge definition is overcome using a thin film trim strip at the edge of the conductive strip.

摘要翻译： 该说明书描述了用于改善由厚膜糊技术形成的导电金属条的边缘敏锐度的方法。 实现了使用厚膜技术形成的条的体积特性的优点，同时利用在导电条的边缘处的薄膜修剪带克服了差的边缘限定的缺点。

公开(公告)号：US6029224A

公开(公告)日：2000-02-22

申请号：US477175

申请日：1995-06-07

申请人： Abhaya Asthana ,  Douglas E. Haggan ,  King Lien Tai

发明人： Abhaya Asthana ,  Douglas E. Haggan ,  King Lien Tai

IPC分类号： G06F12/06 ,  G06F12/08 ,  G06F12/10 ,  G06F13/16 ,  G06F13/368

CPC分类号： G06F12/1027 ,  G06F12/0607 ,  G06F12/08 ,  G06F13/1694

摘要： An apparatus is provided that improves memory storage and access speed by repackaging various types of memories, SRAM, DRAM, and Disk, into a single storage unit. Each unit contains a slice of all the various memories along with programmable logic to control the accessing of the memories. This unit appears to the central processing unit (CPU) of a computer system as an extremely large secondary cache. Independent management of each unit greatly reduces bus traffic to implement any particular address space. By using a plurality of these memory units, an extremely large amount of memory can be accessed by the CPU with the speed of accessing a cache system.

摘要翻译： 提供了一种通过将各种类型的存储器，SRAM，DRAM和Disk重新打包成单个存储单元来提高存储器存储和访问速度的装置。 每个单元包含所有各种存储器的切片以及可编程逻辑以控制存储器的访问。 该单元以计算机系统的中央处理单元（CPU）显示为极大的二级缓存。 每个单元的独立管理大大减少了总线流量以实现任何特定的地址空间。 通过使用多个这样的存储单元，CPU可以以高速访问高速缓存系统来访问极大量的存储器。