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    COUPLING SCHEMES FOR GIMBALED SCANNING MIRROR ARRAYS
    21.
    发明申请
    COUPLING SCHEMES FOR GIMBALED SCANNING MIRROR ARRAYS 有权
    用于扫描扫描镜阵列的耦合方案

    公开(公告)号：US20160178895A1

    公开(公告)日：2016-06-23

    申请号：US14599507

    申请日：2015-01-18

    Applicant: APPLE INC.

    Inventor： Yuval Gerson ,  Naftali Chayat ,  Noel Axelrod ,  Alexander Shpunt

    IPC: G02B26/10 ,  B81C1/00 ,  G02B26/08

    CPC classification number: G02B26/101 ,  B81B2201/04 ,  B81C1/0015 ,  B81C2201/013 ,  G01S7/4817 ,  G01S17/10 ,  G01S17/42 ,  G01S17/89 ,  G02B26/085

    Abstract: A scanning device includes a substrate, which is etched to define an array of two or more parallel rotating members and a gimbal surrounding the rotating members. First hinges connect the gimbal to the substrate and defining a first axis of rotation, about which the gimbal rotates relative to the substrate. Second hinges connect the rotating members to the support and defining respective second, mutually-parallel axes of rotation of the rotating members relative to the support, which are not parallel to the first axis.

    Abstract translation: 扫描装置包括被蚀刻以限定两个或更多个平行旋转构件的阵列的基底和围绕旋转构件的万向节。 第一铰链将万向架连接到基板并且限定第一旋转轴线，万向架绕该基板相对于基板旋转。 第二铰链将旋转构件连接到支撑件并且限定旋转构件相对于不平行于第一轴线的支撑件的相应的第二相互平行的旋转轴线。

    Method for producing a micromechanical component, and micromechanical component
    22.
    发明授权
    Method for producing a micromechanical component, and micromechanical component 有权

    公开(公告)号：US09365410B2

    公开(公告)日：2016-06-14

    申请号：US14624071

    申请日：2015-02-17

    Applicant: Robert Bosch GmbH

    Inventor： Dietmar Haberer

    IPC: H01L21/00 ,  B81B3/00 ,  B81B1/00 ,  B81B7/02 ,  B81C1/00

    CPC classification number: B81B1/004 ,  B81B7/02 ,  B81B2201/04 ,  B81B2201/047 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00103 ,  B81C2201/0194 ,  B81C2203/0172

    Abstract: A method for producing a micromechanical component, and a micromechanical component, includes providing a substrate having first and second outer surfaces, the second surface facing away from the first surface; forming a through-hole through the substrate from the first outer surface up to the second outer surface; attaching an optical functional layer, on the second outer surface, to cover the through-hole; removing a first segment of the substrate on the first surface of the substrate so that there arises a third outer surface inclined relative to the second surface, the third surface facing away from the second surface, the inclined surface enclosing the through-hole; and separating the micromechanical component by separating a first part of the substrate, having the through-hole, and a second part, attached to the first part, of the optical functional layer from a remaining part of the substrate and a remaining part of the optical functional layer.

    FABRICATION OF MEMS DEVICE WITH AUTOMATED DISPENSING OF DAMPING FLUID AND VISCOSITY CONTROL
    24.
    发明公开
    FABRICATION OF MEMS DEVICE WITH AUTOMATED DISPENSING OF DAMPING FLUID AND VISCOSITY CONTROL 审中-公开

    公开(公告)号：US20240174510A1

    公开(公告)日：2024-05-30

    申请号：US18436381

    申请日：2024-02-08

    Applicant: MIRRORCLE TECHNOLOGIES, INC.

    Inventor： Stefan Richter ,  Johannes Kindt ,  Veljko Milanovic

    IPC: B81B3/00 ,  H02N1/00

    CPC classification number: B81B3/0078 ,  H02N1/008 ,  B81B2201/04 ,  B81B2203/0154 ,  B81B2203/058

    Abstract: A microelectromechanical system (MEMS) device comprising a wafer including a MEMS device in a substrate of the wafer is mounted to a fluid dispenser stage. The MEMS device has a damping structure coupled to a suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to the fixed part of the substrate. The damping structure extends into a gap between the suspended element and fixed part of the substrate. The fluid confinement structures permit movement of the damping structure within a limited portion of the gap and confine a viscoelastic fluid to the limited portion of the gap. A viscoelastic fluid is deposited onto the wafer in an area of the wafer configured to communicate the viscoelastic fluid into the limited portion of the gap.

    MEMS DEVICE WITH DAMPING FLUID VERTICALLY SANDWICHED BETWEEN MOVING AND NON-MOVING STRUCTURES
    25.
    发明公开
    MEMS DEVICE WITH DAMPING FLUID VERTICALLY SANDWICHED BETWEEN MOVING AND NON-MOVING STRUCTURES 审中-公开

    公开(公告)号：US20240174509A1

    公开(公告)日：2024-05-30

    申请号：US18436373

    申请日：2024-02-08

    Applicant: MIRRORCLE TECHNOLOGIES, INC.

    Inventor： Stefan Richter ,  Johannes Kindt ,  Veljko Milanovic

    IPC: B81B3/00 ,  H02N1/00

    CPC classification number: B81B3/0078 ,  H02N1/008 ,  B81B2201/04 ,  B81B2203/0154 ,  B81B2203/058

    Abstract: A microelectromechanical system (MEMS) device includes a substrate, a suspended element and a damping structure connected to the suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to a fixed part of the substrate. The damping structure extends into a gap between the suspended element and the fixed part of the substrate. The damping structure includes one or more winglets that protrude over a recessed portion of the fixed part of the substrate. The fluid confinement structures are formed by the recessed portion of the fixed substrate and are configured to permit movement of the damping structure over the recessed portion of the substrate and confine a viscoelastic fluid to the limited portion of the gap underneath the winglets.

    SYSTEMS AND METHODS FOR A TIME-BASED OPTICAL PICKOFF FOR MEMS SENSORS
    29.
    发明申请
    SYSTEMS AND METHODS FOR A TIME-BASED OPTICAL PICKOFF FOR MEMS SENSORS 有权
    用于MEMS传感器的基于时间的光学PICKOFF的系统和方法

    公开(公告)号：US20160377434A1

    公开(公告)日：2016-12-29

    申请号：US14860443

    申请日：2015-09-21

    Applicant: Honeywell International Inc.

    Inventor： Robert D. Horning ,  Grant Lodden

    IPC: G01C19/5726 ,  G01C19/574 ,  G01P15/03 ,  G02B6/293

    CPC classification number: G01C19/5726 ,  B81B2201/0228 ,  B81B2201/04 ,  B81B2203/053 ,  G01C19/5621 ,  G01C19/5656 ,  G01C19/574 ,  G01C25/00 ,  G01P15/032 ,  G01P15/093 ,  G01P21/00 ,  G01P2015/0822 ,  G02B6/29331

    Abstract: Systems and methods for a time-based optical pickoff for MEMS sensors are provided. In one embodiment, a method for an integrated waveguide time-based optical-pickoff sensor comprises: launching a light beam generated by a light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting changes in an area of overlap between the coupling port and a moving sensor component separated from the coupling port by a gap by measuring an attenuation of the light beam at the optical output port, wherein the moving sensor component is moving in-plane with respect a surface of the first substrate comprising the coupling port and the coupling port is positioned to detect movement of an edge of the moving sensor component.

    Abstract translation: 提供了用于MEMS传感器的基于时间的光学拾取的系统和方法。 在一个实施例中，一种用于集成波导时基的光学传感器传感器的方法包括：将由光源产生的光束发射到在第一衬底内单片制造的集成波导光学检测器，所述集成波导光学检测器包括 光输入端口，耦合端口和光输出端口; 并且通过测量光输出端口处的光束的衰减来检测耦合端口和与耦合端口分离的移动传感器部件之间的重叠区域的变化，其中移动传感器部件正在与平面内移动， 相对于包括耦合端口的第一基板的表面和耦合端口被定位成检测移动的传感器部件的边缘的移动。

    WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING
    30.
    发明申请
    WAFER LEVEL MEMS PACKAGE INCLUDING DUAL SEAL RING 有权
    WAFER LEVEL MEMS封装包括双密封圈

    公开(公告)号：US20160376146A1

    公开(公告)日：2016-12-29

    申请号：US14748482

    申请日：2015-06-24

    Applicant: Raytheon Company

    Inventor： Buu Q. Diep ,  Adam M. Kennedy ,  Thomas Allan Kocian ,  Mark Lamb

    IPC: B81C1/00 ,  B81B7/00

    CPC classification number: B81B7/0058 ,  B81B7/0041 ,  B81B2201/0207 ,  B81B2201/04 ,  B81C1/00269 ,  B81C1/00317 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019

    Abstract: A microelectromechanical systems (MEMS) package includes a substrate extending between a first pair of outer edges to define a length and a second pair of outer edges to define a width. A seal ring assembly is disposed on the substrate and includes at least one seal ring creating a first boundary point adjacent to at least one MEMS device and a second boundary point adjacent at least one of the outer edges. The package further includes a window lid on the seal ring assembly to define a seal gap containing the at least one MEMS device. The seal ring assembly anchors the window lid to the substrate at the second boundary point such that deflection of the window lid into the seal gap is reduced.

    Abstract translation: 微机电系统（MEMS）封装包括在第一对外边缘之间延伸以限定长度的基板和限定宽度的第二对外边缘。 密封环组件设置在基板上，并且包括至少一个密封环，其形成与至少一个MEMS装置相邻的第一边界点和邻近至少一个外边缘的第二边界点。 封装还包括在密封环组件上的窗口盖，以限定包含至少一个MEMS器件的密封间隙。 密封圈组件在第二边界点将窗口盖固定到基底，使得窗口盖进入密封间隙的偏转减小。

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