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42 条记录 (耗时 0.016 秒)

    Conductive film and method for producing the same
    23.
    发明授权
    Conductive film and method for producing the same 有权
    导电膜及其制造方法

    公开(公告)号：US08658907B2

    公开(公告)日：2014-02-25

    申请号：US13164276

    申请日：2011-06-20

    申请人： Akira Ichiki

    发明人： Akira Ichiki

    IPC分类号： H05K1/09 ,  G03F7/20

    CPC分类号： G06F3/044 ,  G03F7/0007 ,  G03F7/06 ,  G03F7/0957 ,  G03F7/2014 ,  G06F2203/04103 ,  G06F2203/04112

    摘要： A conductive film has a transparent support, a first conductive silver image disposed on one main surface of the transparent support, and a second conductive silver image disposed on the other main surface of the transparent support. The first and second conductive silver images are obtained by forming at least one silver halide emulsion layer on each of the surfaces of the transparent support and then exposing and developing the silver halide emulsion layer. The first silver image and the second silver image each contain a net-like structure in a region required to be transparent. The net-like structure comprises thin metal wires having a line width of 10 μm or less, and forms a conductive layer having a sheet resistance of 50 ohm/sq or less.

    摘要翻译： 导电膜具有透明支撑体，设置在透明支撑体的一个主表面上的第一导电银图像和布置在透明支撑体的另一个主表面上的第二导电银图像。 通过在透明支撑体的每个表面上形成至少一个卤化银乳剂层，然后曝光和显影卤化银乳剂层，获得第一和第二导电银图像。 第一个银色图像和第二个银色图像在需要透明的区域中都包含网状结构。 网状结构包括具有10μm或更小的线宽的细金属线，并且形成具有50欧姆/平方或更小的薄层电阻的导电层。

    Method for fabricating printing plate with fine pattern using electric field
    24.
    发明申请
    Method for fabricating printing plate with fine pattern using electric field 有权
    使用电场制造精细图案的印版的方法

    公开(公告)号：US20070154842A1

    公开(公告)日：2007-07-05

    申请号：US11415280

    申请日：2006-05-02

    申请人： Oh Kwon

    发明人： Oh Kwon

    IPC分类号： G03F7/00

    CPC分类号： G03F7/405 ,  B41C1/02 ,  B41C1/025 ,  C25F3/14 ,  G03F7/0957 ,  G03F7/11

    摘要： A fabricating method of a printing plate includes forming a first conductive layer on an upper surface of a printing plate, forming a second conductive layer on a lower surface of the printing plate, forming an etch-resist pattern by etching a portion of the first conductive layer, submerging the printing plate, the second conductive layer and the etch-resist pattern into an electrolytic solution, and applying an electrical field between the etch-resist pattern and the second conductive layer so that the electrolytic solution is dissociated to form an anisotropically etched fine pattern in the printing plate.

    摘要翻译： 印版的制造方法包括在印版的上表面上形成第一导电层，在印版的下表面上形成第二导电层，通过蚀刻第一导电层的一部分形成蚀刻抗蚀剂图案 将印版，第二导电层和抗蚀剂图案浸没到电解溶液中，以及在抗蚀剂图案和第二导电层之间施加电场，使得电解液离解以形成各向异性蚀刻 印版中的精细图案。

    Two-sided imaging material
    25.
    发明授权
    Two-sided imaging material 失效
    双面成像材料

    公开(公告)号：US6030740A

    公开(公告)日：2000-02-29

    申请号：US266615

    申请日：1999-03-11

    申请人： Alexander Y. Polykarpov

    发明人： Alexander Y. Polykarpov

    IPC分类号： G03F7/004 ,  G03F7/00 ,  G03F7/095 ,  G03C1/72

    CPC分类号： G03F7/0957 ,  G03F7/002

    摘要： A new digital printer media which allows to create images on both sides of a single sheet is proposed. The media is printed in a new Cycolor printer which utilizes two LED printer heads and one developer head/device. The film consists of the top and the bottom layers of capsules/developer coats on clear polyester (top and bottom) with the white polyester with adhesive on both sides as the separator. The color producing capsules/developer mixture is coated on clear polyester. The coated film is then laminated with white polyester containing adhesive on both sides. The top side of the white polyester remains protected by the removable liner. Thus created film is then used to laminate another layer of capsule/developer coated clear polyester. The double sided film is thus created. Following exposure from both sides will occur independently by a set of two LED heads. Developing pressure can be applied from one side. Two images can be formed at the same time on both sides of a single sheet.

    摘要翻译： 提出了一种新的数字打印机介质，允许在单张纸的两面上创建图像。 介质印刷在一台新的Cycolor打印机中，该打印机采用两个LED打印头和一个显影头/设备。 该薄膜由透明聚酯（顶部和底部）上的胶囊/显影剂涂层的顶层和底层组成，白色聚酯与两侧的粘合剂作为分离器。 生色胶囊/显色剂混合物涂在透明聚酯上。 然后将涂膜与两侧的含白色聚酯的粘合剂层压。 白色聚酯的顶部保持由可移除的衬垫保护。 然后将如此制备的膜用于层压另一层胶囊/显影剂涂覆的透明聚酯。 因此创建双面胶片。 从两侧曝光后将由一组两个LED头独立发生。 显影压力可以从一边应用。 可以在单张纸的两面同时形成两张图像。

    Laminate for the formation of beam leads for IC chip bonding
    26.
    发明授权
    Laminate for the formation of beam leads for IC chip bonding 失效
    用于形成用于IC芯片接合的光束引线的层叠体

    公开(公告)号：US5098814A

    公开(公告)日：1992-03-24

    申请号：US514814

    申请日：1990-04-26

    申请人： Scott E. Tunney ,  John J. Fitzgerald

    发明人： Scott E. Tunney ,  John J. Fitzgerald

    IPC分类号： G03F7/032 ,  G03F7/075 ,  G03F7/095

    CPC分类号： G03F7/032 ,  G03F7/0757 ,  G03F7/0957

    摘要： A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips comprising:(a) a flexible metal strip(b) a layer of a first resist adhered to one surface of the metal strip, and(c) a layer of a second resist adhered to the opposite surface of the metal strip, wherein the second resist is a negative-working resist which forms a semi-interpenetrating polymer network-II upon curing and comprises a homogeneous blend.(A) a solvent soluble polyimide-siloxane containing about 0.5-30 weight percent silicon and (B) an ethylenically unsaturated multifunctional monomer. The siloxane units in the polyimide-siloxane have from 10 to about 200 ##STR1## linkages per unit, more preferably from about 15 to about 100 linkages, and most preferably from about 40 to about 100 linkages per siloxane unit. A second embodiment of the invention comprises a metal strip having one side thereof, a composition obtained by curing the above-identified curable composition. Curable compositions of this invention can be cured by either actinic radiation; for example, ultraviolet light, or by thermal radiation. In the cured composition, the polymer produced upon polymerization of the monomer, and the polyimide portion of the polyimide-siloxane form a homogeneous blend, in which the siloxane portion of the polyimide-siloxane is phase separated. The cured composition is a semi-interpenetrating network. The cured composition is especially useful in the fabrication of electronic devices such as frames of metal beam leads to be bonded to integrated circuit (IC) chips since it reduces stress at the polymer/metal interface, thereby reducing curl in such thin, coated objects.

    摘要翻译： 一种层压板，适于制造结合到集成电路芯片的金属梁引线的框架，其包括：（a）柔性金属条（b）附着在所述金属条的一个表面上的第一抗蚀剂层，以及（c） 粘附到金属带的相对表面的第二抗蚀剂层，其中第二抗蚀剂是负性抗蚀剂，其在固化时形成半互穿聚合物网络II并且包含均匀的共混物。 （A）含有约0.5-30重量％硅的溶剂可溶性聚酰亚胺硅氧烷和（B）烯属不饱和多官能单体。 聚酰亚胺 - 硅氧烷中的硅氧烷单元每单位具有10至约200个键，更优选约15至约100个键，最优选约40至约100个键。 本发明的第二实施方案包括具有一侧的金属带，通过固化上述可固化组合物获得的组合物。 本发明的可固化组合物可通过光化辐射固化; 例如紫外光，或通过热辐射。 在固化的组合物中，在单体聚合时产生的聚合物和聚酰亚胺 - 硅氧烷的聚酰亚胺部分形成均匀的共混物，其中聚酰亚胺 - 硅氧烷的硅氧烷部分相分离。 固化的组合物是半互穿网络。 固化的组合物特别可用于制造电子器件，例如将金属束引线的框架结合到集成电路（IC）芯片，因为它减少了聚合物/金属界面处的应力，从而减少了这种薄的涂覆物体的卷曲。

    Method of making submicron circuit structures
    27.
    发明授权
    Method of making submicron circuit structures 失效
    制造亚微米电路结构的方法

    公开(公告)号：US4557995A

    公开(公告)日：1985-12-10

    申请号：US311831

    申请日：1981-10-16

    申请人： Alec N. Broers ,  Robert B. Laibowitz

    发明人： Alec N. Broers ,  Robert B. Laibowitz

    IPC分类号： G03F1/00 ,  G03F1/08 ,  G03F7/095 ,  G03F7/20 ,  H01L21/027 ,  H01L21/30 ,  H05K3/00 ,  H05K3/04 ,  H05K3/06 ,  G03C5/00

    CPC分类号： G03F7/70425 ,  G03F7/0957 ,  G03F7/2022 ,  H01L21/0277 ,  H05K3/0082 ,  H05K2201/0108 ,  H05K2203/1572 ,  H05K3/048 ,  H05K3/064

    摘要： Double sided lithography is disclosed for fabricating ultra-small multilayer microcircuit structures without need for any intermediate realignment and without need for any intermediate layer deposition involving re-establishment of surface planarity. Microcircuit patterns are defined on opposite sides of a thin substrate by an exposure tool without intermediate removal of the substrate from the exposure tool, the microcircuit pattern on one side being defined by incident patterning radiation and the microcircuit pattern on the other side being defined by patterning radiation which has passed through the thin substrate.

    摘要翻译： 公开了用于制造超小型多层微电路结构的双面光刻，而不需要任何中间重新对准，并且不需要涉及重新建立表面平面度的任何中间层沉积。 微电路图案通过曝光工具限定在薄基板的相对侧上，而不会从曝光工具中间移除基板，一侧上的微电路图案由入射图案化辐射限定，另一侧的微电路图案由图案形成 已经通过薄基板的辐射。

    PHOTOSENSITIVE LAMINATE, TRANSFER MATERIAL, PATTERNED PHOTOSENSITIVE LAMINATE, METHOD FOR MANUFACTURING THE SAME, TOUCH PANEL, AND IMAGE DISPLAY DEVICE
    28.
    发明申请
    PHOTOSENSITIVE LAMINATE, TRANSFER MATERIAL, PATTERNED PHOTOSENSITIVE LAMINATE, METHOD FOR MANUFACTURING THE SAME, TOUCH PANEL, AND IMAGE DISPLAY DEVICE 审中-公开
    感光层压板，转印材料，图案感光层压板，其制造方法，触控面板和图像显示装置

    公开(公告)号：US20170003593A1

    公开(公告)日：2017-01-05

    申请号：US15269414

    申请日：2016-09-19

    申请人： FUJIFILM Corporation

    发明人： Shinichi YOSHINARI ,  Morimasa SATO

    IPC分类号： G03F7/095 ,  G03F7/30 ,  G03F7/16 ,  G03F7/038 ,  G03F7/004

    CPC分类号： G03F7/0957 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  G03F7/0388 ,  G03F7/095 ,  G03F7/11 ,  G03F7/16 ,  G03F7/30 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111

    摘要： An object of the invention is to provide a photosensitive laminate in which two or more layers can be collectively patterned, a transfer material, a patterned photosensitive laminate, a method for manufacturing the patterned photosensitive laminate, a touch panel, and an image display device. According to the invention, there are provided a photosensitive laminate in which a first resin layer, an interlayer, and a second resin layer are laminated on a support in this order, at least one of the first resin layer or the second resin layer includes 20 mass % or greater of inorganic particles, and exposure sensitivity of the second resin layer is higher than that of the first resin layer, a transfer material, a patterned photosensitive laminate, a method for manufacturing the patterned photosensitive laminate, a touch panel, and an image display device.

    摘要翻译： 本发明的目的是提供一种其中可以共同构图两层或更多层的感光层压体，转印材​​料，图案化感光层压板，用于制造图案感光层压板的方法，触摸面板和图像显示装置。 根据本发明，提供了一种感光层压体，其中第一树脂层，中间层和第二树脂层依次层压在载体上，第一树脂层或第二树脂层中的至少一个包括20 无机粒子的质量％以上，第二树脂层的曝光灵敏度高于第一树脂层，转印材料，图案化感光性层叠体，图案化感光性层叠体的制造方法，触摸面板和 图像显示装置。

    Conductive element precursor and conductive pattern formation
    29.
    发明授权
    Conductive element precursor and conductive pattern formation 有权
    导电元件前体和导电图案形成

    公开(公告)号：US09261787B1

    公开(公告)日：2016-02-16

    申请号：US14468626

    申请日：2014-08-26

    申请人： Eastman Kodak Company

    发明人： Kenneth James Lushington

    IPC分类号： H05K1/09 ,  G03F7/06 ,  G03C1/06 ,  G03C1/825 ,  G03C1/815

    CPC分类号： G03F7/06 ,  G03C1/06 ,  G03C1/46 ,  G03C1/815 ,  G03C1/825 ,  G03C2001/7635 ,  G03C2007/3025 ,  G03F7/091 ,  G03F7/0957 ,  G03F7/11

    摘要： Black-and-white silver halide conductive film element precursors have, on one or both sides and in order, a UV filter layer, non-color hydrophilic photosensitive layer comprising a silver halide, and a hydrophilic overcoat as an outer layer. The one or two UV filter layers individually contains one or more UV absorbing agents in an amount of up 0.5 mmol/m2 and the total amount in the precursor is up to 1 mmol/m2 to prevent crosstalk during imagewise exposure. These precursors can be imagewise exposed and processed to provide conductive film elements with various conductive silver patterns (or grids) with narrow conductive silver lines on one or both sides. Such conductive film elements can be prepared with reduced yellowness as evidenced by reduced b* values. The resulting conductive film elements are highly transparent and can be used in various devices such as display devices.

    摘要翻译： 黑白卤化银导电膜元件前体在一侧或两侧依次具有UV滤光层，包含卤化银的非彩色亲水感光层和作为外层的亲水外涂层。 一个或两个UV过滤层分别含有一种或多种上述量为0.5mmol / m 2的UV吸收剂，并且前体中的总量高达1mmol / m 2，以防止成像曝光期间的串扰。 这些前体可以成像曝光和加工，以在一侧或两侧上提供具有窄导电银线的各种导电银图案（或网格）的导电膜元件。 这样的导电膜元件可以通过减少的b *值来证明具有降低的黄度。 所得到的导电膜元件是高度透明的，并且可以用于诸如显示装置的各种装置中。

    Silver halide conductive element precursor and devices
    30.
    发明授权
    Silver halide conductive element precursor and devices 有权
    卤化银导电元件前体和器件

    公开(公告)号：US09247640B2

    公开(公告)日：2016-01-26

    申请号：US14166910

    申请日：2014-01-29

    申请人： Kenneth James Lushington

    发明人： Kenneth James Lushington

    IPC分类号： G03C1/76 ,  H05K1/02 ,  G03C5/29 ,  G03C1/005 ,  G03F7/06 ,  G03F7/095

    CPC分类号： H05K1/0296 ,  G03C1/005 ,  G03C5/29 ,  G03F7/06 ,  G03F7/0957 ,  H05K1/0259

    摘要： A conductive film element precursor can be used to provide conductive silver lines from silver halide in a non-color hydrophilic photosensitive layer. This precursor has a substrate having, in order on at least one supporting side: a non-color hydrophilic photosensitive layer comprising a silver halide at a coverage of less than 5000 mg Ag/m2, and a hydrophilic overcoat disposed over the non-color hydrophilic photosensitive layer. This hydrophilic overcoat is the outermost layer and comprises silver halide in an amount of at least 5 mg Ag/m2 and up to and including 150 mg Ag/m2. The noted hydrophilic layers can be disposed on both supporting sides of the substrate to form a duplex conductive film element precursor. After imagewise exposure, the resulting exposed silver halide is developed and fixed to provide silver metal in conductive lines on either or both supporting sides of the substrate.

    摘要翻译： 导电膜元件前体可用于在非彩色亲水感光层中提供来自卤化银的导电银线。 该前体具有基底，其依次为至少一个支撑侧：包含覆盖率小于5000mg Ag / m 2的卤化银的非彩色亲水感光层和设置在非彩色亲水性上的亲水性外涂层 感光层。 该亲水外涂层是最外层，并且包含至少5mg Ag / m 2且至多且包括150mg Ag / m 2的量的卤化银。 所指出的亲水层可以设置在基板的两个支撑侧上以形成双面导电膜元件前体。 在成像曝光之后，将所得曝光的卤化银显影和固定，以在衬底的一个或两个支撑面上的导电线中提供银金属。