利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

358 条记录 (耗时 0.028 秒)

    Varnish, prepreg, and substrate thereof
    22.
    发明申请
    Varnish, prepreg, and substrate thereof 失效
    清漆，预浸料及其底材

    公开(公告)号：US20110098398A1

    公开(公告)日：2011-04-28

    申请号：US12588669

    申请日：2009-10-23

    申请人： Yan Hua Yuan

    发明人： Yan Hua Yuan

    IPC分类号： C08K3/36

    CPC分类号： C08K3/34 ,  C08G59/32 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/24995 ,  Y10T428/249952 ,  Y10T428/31511 ,  Y10T428/31515 ,  C08L63/00 ,  C08L63/04

    摘要： A varnish includes an epoxy resin, a curing agent, an accelerator agent and fillers. The fillers include sericite powders. The sericite powders have composition of SiO2 in weight ratio of 55±3%. Furthermore, the Mohs' scale of hardness of the sericite powder is between 2 to 3. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better machined-work capability.

    摘要翻译： 清漆包括环氧树脂，固化剂，促进剂和填料。 填料包括绢云母粉末。 绢云母粉末的重量比为55±3％的SiO2组成。 此外，绢云母粉末的莫氏硬度在2-3之间。将玻璃织物布浸入清漆中以形成具有更好加工能力的预浸料。

    RESIN COMPOSITION, AND PREPREG
    23.
    发明申请
    RESIN COMPOSITION, AND PREPREG 失效
    树脂组合物和PREPREG

    公开(公告)号：US20100183862A1

    公开(公告)日：2010-07-22

    申请号：US12594278

    申请日：2008-04-11

    申请人： Yasuyuki Yokoe ,  Toru Kaneko ,  Hiroshi Numata ,  Takeshi Shimada

    发明人： Yasuyuki Yokoe ,  Toru Kaneko ,  Hiroshi Numata ,  Takeshi Shimada

    IPC分类号： B32B27/04 ,  C08K9/10 ,  B32B37/00

    CPC分类号： C08J5/24 ,  C08G59/504 ,  C08J3/241 ,  C08J2363/00 ,  C08K5/41 ,  C08L63/00 ,  C08L2205/14 ,  Y10T156/10 ,  Y10T428/24994 ,  Y10T428/249948 ,  Y10T428/24995 ,  Y10T428/249952 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/2938 ,  Y10T428/31511 ,  Y10T428/31515 ,  C08L2666/02

    摘要： The present invention discloses: a resin composition comprising, as essential components, 100 parts by mass of a component (A) which is an epoxy resin, 41 to 80 parts by mass of a component (B) which is thermoplastic resin particles, and 20 to 50 parts by mass (in terms of diaminodiphenylsulfone) of a component (C) which is diaminodiphenylsulfone microencapsulated with a coating agent, in which resin composition the thermoplastic resin particles (B) comprise at least thermoplastic resin particles (B1) having an average particle diameter of 1 to 50 μm and thermoplastic resin particles (B2) having an average particle diameter of 2 to 100 μm at a mass ratio of 3:1 to 1:3 and the average particle diameter ratio D2/D1 of the average particle diameter D2 of the thermoplastic resin particles (B2) to the average particle diameter D1 of the thermoplastic resin particles (B1) is 2 or more, and a prepreg produced using the resin composition.

    摘要翻译： 本发明公开了一种树脂组合物，作为必要成分，将100质量份作为环氧树脂的成分（A），41〜80质量份作为热塑性树脂粒子的成分（B）和20质量份 至50质量份（以二氨基二苯砜计）（以二氨基二苯基砜为单位），该组分（C）是用涂料微胶囊化的二氨基二苯砜，其中树脂组合物热塑性树脂颗粒（B）至少包含具有平均颗粒的热塑性树脂颗粒 直径为1〜50μm，平均粒径为2〜100μm的热塑性树脂粒子（B2）的质量比为3:1〜1:3，平均粒径D2 / D1为平均粒径D2 的热塑性树脂粒子（B2）与热塑性树脂粒子（B1）的平均粒径D1的比为2以上，使用该树脂组合物制造的预浸料坯。

    Composite comprising structural and non structural fibers
    27.
    发明申请
    Composite comprising structural and non structural fibers 审中-公开
    复合材料包括结构纤维和非结构纤维

    公开(公告)号：US20080160282A1

    公开(公告)日：2008-07-03

    申请号：US11903336

    申请日：2007-09-21

    申请人： David Harold Woolstencroft

    发明人： David Harold Woolstencroft

    IPC分类号： B32B5/02 ,  B29C45/00

    CPC分类号： B29C70/08 ,  B29K2301/12 ,  B29K2307/04 ,  B29K2995/0091 ,  Y10T428/249949 ,  Y10T428/249952 ,  Y10T442/30

    摘要： A composite comprises a structural component and a resin component, the structural component comprising structural fibres and a toughening additive comprising non-structural thermoplastic fibres and the resin component comprising a non-thermoplastic material. The structure component is a preform formed from the structural fibres and the thermoplastic fibres. The volume fraction of the structural fibres in the preform is at least 65%. The composite may be produced by forming a preform from structural fibres with non-structural thermoplastic fibres to provide a structural component. Liquid resin is then injected or infused into the structural component and cured.

    摘要翻译： 复合材料包括结构组分和树脂组分，结构组分包含结构纤维和包含非结构热塑性纤维的增韧添加剂和包含非热塑性材料的树脂组分。 结构部件是由结构纤维和热塑性纤维形成的预制件。 预制件中结构纤维的体积分数至少为65％。 该复合材料可以通过从具有非结构热塑性纤维的结构纤维形成预成型件来提供结构组分来制备。 然后将液体树脂注入或注入结构组分并固化。

    Composite materials including amorphous thermoplastic fibers
    29.
    发明申请
    Composite materials including amorphous thermoplastic fibers 有权
    复合材料包括无定形热塑性纤维

    公开(公告)号：US20070292674A1

    公开(公告)日：2007-12-20

    申请号：US11453502

    申请日：2006-06-15

    申请人： Brian G. Morin

    发明人： Brian G. Morin

    IPC分类号： D04H13/00 ,  B32B27/04 ,  B32B17/02 ,  B32B27/00 ,  B32B27/12 ,  H01Q1/42

    CPC分类号： B32B27/02 ,  C08J5/043 ,  C08J5/048 ,  H05K1/0366 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/029 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/249946 ,  Y10T428/249947 ,  Y10T428/249949 ,  Y10T428/24995 ,  Y10T428/249952

    摘要： Disclosed are composites that can exhibit low transmission energy loss and can also be temperature resistant. The composites include reinforcement fibers held in a polymeric matrix. The reinforcement fibers can include an amorphous polymer component. The fibers can be woven or knit to form a fabric or can be included in a nonwoven fabric. The composites can include other fibers as well, such as fiberglass. The composites can be multi-layer structures and can include layers of other materials, for instance layers formed of polyaramids, fiberglass, or carbon fiber wovens or nonwovens. The composites can advantageously be utilized in low loss dielectric applications, such as in forming circuit board substrates.

    摘要翻译： 公开了可以表现出低的传输能量损失并且也可以是耐温的复合材料。 复合材料包括保持在聚合物基质中的增强纤维。 增强纤维可以包括无定形聚合物组分。 纤维可以编织或编织以形成织物或可以包括在无纺织物中。 复合材料也可以包括其它纤维，例如玻璃纤维。 复合材料可以是多层结构，并且可以包括其它材料的层，例如由聚芳酰胺，玻璃纤维或碳纤维织物或无纺布形成的层。 复合材料可以有利地用于低损耗介电应用中，例如在形成电路板基底时。

    Directed assembly of functional heterostructures
    30.
    发明授权
    Directed assembly of functional heterostructures 有权
    定向组装功能异质结构

    公开(公告)号：US07262063B2

    公开(公告)日：2007-08-28

    申请号：US10034727

    申请日：2001-12-26

    申请人： Sukanta Banerjee ,  Kairali Podual ,  Michael Seul

    发明人： Sukanta Banerjee ,  Kairali Podual ,  Michael Seul

    IPC分类号： G01N33/551

    CPC分类号： C08J3/075 ,  C08J3/28 ,  C08J2333/26 ,  C08J2425/06 ,  C12Q1/6837 ,  G01N33/5005 ,  G01N33/545 ,  G03F7/0047 ,  G03F7/164 ,  Y10T428/249952 ,  Y10T428/25

    摘要： The present invention relates to a systematic process for the creation of functionally organized, spatially patterned assemblies polymer-microparticle composites including the AC electric field-mediated assembly of patterned, self supporting organic (polymeric) films and organic (polymeric)—microparticle composite films of tailored composition and morphology; the present invention further relates to the incorporation of said assemblies into other structures. The present invention. also relates to the application of such functional assemblies in materials science and biology. Additional areas of application include sensors, catalysts, membranes, micro-reactors, smart materials. Miniaturized format for generation of multifunctional thin films. Provides a simple set-up to synthesize thin films of tailored composition and morphology:

    摘要翻译： 本发明涉及一种用于产生功能组织的空间图案化聚合物 - 聚合物 - 微粒复合材料的系统方法，其包括图案化的自支撑有机（聚合物）膜和有机（聚合） - 微粒复合膜的交流电场介导组装 定制组合和形态; 本发明还涉及将所述组件结合到其它结构中。 本发明。 还涉及这种功能组件在材料科学和生物学中的应用。 其他应用领域包括传感器，催化剂，膜，微反应器，智能材料。 用于生成多功能薄膜的小型化格式。 提供简单的设置来合成定制组合和形态的薄膜：