摘要:
The present invention relates to dimethacrylic acid esters of dimethyloltetrahydrofuran and its derivatives having the formula: ##STR1## wherein A and A' individually have the formula: ##STR2## wherein B is a member selected from the group consisting of CH.sub.3 and H, n is an integer from 0 to 5, m is 0 or 1, and p is 0 or 1; their process of preparation and their use as adhesive components of anaerobic adhesive compositions.
摘要:
A pressure sensitive adhesive material is made by coating a substrate with a copolymer of specified proportions of a diester of fumaric acid, and a vinyl compound copolymerisable therewith as well as either or both of an olefinically unsaturated copolymerisable polar compound with carboxyl, carboxamide, dicarboxylic anhydride or dicarboximide groups, and an olefinically unsaturated copolymerisable compound with selfcrosslinkable reactive groups, together with a cross-linking polyfunctional compound, and subjecting the coating thereon to a short period heat treatment.
摘要:
A pressure-sensitive adhesive copolymer material formed from (A) 50-80 percent by weight of at least one diester of fumaric acid and a saturated monovalent aliphatic alcohol containing from 3 to 12 carbon atoms, (B) 18-40 percent by weight of at least one vinyl compound copolymerizable with (A) and (C) from 0.5 to 15 percent of at least one monoolefinic polar compound copolymerizable with (A) and (B) having a polar group from carboxyl, carboxamide, dicarboxylic acid anhydride and dicarboximide; or from (A), (B) and (D) from 0.1 to 10 percent by weight of at least one monoolefinic compound copolymerizable with (A) and (B) having self cross-linkable groups from hydroxy, epoxy, N-methylolamide, aldehyde and isocyanate groups; or from (A), (B), (C) and (D) and which contains from 0.1 to 10 percent by weight of the copolymers of a crosslinking active polyfunctional compound for copolymers of the foregoing components in at least a partially cross-linked state.
摘要:
NEW N-(CHLORO-TERT,BUTYLTHIADIAZOLYL) AMIDES ARE EMPOLYED TO COMBAT UNDESIRED VEGETATION BOTH PRE-EMERGENTLY AND POST-EMERGENTLY. CYCLOPROPANECARBOXAMIDES ARE PREFFERED.
摘要:
The present invention aims to provide an adhesive sheet for back grinding capable of suppressing peeling of an adhesive layer and capable of peeling a wafer easily from an adhesive sheet. According to the present invention, provided is an adhesive sheet for back grinding of a semiconductor wafer having a convex part, comprising: a base material layer; and an adhesive layer provided on the base material layer, wherein: the adhesive layer comprises an opening part having a diameter smaller than a diameter of the semiconductor wafer; the adhesive layer is adhered to an outer peripheral part of the semiconductor wafer so shat the convex part of the semiconductor wafer is placed in the opening part; the adhesive layer is configured so that the convex part is protected by the base material layer with the semiconductor wafer adhered to the adhesive layer; the base material layer comprises a cushion layer and a surface treatment layer provided thereon; the adhesive layer is provided on the surface treatment layer; the surface treatment layer is formed of an acrylic resin composition containing an acrylic resin; the acrylic resin is cross-linked by light irradiation or heating; and the adhesive layer is formed of an acrylic resin composition containing an acrylic resin.
摘要:
The present disclosure relates to a curable precursor of an adhesive composition, the curable precursor comprising: (a) a radically (co) polymerizable (meth)acrylate-based component comprising (i) C1-C32 (meth)acrylic acid ester monomers; and (ii) an ethylenically unsaturated acidic compound; (b) a crosslinker for the (meth)acrylate-based component, which comprises at least one acid-functional group derived from phosphoric acid and at least one radically (co)polymerizable reactive group; and (c) a nitroxide wherein the C1-C32 (meth)acrylic acid ester monomers (a)(i) do not comprise functional groups other than the (meth)acrylic acid ester groups, and wherein the ethylenically unsaturated acidic compound (a)(ii) does not comprise an acid-functional group derived from phosphoric acid. The present disclosure further relates to a process for making a cured composition from said curable precursor and to the use of said curable precursor for adhesive applications and/or for thermal management applications in the automotive industry.
摘要:
A resin composition includes (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) an initiator comprising at least one basic substance, and (c) an anionic polymerization inhibitor including at least one borate ester compound.
摘要:
A UV light curable adhesive is disclosed, comprising, at least one bi-active monomer, at least one polymerizable oligomer, a primary photoinitiator, and a monomer scavenger, wherein photopolymerization of the at least one bi-active monomer by the primary photoinitiator activates the monomer scavenger, reducing residual monomer content in a cured adhesive formed by the photopolymerization of the bi-active monomer in comparison to an otherwise identical comparative UV adhesive lacking the monomer scavenger. A method for curing the UV light curable adhesive is disclosed, including applying the UV light curable adhesive to a surface and exposing the UV light curable adhesive to UV light, free from heating the UV light curable adhesive other than any autogenous increases in temperature from exothermic polymerization reactions. A device with the UV light cured adhesive is disclosed, including the UV light cured adhesive joining a first surface to a second surface.