摘要:
There is provided a mixture having a freezing point of up to 100° C. formed by a process comprising the step of contacting: (A) from 1 to 2 equivalents of a compound of formula (I) AlX3 (I) wherein each X independently represents Cl, Br or F; with (B) 1 equivalent of a compound of formula (II) R1—C(O)—N(R2)(R3) (II) wherein R1 to R3 have meanings given in the description. There is also provided further mixtures containing additional components, as well as methods of using the mixtures in various applications, such as for the electroreduction of the mixtures to produce aluminum metal.
摘要:
A method for producing an aluminum foil of the present invention is characterized in that an aluminum film is formed on a surface of a substrate by electrolysis using a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) at least one nitrogen-containing compound selected from the group consisting of an ammonium halide, a hydrogen halide salt of a primary amine, a hydrogen halide salt of a secondary amine, a hydrogen halide salt of a tertiary amine, and a quaternary ammonium salt represented by the general formula: R1R2R3R4N.X (R1 to R4 independently represent an alkyl group and are the same as or different from one another, and X represents a counteranion for the quaternary ammonium cation), then the film is separated from the substrate to obtain an aluminum foil, and the obtained aluminum foil is subjected to a heat treatment.
摘要:
A metal article comprises an alloy substrate having a surface and a non-diffused metal monolayer disposed thereon. The surface has a first surface work function value Φs. The non-diffused monolayer deposited on the surface has a second surface work function value Φs that is less negative than the first surface work function value. A method for depositing the monolayer via underpotential deposition (UPD) is also disclosed.
摘要:
There is provided a method for forming an aluminide coating on a surface of a heat resistant superalloy substrate, comprising the steps of: exposing a base metal of the substrate in a selective area; forming a aluminum or an aluminum alloy film on the exposed base metal, by a non-aqueous electroplating; and conducting a heat treatment to the substrate on which the film is formed, in order to make a diffusion reaction between an aluminum component in the film and the base metal, and form the aluminide coating, wherein: there is used, as a plating liquid, a non-aqueous plating liquid containing a halide of the metal to be plated and an organic compound which forms an ion pair with the metal halide; and the electroplating is conducted by immersing the selective area into the plating liquid through the use of predetermined means for shielding the plating liquid from the atmosphere.
摘要:
An object of the present invention is to provide an extended-life plating solution that allows an aluminum electroplating process to be performed stably for a long period of time, and also a method for forming an aluminum plating film using the same. An aluminum electroplating solution according to the present invention is characterized by comprising 1.5 to 4.0 mol of an aluminum halide per 10.0 mol of dimethyl sulfone and, relative to the aluminum halide, ammonium chloride in a molar ratio of 1/15 to 1/4 or a tetraalkylammonium chloride in a molar ratio of 1/15 to 1/2. The plating solution has improved electrical conductivity and thus has a further advantage in that it allows the formation of a uniform aluminum plating film on a substrate to be plated even when the plating process is performed by a barrel method.
摘要:
A substrate processing chamber component comprising a chamber component structure having an yttrium-aluminum coating. The yttrium-aluminum coating comprises a compositional gradient through a thickness of the coating.
摘要:
An object of the present invention is to provide a method for preparing a plating solution for aluminum electroplating useful for the production of a high-ductility, high-purity aluminum foil at a high film formation rate, etc., which is an easy-to-handle plating solution that does not solidify and allows for an electroplating treatment even at 25° C. The present invention as a means for achieving the object is characterized in that in a preparation of a plating solution containing at least (1) a dialkyl sulfone, (2) an aluminum halide, and (3) a nitrogen-containing compound, the blending proportions of the dialkyl sulfone, the aluminum halide, and the nitrogen-containing compound are such that per 10 mol of the dialkyl sulfone, the aluminum halide is 3.5+n to 4.2+n mol, and the nitrogen-containing compound is n mol (wherein n is 0.001 to 2.0 mol). In addition, a plating solution for aluminum electroplating prepared by the method of the present invention allows for an electroplating treatment with high aluminum deposition efficiency relative to the current flow, and is thus advantageous in that electricity usage can be reduced, resulting in excellent economic efficiency.
摘要:
To provide a barrel electroplating method which is less prone to bare spots and adhesion failure such as blisters and peeling, and which makes it possible to obtain uniform plated coatings free from burnt deposits and poor brightness, irrespective of the amount of workpieces.The present invention provides a method for performing barrel electroplating by use of an aluminum or aluminum alloy plating bath, the method comprising rotating, swinging, or vibrating an anode (6) placed inside a barrel (4) receiving workpieces, and simultaneously rotating, swinging, or vibrating the barrel, with a voltage being applied between the anode and a cathode provided on an inner wall surface of the barrel.
摘要:
The invention relates to an apparatus (1, 101, 201) for electrochemically coating a workpiece (22), including a coating reservoir (2, 102, 202) with a charge opening (5) and a supply reservoir (3, 103, 203), wherein the two reservoirs are in communication through a passage opening (4, 104, 204). The apparatus has at least one electrode (11) and one counter electrode (14). In order to prevent contamination of a coating liquid (20, 120, 220) during an electrochemical deposition process, the apparatus can be switched between a coating position and a rest position by rotating the supply and the coating reservoirs about at least one common axis (A, A′, A″) so that the center of gravity of the volume of the coating reservoir (2, 102, 202) in the coating position is lower in relation to the center of gravity of the volume of the supply reservoir (3, 103, 203) than in the rest position. The invention further relates to a method for coating workpieces.
摘要:
The invention relates to organoaluminum electrotyles for the electrolytic deposition of aluminum which are characterized in that they consist of KF . 2 AlEt.sub.3 (A), KF . 2 AlMe.sub.3 (B) and MF . 2 Al(iBu).sub.3 (C), wherein M=sodium or potassium or a mixture of both, in a molar ratio of A:B:C of from 2:1:1 to 7:1:1. The organoaluminum electrolytes are dissolved in from 2 to 4.5 moles, based on the amount of MF employed, of an aromatic hydrocarbon which is liquid at 0.degree. C. The invention further relates to a process for the electrolytic deposition of aluminum on electrically conductive materials by using said electrolytes.