公开(公告)号：US11735495B2

公开(公告)日：2023-08-22

申请号：US16287653

申请日：2019-02-27

申请人： Intel Corporation

发明人： Omkar Karhade ,  Mitul Modi ,  Edvin Cetegen ,  Aastha Uppal

IPC分类号： H01L23/46 ,  F28D15/02 ,  H01L21/48 ,  H01L23/427

CPC分类号： H01L23/46 ,  F28D15/02 ,  H01L21/4882 ,  H01L23/427

摘要： Package assemblies with a molded substrate comprising fluid conduits. The fluid conduits may be operable for conveying a fluid (e.g., liquid and/or vapor) through some portion of the package substrate structure. Fluid conduits may be at least partially defined by an interconnect trace comprising a metal. The fluid conveyance may improve thermal management of the package assembly, for example removing heat dissipated by one or more integrated circuits (ICs) of the package assembly.

公开(公告)号：US20230215777A1

公开(公告)日：2023-07-06

申请号：US18000473

申请日：2021-06-01

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Kengo TANAKA

IPC分类号： H01L23/427 ,  B23P15/26 ,  H01L21/48

CPC分类号： H01L23/427 ,  B23P15/26 ,  H01L21/4871 ,  B23P2700/09

摘要： A vapor chamber includes a working fluid in an internal space formed between a first metal sheet and a second metal sheet, in which the first metal sheet includes a recessed channel, at least one projecting part, and at least one flow channel groove. The recessed channel is provided at an inner surface of the first metal sheet, the projecting part projects from the inner surface of the first metal sheet toward an inner surface of the second metal sheet, and a top face of the projecting part abuts the inner surface of the second metal sheet. The flow channel groove has a bottom groove part, a side face groove part and a top face groove part. The bottom groove part is provided at a bottom face of the recessed channel, the side face groove part is provided at a side face of the projecting part, and is connected to the bottom groove part, and the top face groove part is provided at the top face of the projecting part, and is connected to the side face groove part.

公开(公告)号：US11688664B2

公开(公告)日：2023-06-27

申请号：US17140610

申请日：2021-01-04

申请人： Micron Technology, Inc.

发明人： Bradley R. Bitz ,  Xiao Li ,  Jaspreet S. Gandhi

IPC分类号： H01L23/427 ,  H01L23/42 ,  H01L23/433 ,  H01L23/46 ,  H01L23/473 ,  H01L25/065

CPC分类号： H01L23/427 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/46 ,  H01L23/473 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06589

摘要： Semiconductor device assemblies having stacked semiconductor dies and thermal transfer devices that include vapor chambers are disclosed herein. In one embodiment, a semiconductor device assembly includes a first semiconductor die having a base region, at least one second semiconductor die at the base region, and a thermal transfer device attached to the first and second dies. The thermal transfer device includes an encapsulant at least partially surrounding the second die and a via formed in the encapsulant. The encapsulant at least partially defines a cooling channel that is adjacent to a peripheral region of the first die. The via includes a working fluid and/or a solid thermal conductor that at least partially fills the channel.

公开(公告)号：US20230197564A1

公开(公告)日：2023-06-22

申请号：US17937781

申请日：2022-10-04

申请人： Lenovo (Singapore) Pte. Ltd.

发明人： Junki Hashiba ,  Masahiro Kitamura ,  Akinori Uchino ,  Yusuke Onoue

IPC分类号： H01L23/427 ,  H01L25/16 ,  H01L23/00

CPC分类号： H01L23/427 ,  H01L25/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29105 ,  H01L2224/32245

摘要： A heat dissipation structure, for a semiconductor chip in which a die is provided on a surface of a substrate and an electric element is provided around the die, includes: a heat transfer plate thermally connected to a surface of the die; a liquid metal provided between the surface of the die and the heat transfer plate; and an insulating material covering the electric element. The heat transfer plate has a recessed portion in a location facing the electric element.

公开(公告)号：US11647612B2

公开(公告)日：2023-05-09

申请号：US17164268

申请日：2021-02-01

申请人： Toyota Motor Engineering & Manufacturing North America, Inc.

发明人： Hitoshi Fujioka ,  Shailesh N. Joshi ,  Hiroshi Ukegawa

IPC分类号： H05K7/20 ,  H02M7/00 ,  H01L23/427

CPC分类号： H05K7/209 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336 ,  H05K7/20909 ,  H05K7/20936 ,  H01L23/427 ,  H02M7/003

摘要： An integrated power electronic assembly includes a power electronic device, a cooling assembly offset from and thermally coupled to a second edge of the power electronic device, and a thermal spreader offset from and thermally coupled to a first edge of the power electronic device. The first edge of the power electronic device is opposite the second edge of the power electronic device, and the thermal spreader is thermally coupled to the cooling assembly.

公开(公告)号：US11635263B2

公开(公告)日：2023-04-25

申请号：US16870297

申请日：2020-05-08

申请人： COOLER MASTER CO., LTD.

发明人： Chi-Lung Chen

IPC分类号： F28D15/04 ,  F28D15/02 ,  H01L23/427 ,  H05K7/20

摘要： A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

公开(公告)号：US11606880B2

公开(公告)日：2023-03-14

申请号：US16562120

申请日：2019-09-05

申请人： Coolanyp, LLC

发明人： Peng Cheng

IPC分类号： H05K7/20 ,  F28D15/02 ,  H01L23/427 ,  G06F1/20

摘要： Disclosed are thermal management for electronic devices and, more particularly, to a thermodynamic system with bi-phase fluid circuits which self-organize internal fluid movement to transfer heat from heat absorption zones to heat dissipation zones. A thermodynamic system may include a plurality of thermal energy absorption (TEA) nodes disposed adjacent to one or more heat sources which are interconnected with one another and also a plurality of thermal energy dissipation (TED) nodes through a capillary system that encloses a bi-phase fluid. As TE is absorbed into the bi-phase fluid at individual TEA nodes local condition changes such as, for example, pressure and/or volume increases induce convection of the absorbed TE away from the individual TEA nodes. As TE dissipates from the bi-phase fluid at individual TED nodes local condition changes such as, for example, pressure and/or volume decreases further induce convection of additional absorbed TE toward the individual TED nodes.

公开(公告)号：US11605886B1

公开(公告)日：2023-03-14

申请号：US17133518

申请日：2020-12-23

申请人： XILINX, INC.

发明人： Gamal Refai-Ahmed ,  Chi-Yi Chao ,  Lik Tsang ,  Jens Weis ,  Brendan Farley ,  Anthony Torza ,  Suresh Ramalingam

IPC分类号： H01Q1/42 ,  H01L23/427 ,  H01Q1/02

摘要： An antenna assembly is provided having passive cooling elements that enable compact design. In one example, an antenna assembly is provided that includes a heat sink assembly having an interior side and an exterior side, an antenna array, an antenna circuit board, and a radome. The antenna circuit board includes at least one integrated circuit (IC) die. The IC die has a conductive primary heat dissipation path to the interior side of the heat sink assembly. The radome is coupled to the heat sink assembly and encloses the antenna circuit board and the antenna array between the radome and the heat sink assembly. The heat sink assembly includes a metal base plate and at least a first heat pipe embedded with the metal base plate. The first heat pipe is disposed between the metal base plate and the IC die.

公开(公告)号：US20230065622A1

公开(公告)日：2023-03-02

申请号：US17465633

申请日：2021-09-02

申请人： Raytheon Company

发明人： Miroslav Micovic ,  Karen Kaneko Baker ,  Christopher Carbonneau ,  Katherine J. Herrick ,  Teresa J. Clement ,  Jeffrey R. Laroche

IPC分类号： H01L23/427 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H03F3/24 ,  H01Q3/24

摘要： An Array Core Block for an AESA includes a stack of 2*M alternating N-channel RFIC and MMIC Power Amplifier wafers bonded together by a wafer-scale direct bond hybrid (DBH) interconnect process. This process forms both metal-to-metal and dielectric hydrogen bonds between bonding surfaces to seal the wafer stack. Each array core block includes an array of through substrate metal vias to distribute DC bias, LO and information signals. Each array core block also includes a cooling system including micro-channels formed on a backside of at least one of the chips in each bonded pair and through substrate via holes formed through the stack that operatively couple the micro-channels for all of the bonded pairs to receive and circulate a fluid through the micro-channels and through substrate via holes to cool the RFIC and MMIC Power Amplifier chips and to extract the heated fluid.

公开(公告)号：US11594469B2

公开(公告)日：2023-02-28

申请号：US17228018

申请日：2021-04-12

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Shih-Chang Ku ,  Hung-Chi Li ,  Tsung-Shu Lin ,  Tsung-Yu Chen ,  Wensen Hung

IPC分类号： H01L23/34 ,  H01L23/427 ,  H01L21/48 ,  H01L25/00 ,  H01L25/065

摘要： A semiconductor device includes a vapor chamber lid for high power applications such as chip-on-wafer-on-substrate (CoWoS) applications using high performance processors (e.g., graphics processing unit (GPU)) and methods of manufacturing the same. The vapor chamber lid provides a thermal solution which enhances the thermal performance of a package with multiple chips. The vapor chamber lid improves hot spot dissipation in high performance chips, for example, at the three-dimensional (3D-IC) packaging level.