公开(公告)号：US20180108546A1

公开(公告)日：2018-04-19

申请号：US15785993

申请日：2017-10-17

Applicant: SEMES CO., LTD.

Inventor： Soon-Cheon Cho ,  Bongkyu Shin ,  Byeol Han ,  Hyun Joong Kim

IPC: H01L21/67 ,  B08B7/00 ,  G03F1/82 ,  B08B3/10 ,  H01J37/32 ,  H01L21/3065

CPC classification number: H01L21/67051 ,  B08B3/10 ,  B08B7/0057 ,  G03F1/82 ,  H01J37/32495 ,  H01J37/32623 ,  H01L21/3065 ,  H01L21/67086 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6831

Abstract: Disclosed are an apparatus and a method for cleaning a component of a substrate dry processing apparatus. The method for cleaning a component of a substrate dry processing apparatus includes dipping the component in a cleaning solution received in a cleaning bath, generating radicals from the cleaning solution, and cleaning the component with the radicals. The component is cleaned with hydrogen radicals (H2*) and hydroxyl radicals (OH*) generated from ozone water. Accordingly, it is possible to rapidly remove carbon (C) and fluorine (F) deposited on the component.

公开(公告)号：US09922850B2

公开(公告)日：2018-03-20

申请号：US14744563

申请日：2015-06-19

Applicant: SEMES CO., LTD.

Inventor： Oh Jin Kwon ,  Seong-Soo Kim

IPC: H01L21/67

CPC classification number: H01L21/67051

Abstract: Disclosed is a substrate treating apparatus which includes a treating container having a treating space therein and including a plurality of collecting vessels surrounding the treating space and provided such that inlets for inputting a fluid in the treating space are vertically stacked on each other, a support unit supporting a substrate in the treating space, a solution supply unit supplying a treating solution to the substrate supported by the support unit, and elevation units respectively joined with the collecting vessels and lifting up and down the collecting vessels. Each of the elevation units includes a base having a ring shape and joined with a corresponding collecting vessel, an elevation load joined with the base, and a driver lifting up and down the elevation load.

公开(公告)号：US20180040458A1

公开(公告)日：2018-02-08

申请号：US15788166

申请日：2017-10-19

Applicant: Semes Co., Ltd

Inventor： Hyungchul MOON ,  Hyung Joon KIM

IPC: H01J37/32

CPC classification number: H01J37/3244 ,  H01J37/32009 ,  H01J37/32449 ,  H01J37/32477 ,  H01J37/32642 ,  H01J37/32715 ,  H01J37/32862 ,  H01J37/32871 ,  H01L21/3065 ,  H01L21/32136 ,  H01L21/67069

Abstract: Substrate treating systems are disclosed. The system may include a chamber with a processing space, a supporting unit provided in the processing space to support a substrate, a gas supplying unit provided in the processing space to supply gas into the processing space, a plasma source unit generating plasma from the gas, and a liner unit disposed to enclose the supporting unit. The supporting unit may include a supporting plate supporting a substrate. The liner unit may include an inner liner enclosing the supporting plate and an actuator vertically moving the inner liner.

公开(公告)号：US20180005849A1

公开(公告)日：2018-01-04

申请号：US15632768

申请日：2017-06-26

Applicant: SEMES CO., LTD.

Inventor： Ji-hwan LEE ,  Jungbong CHOI ,  Chan Young HEO ,  Pil Kyun HEO ,  Byung Man KANG

IPC: H01L21/67 ,  B08B3/00 ,  B23B31/28 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B3/00 ,  B08B11/02 ,  B23B31/28 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/68728 ,  H01L21/6875 ,  H01L21/68785

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a spin head, a support shaft connected to a lower portion of the spin head to support the spin head, a pin located on an upper surface of the spin head to support the substrate and having a space in the interior thereof, and a nozzle member configured to supply a liquid to the substrate located on the spin head.

公开(公告)号：US20170345688A1

公开(公告)日：2017-11-30

申请号：US15607361

申请日：2017-05-26

Applicant: SEMES CO., LTD.

Inventor： HYO WON LEE ,  YOUNG HUN LEE

IPC: H01L21/67 ,  B05C5/02 ,  B05C5/00

CPC classification number: H01L21/67051 ,  B05C5/004 ,  B05C5/02 ,  B05C11/1005 ,  H01L21/67023 ,  H01L21/67034 ,  H01L21/67109 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67253 ,  H01L21/67703

Abstract: Disclosed are an apparatus and a method for liquid-treating a substrate. An apparatus for treating a substrate includes a liquid treating unit that liquid-treats a substrate by supplying a liquid onto a substrate, a weight measuring unit that measures a weight of the remained liquid on the substrate, and a transfer unit that transfers the substrate between the liquid treating unit and the weight measuring unit. Accordingly, the weight of the remained liquid may be measured more promptly.

公开(公告)号：US20170345641A1

公开(公告)日：2017-11-30

申请号：US15604267

申请日：2017-05-24

Applicant: SEMES CO., LTD.

Inventor： YOUNG HUN LEE ,  EUI SANG LIM

IPC: H01L21/02 ,  B08B3/10 ,  B08B3/08 ,  H01L21/67 ,  B08B3/02

CPC classification number: H01L21/67051 ,  B08B3/024 ,  B08B2203/0229

Abstract: Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.

公开(公告)号：US20170338132A1

公开(公告)日：2017-11-23

申请号：US15671848

申请日：2017-08-08

Applicant: SEMES CO., LTD.

Inventor： Jintack YU ,  Jaemyoung LEE

IPC: H01L21/67

CPC classification number: H01L21/67051

Abstract: Provided is an apparatus for processing a substrate including a spin head on which a substrate is placed, a container provided to surround the spin head, an upper nozzle member supplying a processing solution downwards, a bottom cleaning member located to be a certain distance from the bottom of the spin head, wherein the bottom cleaning member sprays a cleaning solution to the bottom of the spin head.

公开(公告)号：US20170316920A1

公开(公告)日：2017-11-02

申请号：US15443212

申请日：2017-02-27

Applicant: SEMES CO., LTD.

Inventor： Harutyun MELIKYAN ,  Junghwan LEE ,  Jong Hwan AN ,  Shin-Woo NAM

IPC: H01J37/32 ,  H01L21/67

CPC classification number: H01J37/3211 ,  H01J37/3244 ,  H01J2237/334 ,  H01L21/67069

Abstract: An antenna and a substrate treating process utilizing the same are provided. The antenna may extend along an imaginary baseline having predetermined curvature and comprise a section where the distance between the baseline and intersection point between the antenna and a vertical line perpendicular to the baseline changes depending on a position on the baseline.

公开(公告)号：US20170312770A1

公开(公告)日：2017-11-02

申请号：US15468257

申请日：2017-03-24

Applicant: SEMES CO., LTD.

Inventor： Juyong JANG

IPC: B05B7/22 ,  C23C24/04 ,  B05B7/16

CPC classification number: B05B7/226 ,  B05B5/032 ,  B05B7/1486 ,  B05B7/1606 ,  C23C24/04

Abstract: An embodiment includes a coating apparatus comprising: a support unit for supporting a coating object; and a spray assembly for spraying a fluid which includes a coating material to be coated by the coating object supported on the support unit. The spray assembly comprises: a nozzle unit where the fluid is sprayed; and a fluid supply unit for supplying the fluid to the nozzle unit. The nozzle unit comprises: a body including a passageway for the fluid therein and a dielectric unit provided with a dielectric material; and a plasma source for generating plasma from the fluid which flows to an area adjacent to inner lateral surface of the dielectric unit. The plasma source comprises: a power electrode applying a power; and a ground electrode to be grounded.

公开(公告)号：US20170274415A1

公开(公告)日：2017-09-28

申请号：US15440288

申请日：2017-02-23

Applicant: SEMES CO., LTD.

Inventor： Dae Min KIM ,  Soyoung Park ,  Muhyeon Lee

IPC: B05D1/02 ,  B05B9/03 ,  B05D7/00

CPC classification number: H01L21/67051 ,  B05D1/002 ,  B05D1/005 ,  B05D1/02 ,  B05D1/34 ,  B05D1/36 ,  B05D3/002 ,  B05D7/52 ,  B08B3/00 ,  B08B3/024 ,  B08B3/04 ,  H01L21/02041

Abstract: The present invention relates to an apparatus and a method for treating a substrate with liquid. The substrate treating apparatus comprises a substrate supporting unit for supporting the substrate, a liquid supply unit for supplying a liquid to the substrate supported on the substrate supporting unit, and a controller for controlling the liquid supply unit, wherein the liquid supply unit comprises a first nozzle for supplying a first liquid and a second nozzle for supplying a second liquid, and a second area where the second liquid is supplied on the substrate is provided within a first area where the first liquid is supplied on the substrate. The first liquid and the second liquid supplied with a hydrophobic film are discharged with different ways from each other. Thereby, particles with various sizes may be removed depending on each discharge methods.