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公开(公告)号:US10141321B2
公开(公告)日:2018-11-27
申请号:US15290960
申请日:2016-10-11
Applicant: Silicon Storage Technology, Inc.
Inventor: Chun-Ming Chen , Man-Tang Wu , Jeng-Wei Yang , Chien-Sheng Su , Nhan Do
IPC: H01L27/115 , H01L29/66 , H01L29/788 , H01L27/11521 , H01L21/28 , H01L29/423 , G11C16/04
Abstract: A method of forming a non-volatile memory cell includes forming spaced apart first and second regions in a substrate, defining a channel region there between. A floating gate is formed over a first portion of the channel region and over a portion of the first region, wherein the floating gate includes a sharp edge disposed over the first region. A tunnel oxide layer is formed around the sharp edge. An erase gate is formed over the first region, wherein the erase gate includes a notch facing the sharp edge, and wherein the notch is insulated from the sharp edge by the tunnel oxide layer. A word line gate is formed over a second portion of the channel region which is adjacent to the second region. The forming of the word line gate is performed after the forming of the tunnel oxide layer and the erase gate.
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公开(公告)号:US10141062B2
公开(公告)日:2018-11-27
申请号:US15135445
申请日:2016-04-21
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu , Hung Quoc Nguyen , Viet Tan Nguyen
IPC: G11C11/34 , G11C7/02 , G11C16/30 , G11C16/08 , G11C16/10 , G11C16/28 , G11C8/10 , G11C5/14 , G11C16/32 , G11C29/14
Abstract: A circuit and method are disclosed for operating a non-volatile memory device, comprising time sampling a reference current or voltage in a floating holding node to obtain a hold voltage and applying the hold voltage in sensing circuitry.
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313.
公开(公告)号:US10134475B2
公开(公告)日:2018-11-20
申请号:US15048707
申请日:2016-02-19
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu , Hung Quoc Nguyen
Abstract: Various embodiments for inhibiting the programming of memory cells coupled to unselected bit lines while programming a memory cell coupled to a selected bit line in a flash memory array are disclosed. Various embodiments for compensating for leakage current during the programming of memory cells coupled to a selected bit line in a flash memory array also are disclosed.
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公开(公告)号:US20180204627A1
公开(公告)日:2018-07-19
申请号:US15924100
申请日:2018-03-16
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu
Abstract: The present invention relates to a flash memory cell with only four terminals and decoder circuitry for operating an array of such flash memory cells. The invention allows for fewer terminals for each flash memory cell compared to the prior art, which results in a simplification of the decoder circuitry and overall die space required per flash memory cells. The invention also provides for the use of high voltages on one or more of the four terminals to allow for read, erase, and programming operations despite the lower number of terminals compared to prior art flash memory cells.
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公开(公告)号:US09997252B2
公开(公告)日:2018-06-12
申请号:US15706586
申请日:2017-09-15
Applicant: Silicon Storage Technology, Inc.
Inventor: Xiao Yan Pi , Xiaozhou Qian , Kai Man Yue , Yao Zhou , Yaohua Zhu
IPC: G11C16/06 , G11C16/28 , G11C16/08 , G11C7/14 , G11C16/24 , G11C7/06 , G11C29/02 , G11C7/12 , G11C29/12 , G11C29/50
CPC classification number: G11C16/28 , G11C7/062 , G11C7/12 , G11C7/14 , G11C16/08 , G11C16/24 , G11C29/025 , G11C2029/1204 , G11C2029/5006
Abstract: An improved sensing circuit is disclosed that utilizes a bit line in an unused memory array to provide reference values to compare against selected cells in another memory array. A circuit that can perform a self-test for identifying bit lines with leakage currents about an acceptable threshold also is disclosed.
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公开(公告)号:US09972632B2
公开(公告)日:2018-05-15
申请号:US15476663
申请日:2017-03-31
Applicant: Silicon Storage Technology, Inc.
Inventor: Chunming Wang , Nhan Do
IPC: H01L27/11521 , H01L29/423 , G11C16/10 , G11C16/16
CPC classification number: H01L27/11521 , G11C16/0433 , G11C16/10 , G11C16/16 , H01L21/28273 , H01L27/11524 , H01L29/42328
Abstract: A memory device that includes a substrate of semiconductor material of a first conductivity type, first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a continuous channel region in the substrate extending between the first and second regions. A first floating gate is disposed over and insulated from a first portion of the channel region adjacent to the first region. A second floating gate is disposed over and insulated from a second portion of the channel region adjacent to the second region. A word line gate is disposed over and insulated from a third portion of the channel region between the first and second channel region portions. A first erase gate disposed over and insulated from the first region. A second erase gate disposed is over and insulated from the second region.
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公开(公告)号:US09922715B2
公开(公告)日:2018-03-20
申请号:US14506433
申请日:2014-10-03
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Hung Quoc Nguyen , Nhan Do
CPC classification number: G11C16/24 , G11C16/0408 , G11C16/0425 , G11C16/10 , G11C16/12 , G11C16/14 , G11C16/26
Abstract: A non-volatile memory device that a semiconductor substrate of a first conductivity type. An array of non-volatile memory cells is in the semiconductor substrate arranged in a plurality of rows and columns. Each memory cell comprises a first region on a surface of the semiconductor substrate of a second conductivity type, and a second region on the surface of the semiconductor substrate of the second conductivity type. A channel region is between the first region and the second region. A word line overlies a first portion of the channel region and is insulated therefrom, and adjacent to the first region and having little or no overlap with the first region. A floating gate overlies a second portion of the channel region, is adjacent to the first portion, and is insulated therefrom and is adjacent to the second region. A coupling gate overlies the floating gate. A bit line is connected to the first region. A negative charge pump circuit generates a first negative voltage. A control circuit receives a command signal and generates a plurality of control signals, in response thereto and applies the first negative voltage to the word line of the unselected memory cells. During the operations of program, read or erase, a negative voltage can be applied to the word lines of the unselected memory cells.
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公开(公告)号:US09911501B2
公开(公告)日:2018-03-06
申请号:US15163548
申请日:2016-05-24
Applicant: Silicon Storage Technology, Inc.
Inventor: Hieu Van Tran , Anh Ly , Thuan Vu
CPC classification number: G11C16/28 , G11C7/065 , G11C16/0433 , G11C16/14 , G11C16/24
Abstract: The present invention relates to an improved sensing amplifier and related method for use in read operations in flash memory devices. In one embodiment, the sensing amplifier includes a built-in voltage offset. In another embodiment, a voltage offset is induced in the sensing amplifier through the use of capacitors. In another embodiment, the sensing amplifier utilizes sloped timing for the reference signal to increase the margin by which a “0” or “1” are detected from the current drawn by the selected cell compared to the reference cell. In an another embodiment, a sensing amplifier is used without any voltage offset.
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公开(公告)号:US20170338330A1
公开(公告)日:2017-11-23
申请号:US15494499
申请日:2017-04-22
Applicant: Silicon Storage Technology, Inc.
Inventor: Chunming Wang , Leo Xing , Andy Liu , Melvin Diao , Xian Liu , Nhan Do
IPC: H01L29/66 , H01L27/11521 , H01L21/3213
CPC classification number: H01L29/66825 , H01L21/32133 , H01L27/11521 , H01L29/42328
Abstract: A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.
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公开(公告)号:US20170337980A1
公开(公告)日:2017-11-23
申请号:US15374588
申请日:2016-12-09
Inventor: Xinjie Guo , Farnood Merrikh Bayat , Dmitri Strukov , Nhan Do , Hieu Van Tran , Vipin Tiwari
IPC: G11C16/34 , G11C16/26 , G11C16/10 , G11C16/14 , H01L27/11558 , H01L27/11521
CPC classification number: G11C16/3431 , G11C7/18 , G11C8/14 , G11C16/0483 , G11C16/10 , G11C16/14 , G11C16/26 , G11C16/3427 , H01L27/11521 , H01L27/11524 , H01L27/11558 , H01L29/7881
Abstract: A memory device that provides individual memory cell read, write and erase. In an array of memory cells arranged in rows and columns, each column of memory cells includes a column bit line, a first column control gate line for even row cells and a second column control gate line for odd row cells. Each row of memory cells includes a row source line. In another embodiment, each column of memory cells includes a column bit line and a column source line. Each row of memory cells includes a row control gate line. In yet another embodiment, each column of memory cells includes a column bit line and a column erase gate line. Each row of memory cells includes a row source line, a row control gate line, and a row select gate line.
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