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公开(公告)号：US20250085320A1
公开(公告)日：2025-03-13
申请号：US18798841
申请日：2024-08-09
Applicant: SEMES CO,.LTD.
Inventor： Hyo Seong SEONG , Tae Hoon JO , Soon Min KWON
Abstract: An inspecting apparatus capable of performing an inspection of equipment without destroying the equipment and semiconductor manufacturing equipment including the inspecting apparatus are provided. The inspecting apparatus includes: a measurement module measuring a first impedance at a first port, and a second impedance at a second port; a comparison module comparing the first and second impedances; and a determination module determining whether the equipment part is operating properly based on a result of the comparison of the first and second impedances, wherein the first impedance includes a first resistance and a first reactance, the second impedance includes a second resistance and a second reactance, and the determination module determines whether the equipment part is operating properly based on at least one of a result of the comparison of the first and second resistances and a result of the comparison of the first and second reactances.
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公开(公告)号：US20250083359A1
公开(公告)日：2025-03-13
申请号：US18824834
申请日：2024-09-04
Applicant: SEMES CO., LTD.
Inventor： Changhoon OK , Jae Gyeong LEE , Jinsoo KIM
Abstract: Provided is a semiconductor package cutting system including a cutting device for partial-cutting at least a portion of a strip including a plurality of semiconductor packages, an inspection device mounted behind the cutting device to supply a first strip to be cut to the cutting device and to receive and inspect a second strip cut by the cutting device, and a storage device mounted behind the inspection device to supply the first strip stored therein, to the inspection device and to receive and store the second strip inspected by the inspection device, wherein the inspection device includes an inspection table for placing the first or second strip thereon and moving the first strip along a first direction.
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公开(公告)号：US20250079197A1
公开(公告)日：2025-03-06
申请号：US18815987
申请日：2024-08-27
Applicant: SEMES CO., LTD.
Inventor： Pil Kyun HEO , Min Woo KIM , Hyung Seok KANG , Anton KORIAKIN , Joon Hee LEE
Abstract: Disclosed are an apparatus for treating a substrate and a method of treating a substrate using a supercritical fluid. The apparatus includes: a chamber for providing a treatment space for treating a substrate; and a treatment fluid supply unit for supplying a treatment fluid to the treatment space, in which treatment fluid supply unit includes: a tank for storing the treatment fluid; a heating unit for heating the treatment fluid in the tank to convert the treatment fluid from a first state to a second state; an inlet line for introducing the treatment fluid in the first state into the tank; a supply line for supplying the treatment fluid of the second state from the tank to the chamber; a circulation line for circulating the treatment fluid in the tank; a first valve installed in the circulation line; and a temperature drop member installed in the circulation line to lower a temperature of the treatment fluid flowing through the circulation line.
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374.发明授权公开(公告)号：US12243726B2
公开(公告)日：2025-03-04
申请号：US18066003
申请日：2022-12-14
Applicant: SEMES CO., LTD.
Inventor： Jae-Won Shin
IPC: H01J37/32
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a process chamber having a treating space therein; a substrate support unit configured to support a substrate in the treating space; a gas supply unit configured to supply a process gas to the treating space; and a plasma source for generating a plasma from the process gas, and wherein the substrate support unit includes: a support plate on which the substrate is placed; a base which is positioned below the support plate; a first ring provided to surround the substrate placed on the support unit; a second ring provided below the first ring and having a through hole; and a ring lift pin assembly for lifting and lowering the first ring and the second ring, and wherein the ring lift pin assembly includes: a first pin provided to be inserted into the through hole and to lift and lower the first ring; a second pin in a hollow shaft shape to lift and lower the second ring and having a hole at which first pin passes through within; and a driving unit for driving the first pin and the second pin, and wherein the through hole overlaps the first ring when seen from above.
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公开(公告)号：US12240709B2
公开(公告)日：2025-03-04
申请号：US17750359
申请日：2022-05-22
Applicant: SEMES CO., LTD.
Inventor： Hee Jae Byun , Sang Oh Kim , Na Hyun Lee , Myung Jin Lee
IPC: B66F7/02 , B65G47/90 , B66F11/00 , H01L21/677
Abstract: A tower lift includes a main frame, a first carriage module and a second carriage module connected with each other inside the main frame at left and right sides of the main frame, respectively, having the same weight as each other, and configured to be moved in a vertical direction, and a driving module installed on the main frame and configured to move the first carriage module and the second carriage module in the vertical direction.
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Patent Agency Ranking
公开(公告)号：US12240699B2
公开(公告)日：2025-03-04
申请号：US17349467
申请日：2021-06-16
Applicant: SEMES CO., LTD.
Inventor： Young Woo Kim , Jin Ho Song , Yong Bae Choi , Ji Hyun Park
Abstract: An article storage device includes a load port configured to load and unload a plurality of articles, a plurality of shelves configured to load the articles, a transportation robot configured to transport the articles between the load port and the shelves or between the shelves, a receiving part configured to receive operation commands of the transportation robot from an upper system, a calculating part configured to calculate a setting value of an order of priority with respect to the operation commands, and a control part configured to control the transportation robot to perform an operation command having a high setting value of an order of priority among the operation commands.
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公开(公告)号：US20250069908A1
公开(公告)日：2025-02-27
申请号：US18779123
申请日：2024-07-22
Applicant: SEMES CO., LTD.
Inventor： Youngjoon Han , Kyuhwan Chang , Juha Woo
Abstract: A substrate processing apparatus includes a support unit configured to support a substrate and be rotatable, a chemical liquid supply nozzle configured to supply a chemical liquid to a chemical liquid supply area of the substrate, and a charging unit disposed adjacent to the substrate. The charging unit is disposed adjacent to the chemical liquid supply nozzle, and is charged with charges opposite to charges of the chemical liquid.
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公开(公告)号：US20250068080A1
公开(公告)日：2025-02-27
申请号：US18743089
申请日：2024-06-13
Applicant: SEMES CO., LTD.
Inventor： Kyung Taek IM , Jae Ha KIM , Seung Hwan LEE , Seung Jun LEE
Abstract: Provided is a substrate treatment apparatus including: a cooling chamber accommodating a substrate; and a cooling unit disposed inside the cooling chamber, the cooling unit including a support, two first plates connected to the support to support the substrate and spaced apart from each other in a height direction of the support, and a second plate disposed to move up and down between the two first plates.
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公开(公告)号：US12235663B2
公开(公告)日：2025-02-25
申请号：US17742281
申请日：2022-05-11
Applicant: SEMES CO., LTD.
Inventor： Myung Hwan Eom , Sang Hyun Son , Jae Hong Kim
IPC: G05D7/06 , G01F1/667 , G05B19/416
Abstract: A flow rate control apparatus with improved reliability is provided. The flow rate control apparatus comprises a flow rate measuring unit for measuring a flow rate of chemical solution in a chemical solution supply line, a flow rate control unit for comparing a preset target flow rate profile and an applied flow rate profile, and controlling the flow rate of the chemical solution so that the applied flow rate profile matches the target flow rate profile, and a processor for switching the flow rate control unit to a first mode in response to a signal for the flow rate of the chemical solution measured by the flow rate measuring unit being less than a preset level, wherein, in the first mode, the applied flow rate profile includes a profile of a flow rate estimation model simulated using a flow rate of chemical solution measured by the flow rate measuring unit.
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公开(公告)号：US12230516B2
公开(公告)日：2025-02-18
申请号：US17515737
申请日：2021-11-01
Applicant: SEMES CO., LTD.
Inventor： Jae Oh Bang , Young Seo An , Seung Han Lee , Seung Hwan Lee , Hyun Min Kim
Abstract: The inventive concept relates to a substrate treating apparatus including a process chamber having a first and a second body, a support unit supporting a substrate, a heating unit heats the substrate, a driver moves any one of the first body and the second body, an interval state detection unit that detects an interval state between a side wall of the first body and a side wall of the second body when the first and the second body are placed in a process location, and a controller that controls the driver and the interval state detection unit, wherein the interval state detection unit includes a pressure provision line that provides a positive pressure or a negative pressure between the side wall of the first body and the side wall of the second body, and a pressure measurement member that measures a change in a pressure of the pressure provision line.
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