公开(公告)号：US20130256722A1

公开(公告)日：2013-10-03

申请号：US13572209

申请日：2012-08-10

Applicant: SHIH-PU YANG ,  JUI-YI CHU

Inventor： SHIH-PU YANG ,  JUI-YI CHU

IPC: H01L33/60

CPC classification number: H01L33/10 ,  H01L33/0079

Abstract: The present invention relates to a light emitted diode (LED). The LED includes a metal mirror, a bonding substrate, a distributed bragg reflector (DBR), a buffer layer, and a LED epitaxial structure. The bonding substrate is arranged under the metal mirror. The DBR is arranged on the metal mirror. The buffer layer is arranged on the DBR. The LED epitaxial structure is arranged on the buffer layer.

Abstract translation: 本发明涉及一种发光二极管（LED）。 LED包括金属镜，接合衬底，分布式布拉格反射器（DBR），缓冲层和LED外延结构。 接合基板设置在金属镜下方。 DBR布置在金属镜上。 缓冲层布置在DBR上。 LED外延结构布置在缓冲层上。

公开(公告)号：USD687788S1

公开(公告)日：2013-08-13

申请号：US29425804

申请日：2012-06-27

Applicant: Kuo-Ching Chen ,  Chien-Hsuan Chien

Designer： Kuo-Ching Chen ,  Chien-Hsuan Chien

公开(公告)号：US08508114B2

公开(公告)日：2013-08-13

申请号：US13356317

申请日：2012-01-23

Applicant: Wen-Lung Su ,  Hsiang-Cheng Hsieh

Inventor： Wen-Lung Su ,  Hsiang-Cheng Hsieh

IPC: H01L51/00

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01322 ,  H01L2924/00014

Abstract: A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided 5 with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.

Abstract translation: 发光二极管包括壳体，壳体中的框架，一个或多个发光芯片和包装聚合物; 该框架5设置有用于接收发光芯片的放置的放置区域和与放置区域分离的电极区域; 在适当地设置在放置区域上的截面下降以增加框架和壳体之间的接触面积，并提高壳体与框架之间的相对稳定性。

公开(公告)号：US20130176718A1

公开(公告)日：2013-07-11

申请号：US13452978

申请日：2012-04-23

Applicant: TSUNG-LIN YU

Inventor： TSUNG-LIN YU

IPC: F21V21/00

CPC classification number: H05B33/0821 ,  F21V23/02 ,  F21Y2103/10 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05B33/0809

Abstract: A luminous circuit and a luminous device having the same are provided. The luminous circuit may include a first conducting wire and a second conducting wire connected to a positive terminal and a negative terminal of a power supply, respectively. The luminous circuit may further include N light-emitting circuits electrically and sequentially coupled between the first conducting wire and the second conducting wire in a parallel connection fashion beginning from a location in proximity of the power supply. Each of the light-emitting circuits corresponds to a light-emitting element, and jth light-emitting element is better than ith light-emitting element in lighting efficiency, wherein 1≦i

Abstract translation: 提供发光电路和具有该发光电路的发光装置。 发光电路可以包括分别连接到电源的正极端子和负极端子的第一导线和第二导线。 发光电路还可以包括N个发光电路，其以从电源附近的位置开始以并联的方式电连接并顺序耦合在第一导线和第二导线之间。 每个发光电路对应于发光元件，并且第j个发光元件在照明效率方面优于第i个发光元件，其中1 i，i，j，i，j和N是整数 ，N> = 2。

公开(公告)号：US20130155561A1

公开(公告)日：2013-06-20

申请号：US13429349

申请日：2012-03-24

Applicant: Chien-Feng LAI

Inventor： Chien-Feng LAI

IPC: H02H3/20 ,  H05B41/16

CPC classification number: H02H3/202 ,  H02H9/041 ,  H02H9/042 ,  H05B33/0812 ,  H05B33/0887 ,  Y02B20/341

Abstract: An over voltage protection circuit, adapted for placing between a power pin of a chip and a power terminal is provided. The over voltage protection circuit includes a voltage detection unit, a current limiting component, and a switch component. The voltage detection unit is coupled between the power terminal and a ground, for outputting a setting voltage according to the voltage level at the power terminal. The current limiting component is coupled between the power terminal and the power pin of the chip. The switch component is coupled between the power pin of the chip and the ground, wherein the switch component is further coupled to the voltage detection unit and controlled by the setting voltage. When the voltage level at the power terminal is higher than a first predetermined value, the switch component conducts to cut off voltage received by the chip.

Abstract translation: 提供了适用于放置在芯片的电源引脚与电源端子之间的过电压保护电路。 过电压保护电路包括电压检测单元，限流部件和开关部件。 电压检测单元耦合在电源端子和地之间，用于根据电源端子处的电压电平输出设定电压。 电流限制部件耦合在电源端子和芯片的电源引脚之间。 开关部件耦合在芯片的电源引脚和地之间，其中开关部件进一步耦合到电压检测单元并由设定电压控制。 当电源端子的电压电平高于第一预定值时，开关元件导通以切断由芯片接收的电压。

公开(公告)号：USD680975S1

公开(公告)日：2013-04-30

申请号：US29406557

申请日：2011-11-16

Applicant: Chia-En Lee ,  Te-Ling Hsia ,  Wen-Fei Fong

Designer： Chia-En Lee ,  Te-Ling Hsia ,  Wen-Fei Fong

公开(公告)号：US20130026491A1

公开(公告)日：2013-01-31

申请号：US13241563

申请日：2011-09-23

Applicant: CHENG-HUNG CHEN ,  DER-LIN HSIA ,  CHIA-HUNG HOU

Inventor： CHENG-HUNG CHEN ,  DER-LIN HSIA ,  CHIA-HUNG HOU

IPC: H01L33/02 ,  H01L33/60

CPC classification number: H01L33/46 ,  H01L33/007 ,  H01L33/10 ,  H01L33/20

Abstract: The present invention discloses a LED structure and a method for manufacturing the LED structure. The LED structure includes a substrate, a reflection layer, a first conducting layer, a light emitting layer, and a second conducting layer. The substrate has a plurality of grooves, and the reflection layer is disposed inside the plurality of grooves. The reflection layer is formed as a reflection block inside each of the grooves. The first conducting layer is disposed on the substrate, that is, the reflection layer is disposed between the first conducting layer and the substrate. The light emitting layer and the second conducting layer are sequentially disposed on the first conducting layer. The light emitting layer generates light when a current pass through the light emitting layer. Accordingly, the light generated by the light emitting layer can be emitted to the same side of the LED structure.

Abstract translation: 本发明公开了一种LED结构及其制造方法。 LED结构包括基板，反射层，第一导电层，发光层和第二导电层。 基板具有多个槽，反射层配置在多个槽内。 反射层在每个槽内形成为反射块。 第一导电层设置在基板上，即，反射层设置在第一导电层和基板之间。 发光层和第二导电层依次设置在第一导电层上。 当电流通过发光层时，发光层产生光。 因此，由发光层产生的光可以发射到LED结构的同一侧。

公开(公告)号：USD670662S1

公开(公告)日：2012-11-13

申请号：US29406916

申请日：2011-11-21

Applicant: Te-Hao Sun

Designer： Te-Hao Sun

公开(公告)号：US08294173B2

公开(公告)日：2012-10-23

申请号：US12068854

申请日：2008-02-12

Applicant: Wei-An Chen ,  Chu-Ping Fan

Inventor： Wei-An Chen ,  Chu-Ping Fan

IPC: H01L33/00

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses a light emitting element including a carrier, at least one light emitting chip, an adhesive and a first encapsulated layer. The light emitting chip is fixed onto the carrier by the adhesive, and most of the carrier and adhesive are made of a light absorbing material, so that the external luminescence quantum efficiency of the light emitting element is poor. The invention adopts a first encapsulated layer disposed on the carrier to cover the light absorbing material including the adhesive or carrier, so as to reduce the light absorption and improve the external luminescence quantum efficiency of the light emitting element.

Abstract translation: 本发明公开了一种发光元件，其包括载体，至少一个发光芯片，粘合剂和第一封装层。 发光芯片通过粘合剂固定在载体上，并且载体和粘合剂的大部分由光吸收材料制成，使得发光元件的外部发光量子效率差。 本发明采用设置在载体上的第一封装层以覆盖包括粘合剂或载体的光吸收材料，以减少光吸收并提高发光元件的外部发光量子效率。

公开(公告)号：USD667385S1

公开(公告)日：2012-09-18

申请号：US29406977

申请日：2011-11-21

Applicant: Sheng-Pei Lin

Designer： Sheng-Pei Lin