公开(公告)号：US20190233636A1

公开(公告)日：2019-08-01

申请号：US16133051

申请日：2018-09-17

Applicant: Brewer Science, Inc.

Inventor： Kui Xu ,  Richard Elsworth Daugherty, JR. ,  Daniel Patrick Sweat ,  Mary Ann Hockey ,  Eric Calderas ,  Megan Bennett

IPC: C08L53/00 ,  C08F20/18 ,  C08F20/26 ,  C08F26/06 ,  C08G63/06

CPC classification number: C08L53/00 ,  C08F20/18 ,  C08F20/26 ,  C08F26/06 ,  C08G63/06 ,  C08L2203/20

Abstract: Novel block copolymers (“BCPs”) having non-random distributions of comonomers within at least one of the blocks and methods of using those BCPs in directed self-assembly (“DSA”) processes are provided. The non-random (e.g., gradient-creating) distributions can be customized in order to concentrate the desired comonomer properties in predetermined areas of the BCP. These BCPs can achieve perpendicular orientation with simple annealing and offer superior long-range ordering and lower defectivity when compared to prior art BCPs. These BCPs can be incorporated into compositions that simultaneously offer the benefits of high-χ and rapid thermal-annealing kinetics while maintaining similar or improved guide process windows when compared to prior art BCPs.

公开(公告)号：US10366887B2

公开(公告)日：2019-07-30

申请号：US15724662

申请日：2017-10-04

Applicant: Brewer Science Inc.

Inventor： Jinhua Dai ,  Joyce Lowes

IPC: H01L29/06 ,  H01L21/027 ,  C08F120/68 ,  C08F120/18 ,  H01L21/02 ,  B05D1/00 ,  C08L53/00 ,  G03F7/00

Abstract: The present invention is broadly concerned with materials, processes, and structures that allow an underlayer to be imaged directly using conventional lithography, thus avoiding the photoresist processing steps required by prior art directed self-assembly (DSA) processes. The underlayers can be tailored to favor a selected block of the DSA block co-polymers (BCP), depending on the pattern, and can be formulated either to initially be neutral to the BCP and switch to non-neutral after photoexposure, or can initially be non-neutral to the BCP and switch to neutral after exposure. These materials allow fast crosslinking to achieve solvent resistance and possess good thermal stability.

公开(公告)号：US10352726B2

公开(公告)日：2019-07-16

申请号：US14806238

申请日：2015-07-22

Applicant: Brewer Science Inc.

Inventor： Ryan E. Giedd ,  Vijaya Kayastha ,  Jonathan Fury ,  Robert Christian Cox

IPC: G01D5/16 ,  G01K7/16 ,  G01N27/12

Abstract: Printed resistive-based sensors and transducers comprising a thin, electronically “active” sensing layer within a dielectric and/or metallic layered structure are provided. The electronic resistance of the active sensing layer is measured during a change in the sensor environment. By utilizing a multi-layered architecture around the active sensing layer, the electronic signal of the sensing element can be improved. By carefully selecting the architecture and materials that surround the active sensing layer, the sensitivity, stability, and selectivity of the sensor to detect changes in the environment are improved. This design allows for a number of specific application areas for environmental sensing.

公开(公告)号：US10304720B2

公开(公告)日：2019-05-28

申请号：US15650535

申请日：2017-07-14

Applicant: Brewer Science Inc.

Inventor： Christina R. Matos-Perez ,  Tony D. Flaim ,  Arthur O. Southard ,  Lisa M. Kirchner ,  Deborah Blumenshine

IPC: H01L21/762 ,  B41C1/10 ,  C07C65/21 ,  C07C65/30 ,  C07C243/12 ,  C08G69/38 ,  C08G18/76 ,  C08G12/06 ,  C08G73/02 ,  C08G18/38

Abstract: Dielectric materials with optimal mechanical properties for use in laser ablation patterning are proposed. These materials include a polymer selected from the group consisting of polyureas, polyurethane, and polyacylhydrazones. New methods to prepare suitable polyacylhydrazones are also provided. Those methods involve mild conditions and result in a soluble polymer that is stable at room temperature and can be incorporated into formulations that can be coated onto microelectronic substrates. The dielectric materials exhibit high elongation, low CTE, low cure temperature, and leave little to no debris post-ablation.

公开(公告)号：US20180063963A1

公开(公告)日：2018-03-01

申请号：US15689056

申请日：2017-08-29

Applicant: Brewer Science Inc.

Inventor： Tony D. Flaim

IPC: H05K3/12 ,  H05K1/03 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/1216 ,  H01L23/13 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H05K1/0236 ,  H05K1/0373 ,  H05K1/187

Abstract: The present invention provides stencil-based processes for fan-out wafer-level packaging (“FOWLP”) that addresses the limitations associated with prior art over-molding of dies. In the inventive process, a temporary carrier is coated with a release layer and curable adhesive backing layer. A die stencil film is then laminated to the coated carrier, and the dies are placed inside pre-formed cavities created in the laminated stencil. The gaps between the dies and the stencil are filled with a curable polymeric material, and a redistribution layer is constructed according to conventional processes. This process results in better repeatability, lower bowing in the carrier, and enhanced downstream processing.

公开(公告)号：USD785058S1

公开(公告)日：2017-04-25

申请号：US29491486

申请日：2014-05-21

Applicant: Brewer Science Inc.

Designer： Jim Strothmann ,  Roger A. Ruesing ,  Brandon Wilson ,  Kirk Emory

公开(公告)号：US20170040200A1

公开(公告)日：2017-02-09

申请号：US15332581

申请日：2016-10-24

Applicant: Brewer Science Inc.

Inventor： Dongshun Bai ,  Gu Xu ,  Debbie Blumenshine ,  Baron Huang ,  Andy Wong

IPC: H01L21/683 ,  C08G77/14 ,  C08G77/20 ,  C09J7/02 ,  C08G77/26 ,  C09J5/04 ,  C09J145/00 ,  C09J183/06 ,  H01L21/50 ,  C08G77/18

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B9/045 ,  B32B27/08 ,  B32B27/16 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C09J5/06 ,  C09J145/00 ,  C09J183/06 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  H01L21/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

Abstract translation: 本发明广泛地涉及单独或一起使用的环烯烃聚合物粘合组合物和释放组合物，其能够在微电子制造期间实现薄晶片处理，特别是在全晶片机械剥离过程中。 释放组合物包含由硅氧烷聚合物和共聚物在极性溶剂中共混制成的组合物，并且在室温下稳定长达一个月以上。 环状烯烃聚合物粘合组合物提供高热稳定性，可以结合到完全处理的载体晶片上，可以在高温热处理后机械或激光脱粘，并且易于用工业上可接受的溶剂除去。 根据本发明结合的晶片与其他商业粘合材料相比表现出更低的整体后研磨堆叠TTV，并且可以在200℃下进行PECVD处理。

公开(公告)号：US09299778B2

公开(公告)日：2016-03-29

申请号：US14076094

申请日：2013-11-08

Applicant: Brewer Science Inc.

Inventor： Jyoti K. Malhotra ,  Jeff Leith ,  Curtis Planje

IPC: H01L21/00 ,  H01L29/06 ,  H01L21/02 ,  H01L51/00 ,  B82Y10/00 ,  B82Y40/00 ,  B81C1/00 ,  B81C99/00 ,  G03F1/50 ,  G03F7/00

CPC classification number: H01L29/0676 ,  B81C1/00111 ,  B81C99/008 ,  B82Y10/00 ,  B82Y40/00 ,  G03F1/50 ,  G03F7/0035 ,  H01L21/0259 ,  H01L21/02606 ,  H01L29/0665 ,  H01L29/0669 ,  H01L51/0048

Abstract: Manufacturing-friendly and scalable methods for the production of silicon micro- and nanostructures, including silicon nanotubes, are described. The inventive methods utilize conventional integrated circuit and MEMS manufacturing processes, including spin-coating, photolithography, wet and dry silicon etching, and photoassisted electrochemical etch processes. The invention also provides a novel mask, for maximizing the number of tubes obtained per surface area unit of the silicon substrate on which the tubes are built. The resulting tubes have thick and straight outer walls, as well as high aspect ratios.

Abstract translation: 描述了用于生产硅微纳米结构（包括硅纳米管）的制造友好且可扩展的方法。 本发明的方法利用传统的集成电路和MEMS制造工艺，包括旋涂，光刻，湿和干硅蚀刻以及光辅助电化学蚀刻工艺。 本发明还提供了一种新颖的掩模，用于最大化在其上构建管的硅衬底的每表面积单位获得的管的数目。 所得到的管具有厚而直的外壁以及高纵横比。

公开(公告)号：US09102129B2

公开(公告)日：2015-08-11

申请号：US14461109

申请日：2014-08-15

Applicant: Brewer Science Inc.

Inventor： Vandana Krishnamurthy ,  Daniel M. Sullivan ,  Yubao Wang ,  Qin Lin ,  Sean Simmons

IPC: G03F7/26 ,  B32B33/00 ,  C08G73/00 ,  H01L21/033 ,  H01L21/308 ,  C09D179/08 ,  C08G73/10 ,  G03F7/09 ,  B32B9/04

CPC classification number: B32B33/00 ,  B32B9/04 ,  B32B2255/26 ,  B32B2307/70 ,  B32B2379/08 ,  C08G73/00 ,  C08G73/1067 ,  C08G73/1075 ,  C08G73/1078 ,  C09D179/08 ,  G03F7/094 ,  H01L21/0332 ,  H01L21/3081 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/30 ,  Y10T428/31623 ,  Y10T428/31667 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The invention described herein is directed towards spin-on carbon materials comprising polyamic acid compositions and a crosslinker in a solvent system. The materials are useful in trilayer photolithography processes. Films made with the inventive compositions are not soluble in solvents commonly used in lithographic materials, such as, but not limited to PGME, PGMEA, and cyclohexanone. However, the films can be dissolved in developers commonly used in photolithography. In one embodiment, the films can be heated at high temperatures to improve the thermal stability for high temperature processing. Regardless of the embodiment, the material can be applied to a flat/planar or patterned surface. Advantageously, the material exhibits a wiggling resistance during pattern transfer to silicon substrate using fluorocarbon etch.

Abstract translation: 本文描述的本发明涉及在溶剂体系中包含聚酰胺酸组合物和交联剂的旋涂碳材料。 这些材料在三层光刻工艺中是有用的。 用本发明组合物制成的薄膜不溶于通常用于平版印刷材料的溶剂中，例如但不限于PGME，PGMEA和环己酮。 然而，这些膜可以溶解在通常用于光刻中的显影剂中。 在一个实施方案中，可以在高温下加热膜以改善用于高温处理的热稳定性。 不管实施例如何，材料可以应用于平面/平面或图案化表面。 有利地，该材料在使用碳氟化合物蚀刻的图案转移到硅衬底期间表现出摆动阻力。

公开(公告)号：US20150197594A1

公开(公告)日：2015-07-16

申请号：US14599103

申请日：2015-01-16

Applicant: Brewer Science Inc.

Inventor： Kui Xu ,  Mary Ann Hockey ,  Eric Calderas

IPC: C08F299/04 ,  C09D153/00

Abstract: Compositions for directed self-assembly (DSA) patterning techniques are provided. Methods for directed self-assembly are also provided in which a DSA composition comprising a block copolymer (BCP) is applied to a substrate and then self-assembled to form the desired pattern. The block copolymer includes at least two blocks and is selected to have a high interaction parameter (χ). The BCPs are able to form perpendicular lamellae by simple thermal annealing on a neutralized substrate, without a top coat. The BCPs are also capable of micro-phase separating into lines and spaces measuring at 10 nm or smaller, with sub-20-nm L0 capability.

Abstract translation: 提供了用于定向自组装（DSA）图案化技术的组合。 还提供了用于定向自组装的方法，其中将包含嵌段共聚物（BCP）的DSA组合物施加到基材上，然后自组装形成所需图案。 嵌段共聚物包括至少两个嵌段并且被选择为具有高相互作用参数（χ）。 BCP能够通过在中和的基材上进行简单的热退火而形成垂直薄片，而不需要顶涂层。 BCP还能够将微相分离成10nm或更小的线和空间，具有低于20nm的L0能力。