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    SYSTEMS AND METHODS FOR ELECTRICALLY TESTING ELECTROMIGRATION IN AN ELECTROMIGRATION TEST STRUCTURE
    31.
    发明申请
    SYSTEMS AND METHODS FOR ELECTRICALLY TESTING ELECTROMIGRATION IN AN ELECTROMIGRATION TEST STRUCTURE 审中-公开

    公开(公告)号：US20170356957A1

    公开(公告)日：2017-12-14

    申请号：US15181909

    申请日：2016-06-14

    Applicant: Cascade Microtech, Inc.

    Inventor： Timothy Allen McMullen ,  Brent Dale Harry ,  Eric James Wilcox ,  James J. Donlin

    IPC: G01R31/28

    CPC classification number: G01R31/2858 ,  G01R31/2818

    Abstract: Systems and methods for electrically testing electromigration in an electromigration test structure are disclosed herein. The systems include a voltage control portion, a current control portion, and a current regulating structure. The systems further include an electric current detector, a first system connection, and a second system connection. The systems also include a voltage detector, and a controller. In some embodiments of the methods, a voltage control portion regulates a high-side signal electric current to maintain a voltage difference below a voltage setpoint while a current control portion maintains the high-side signal electric current below a threshold current value. In some embodiments of the methods, one of the voltage difference and a magnitude of the high-side signal electric current is selected as a primary control parameter while the other is selected as a compliant control parameter.

    Probes with fiducial marks, probe systems including the same, and associated methods
    32.
    发明授权
    Probes with fiducial marks, probe systems including the same, and associated methods 有权

    公开(公告)号：US09804196B2

    公开(公告)日：2017-10-31

    申请号：US14997371

    申请日：2016-01-15

    Applicant: Cascade Microtech, Inc.

    Inventor： Bryan Conrad Bolt ,  Joseph George Frankel

    IPC: G01R1/067 ,  G01R31/28

    CPC classification number: G01R1/06794 ,  G01R31/2891

    Abstract: Probes with fiducial marks, probe systems including the same, and associated methods. The probes include a beam portion and a probe tip that is configured to contact a device under test (DUT), and further include a fiducial mark formed on the beam portion that is configured to facilitate alignment of the probe and the DUT. The fiducial mark is configured to be visible to an optical assembly, and is in focus to the optical assembly within a depth of field of the optical assembly that is smaller than a depth of field over which the beam portion is in focus to the optical assembly. The methods include methods of utilizing and/or manufacturing the probes.

    WAFER-HANDLING END EFFECTORS
    33.
    发明申请
    WAFER-HANDLING END EFFECTORS 有权
    水处理终止效应

    公开(公告)号：US20150255322A1

    公开(公告)日：2015-09-10

    申请号：US14631131

    申请日：2015-02-25

    Applicant: CASCADE MICROTECH, INC.

    Inventor： Robbie Ingram-Goble ,  Michael E. Simmons ,  Philip Wolf ,  Ryan Garrison ,  Christopher Storm

    IPC: H01L21/683 ,  B25J11/00 ,  B25J15/06

    CPC classification number: H01L21/6838 ,  B25J11/0095 ,  B25J15/0014 ,  B25J15/0616 ,  H01L21/67778 ,  Y10S901/40

    Abstract: Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.

    Abstract translation: 本文公开了包括和/或与晶片处理端效应器一起使用的晶片处理末端执行器和半导体制造装置。 末端执行器包括末端执行器主体和多个晶片接触表面，其由端部执行器主体支撑并被配置为与晶片形成至少部分的面对面的接触。 末端执行器还包括在末端执行器主体的机器人近端与多个晶片接触表面之间延伸的真空分配歧管。 末端执行器还包括限定在多个晶片接触表面内并在多个晶片接触表面和真空分配歧管之间延伸的多个真空开口。 末端执行器还包括多个密封结构，每个密封结构与多个晶片接触表面中的相应一个相关联。

    Probe holder for low current measurements
    34.
    发明授权
    Probe holder for low current measurements 有权
    用于低电流测量的探头支架

    公开(公告)号：US6384615B2

    公开(公告)日：2002-05-07

    申请号：US81518201

    申请日：2001-03-22

    Applicant: CASCADE MICROTECH INC

    Inventor： SCHWINDT RANDY

    IPC: G01R1/073 ,  G01R1/067 ,  G01R19/00 ,  G01R31/28 ,  G01R35/00 ,  H01L21/66 ,  H01R11/18 ,  G01R1/06

    CPC classification number: G01R1/067 ,  B82Y35/00 ,  G01R1/06705 ,  G01R1/06772 ,  G01R1/07342 ,  G01R1/18 ,  G01R19/0023 ,  G01R35/00 ,  H01R11/18

    Abstract: A system for low-current testing of a test device includes a probing device for probing a probing site on the test device. The probing device includes a dielectric substrate having first and second sides, an elongate conductive path on the first side of the substrate, an elongate probing element connected to the elongate conductive path so as to extend in a cantilevered manner beyond the substrate, and a conductive area on the second side of the substrate. The probe housing is matingly detachably engageable with the probing device.

    Abstract translation: 用于测试设备的低电流测试的系统包括用于探测测试设备上的探测位置的探测设备。 探测装置包括具有第一和第二侧面的电介质基底，在基底的第一侧上的细长导电路径，连接到细长导电路径的细长探测元件，以便以悬臂方式延伸超过基底，并且导电 在基板的第二面上的区域。 探头外壳可与探测装置配合地可拆卸地接合。

    Probe systems and methods including electric contact detection
    35.
    发明授权
    Probe systems and methods including electric contact detection 有权

    公开(公告)号：US10330703B2

    公开(公告)日：2019-06-25

    申请号：US15934672

    申请日：2018-03-23

    Applicant: Cascade Microtech, Inc.

    Inventor： Sia Choon Beng ,  Kazuki Negishi

    IPC: G01R31/28 ,  G01R1/073 ,  G01R1/067

    Abstract: Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.

    Shielded probe systems with controlled testing environments
    36.
    发明授权
    Shielded probe systems with controlled testing environments 有权

    公开(公告)号：US10281492B2

    公开(公告)日：2019-05-07

    申请号：US15725650

    申请日：2017-10-05

    Applicant: Cascade Microtech, Inc.

    Inventor： Michael Teich ,  Karsten Stoll ,  Walter Matthias Clauss ,  Swen Schmiedchen

    IPC: G01R31/10 ,  G01R1/18 ,  G01R1/067 ,  G01R1/44 ,  G01R1/073 ,  G01N27/42 ,  G01N31/02

    Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.

    PROBE HEAD ASSEMBLIES AND PROBE SYSTEMS FOR TESTING INTEGRATED CIRCUIT DEVICES
    37.
    发明申请
    PROBE HEAD ASSEMBLIES AND PROBE SYSTEMS FOR TESTING INTEGRATED CIRCUIT DEVICES 审中-公开

    公开(公告)号：US20170363681A1

    公开(公告)日：2017-12-21

    申请号：US15184374

    申请日：2016-06-16

    Applicant: CASCADE MICROTECH, INC.

    Inventor： JAY SALMON ,  ROY E. SWART ,  BRANDON LIEW

    IPC: G01R31/28 ,  G01R1/073

    CPC classification number: G01R31/2887 ,  G01R1/07378

    Abstract: Probe head assemblies and probe systems for testing integrated circuit devices are disclosed herein. In one embodiment, the probe head assemblies include a contacting structure and a space transformer assembly. In another embodiment, the probe head assemblies include a contacting structure, a suspension system, a flex cable interface, and a space transformer including a space transformer body and a flex cable assembly. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, and a planarization layer. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, a suspension system, a platen, a printed circuit board, a first plurality of signal conductors configured to convey a first plurality of signals external to the space transformer, and a second plurality of signal conductors configured to convey a second plurality of signals via the space transformer. The probe systems include the probe head assemblies.

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