公开(公告)号：US20130149508A1

公开(公告)日：2013-06-13

申请号：US13818373

申请日：2011-08-24

Applicant: Chang Hoon Kwak ,  Il Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

Inventor： Chang Hoon Kwak ,  Il Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

IPC: H01L33/50

CPC classification number: H01L33/50 ,  B32B3/08 ,  B32B3/10 ,  B32B3/14 ,  B32B3/16 ,  B32B3/18 ,  B32B5/16 ,  B32B7/12 ,  B32B9/04 ,  B32B9/045 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2250/44 ,  B32B2266/025 ,  B32B2307/40 ,  B32B2307/422 ,  B32B2457/00 ,  C09K11/06 ,  H01L24/97 ,  H01L33/505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2933/0041 ,  H05B33/22 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  Y10T428/31855 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2924/00012

Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Abstract translation: 提供了荧光体膜，其制造方法以及涂覆荧光体层的LED芯片的方法。 荧光体膜包括：基膜; 通过将部分固化的树脂材料中的荧光体粒子混合而形成在基底膜上的荧光体层; 以及形成在荧光体层上以保护荧光体层的覆盖膜。

公开(公告)号：US20130047877A1

公开(公告)日：2013-02-28

申请号：US13595468

申请日：2012-08-27

Applicant: Cheol Jun YOO ,  Min Jung KIM

Inventor： Cheol Jun YOO ,  Min Jung KIM

IPC: B41F31/08

CPC classification number: B41F31/08 ,  B41F15/42 ,  H01L31/055 ,  H01L31/18 ,  Y02E10/52

Abstract: A squeeze apparatus includes a body unit and an injection unit. The body unit has a flow path inside the body unit for applying a printing substance on a substrate. The injection unit has a nozzle that fluidly communicates with the flow path to inject the printing substance. The nozzle has a curved surface facing the substrate.

Abstract translation: 挤压装置包括主体单元和注射单元。 主体单元在主体单元内具有用于将印刷物质施加在基板上的流路。 注射单元具有与流路流体连通以喷射印刷物质的喷嘴。 喷嘴具有面向基板的弯曲表面。

公开(公告)号：US20120187437A1

公开(公告)日：2012-07-26

申请号：US13348369

申请日：2012-01-11

Applicant: Cheol-jun YOO ,  Young-hee SONG

Inventor： Cheol-jun YOO ,  Young-hee SONG

IPC: H01L33/44 ,  H01L33/52

CPC classification number: H01L33/486 ,  B29C45/14344 ,  B29C45/14655 ,  B29C45/14836 ,  H01L33/54 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/15311 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package includes, for example, a wiring substrate having an opening; a light-emitting device that is disposed on the wiring substrate and covers the opening; a bonding wire electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist and a bump formed on the bottom surface of the wiring substrate.

Abstract translation: 具有提高接合线的连接可靠性的发光器件封装，由于后成型而导致的散热特性和光质量以及制造发光器件封装的方法。 发光器件封装包括例如具有开口的布线基板; 发光装置，其布置在所述布线基板上并覆盖所述开口; 通过所述开口将所述布线基板的底面与所述发光装置的底面电连接的接合线; 在布线基板的上表面的一部分上形成有围绕发光装置的侧面而不是作为发射面的发光元件的顶面的成型部件， 布线基板的开口以覆盖接合线; 以及形成在布线基板的底面上的阻焊剂和凸块。

公开(公告)号：US20120181555A1

公开(公告)日：2012-07-19

申请号：US13344255

申请日：2012-01-05

Applicant: Cheol-jun Yoo ,  Young-hee Song ,  Seong-deok Hwang ,  Sang-hyun Lee

Inventor： Cheol-jun Yoo ,  Young-hee Song ,  Seong-deok Hwang ,  Sang-hyun Lee

IPC: H01L33/62 ,  H01L33/52 ,  H01L33/44

CPC classification number: H01L33/486 ,  H01L24/73 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device.

Abstract translation: 可以使用后成型制造并具有改善的散热性能和光学质量的发光器件封装以及制造发光器件封装的方法。 发光器件封装包括：散热垫; 形成在所述散热垫上的发光装置; 一对引线框架，设置成在发光装置和散热垫的两侧彼此间隔开; 围绕所述发光装置的除了所述发光装置的发射表面的侧面的成型构件; 以及用于将引线框架电连接到发光器件的接合线。

公开(公告)号：US20120164759A1

公开(公告)日：2012-06-28

申请号：US13314783

申请日：2011-12-08

Applicant: Cheol-jun YOO ,  Seong-jae Hong

Inventor： Cheol-jun YOO ,  Seong-jae Hong

IPC: H01L33/50 ,  B29C33/00

CPC classification number: H01L22/20 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/52 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

Abstract: A method and apparatus for depositing a phosphor using transfer molding. The method includes: forming a plurality of light-emitting devices on a wafer and rearranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices; depositing the phosphor on the rearranged light-emitting devices using transfer molding; and separating the light-emitting devices on the carrier substrate.

Abstract translation: 一种使用传递模塑沉积磷光体的方法和装置。 该方法包括：在晶片上形成多个发光器件，并通过检查多个发光器件的亮度特性，根据多个发光器件的亮度特性重新排列载体衬底上的发光器件 设备; 使用传递模塑将磷光体沉积在重排的发光器件上; 并分离载体基板上的发光装置。

公开(公告)号：US20120052608A1

公开(公告)日：2012-03-01

申请号：US13217828

申请日：2011-08-25

Applicant: Cheol-jun Yoo ,  Seong-jae Hong

Inventor： Cheol-jun Yoo ,  Seong-jae Hong

IPC: H01L33/44 ,  B32B27/00 ,  B05D5/06 ,  B32B19/00

CPC classification number: B32B3/10 ,  B32B3/08 ,  B32B3/14 ,  B32B3/16 ,  B32B3/18 ,  B32B5/16 ,  B32B7/12 ,  B32B9/04 ,  B32B9/045 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2250/44 ,  B32B2266/025 ,  B32B2307/40 ,  B32B2307/422 ,  B32B2457/00 ,  C09K11/06 ,  H01L33/50 ,  H01L33/505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2933/0041 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  Y10T428/31855 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Phosphor films, methods of forming the phosphor films, and methods of coating a phosphor layer on light-emitting chips are disclosed. The phosphor film includes: a base film; a phosphor layer that is formed on the base film and comprises an incompletely cured resin material and phosphor particles mixed with the incompletely cured resin material; and a cover film that is formed on the phosphor layer and protects the phosphor layer.

Abstract translation: 公开了荧光体膜，形成荧光体膜的方法以及在发光芯片上涂布磷光体层的方法。 荧光体膜包括：基膜; 形成在所述基底膜上的荧光体层，其包含未完全固化的树脂材料和与所述不完全固化的树脂材料混合的荧光体颗粒; 以及形成在荧光体层上并保护荧光体层的覆盖膜。