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1.发明授权Phosphor film, method of forming the same, and method of coating phosphor layer on LED chips 有权磷光体膜，其形成方法以及在LED芯片上涂布荧光体层的方法公开(公告)号：US08546159B2
公开(公告)日：2013-10-01
申请号：US13217828
申请日：2011-08-25
Applicant: Cheol-jun Yoo , Seong-jae Hong
Inventor： Cheol-jun Yoo , Seong-jae Hong
CPC classification number: B32B3/10 , B32B3/08 , B32B3/14 , B32B3/16 , B32B3/18 , B32B5/16 , B32B7/12 , B32B9/04 , B32B9/045 , B32B27/06 , B32B27/08 , B32B27/32 , B32B2250/03 , B32B2250/40 , B32B2250/44 , B32B2266/025 , B32B2307/40 , B32B2307/422 , B32B2457/00 , C09K11/06 , H01L33/50 , H01L33/505 , H01L2224/45139 , H01L2224/48091 , H01L2933/0041 , Y10T428/24802 , Y10T428/24851 , Y10T428/24893 , Y10T428/24942 , Y10T428/31855 , H01L2924/00014 , H01L2924/00
Abstract: Phosphor films, methods of forming the phosphor films, and methods of coating a phosphor layer on light-emitting chips are disclosed. The phosphor film includes: a base film; a phosphor layer that is formed on the base film and comprises an incompletely cured resin material and phosphor particles mixed with the incompletely cured resin material; and a cover film that is formed on the phosphor layer and protects the phosphor layer.
Abstract translation: 公开了荧光体膜，形成荧光体膜的方法以及在发光芯片上涂布磷光体层的方法。 荧光体膜包括：基膜; 形成在所述基底膜上的荧光体层，其包含未完全固化的树脂材料和与所述不完全固化的树脂材料混合的荧光体颗粒; 以及形成在荧光体层上并保护荧光体层的覆盖膜。
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公开(公告)号：US08796050B2
公开(公告)日：2014-08-05
申请号：US13338678
申请日：2011-12-28
Applicant: Cheol-jun Yoo , Seong-jae Hong , Tsuyoshi Tsutsui , Shin-kun Kim
Inventor： Cheol-jun Yoo , Seong-jae Hong , Tsuyoshi Tsutsui , Shin-kun Kim
IPC: H01L33/50 , H01L33/00 , H01L21/67 , H01L21/683
CPC classification number: B05C1/027 , H01L21/6715 , H01L21/6838 , H01L33/0079 , H01L33/50 , H01L2933/0041
Abstract: Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer.
Abstract translation: 制造通过在晶片级在半导体发光元件的发射表面上形成荧光层而发出白光的半导体发光器件的制造方法和装置。 该方法包括：在晶片上形成多个发光器件; 使形成有多个发光装置的晶片变薄; 将薄的晶片设置在载体膜上; 以及在所述晶片上的所述多个发光器件的发射表面上形成荧光体层。
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公开(公告)号：US20120142124A1
公开(公告)日：2012-06-07
申请号：US13289497
申请日：2011-11-04
Applicant: Cheol-jun Yoo , Seong-jae Hong
Inventor： Cheol-jun Yoo , Seong-jae Hong
IPC: H01L33/08
CPC classification number: H01L33/50 , H01L33/0095
Abstract: A method of applying a phosphor according to a light-emission characteristic of semiconductor light-emitting devices so as to increase a yield rate of manufacture with respect to a white light-emitting device chip, the method including the operations of testing light-emission characteristics of a plurality of light-emitting devices formed on a wafer; disposing a plurality of light-emitting devices having the same light-emission characteristics on a carrier substrate; applying a same phosphor to the plurality of light-emitting devices disposed on the carrier substrate; and separating the plurality of arrayed light-emitting devices. Thus, a white light-emitting device chip manufactured by using the method may emit almost the same white light.
Abstract translation: 一种根据半导体发光器件的发光特性施加荧光体以提高白色发光器件芯片的制造成品率的方法，该方法包括测试发光特性 形成在晶片上的多个发光器件; 在载体基板上配置具有相同发光特性的多个发光器件; 对设置在载体基板上的多个发光装置施加相同的荧光体; 以及分离所述多个排列的发光器件。 因此，通过使用该方法制造的白色发光器件芯片可以发射几乎相同的白光。
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4.发明申请METHOD AND APPARATUS FOR DEPOSITING PHOSPHOR ON SEMICONDUCTOR LIGHT-EMITTING DEVICE 审中-公开在半导体发光器件上沉积磷光体的方法和装置公开(公告)号：US20120178188A1
公开(公告)日：2012-07-12
申请号：US13346505
申请日：2012-01-09
Applicant: Cheol-jun Yoo , Seong-jae Hong
Inventor： Cheol-jun Yoo , Seong-jae Hong
CPC classification number: H01L33/50 , H01L2224/16245 , H01L2224/81 , H01L2933/0041
Abstract: A method and apparatus for depositing a phosphor via a compression molding process, the method involving forming a plurality of light-emitting devices on a wafer, evaluating emission characteristics of the plurality of light-emitting devices, and re-arraying and aligning the plurality of light-emitting devices on a carrier substrate according to the emission characteristics; depositing the phosphor on the plurality of re-arrayed light-emitting devices via a compression molding process; and dicing the plurality of re-arrayed light-emitting devices on the carrier substrate.
Abstract translation: 一种用于通过压缩成型工艺沉积磷光体的方法和装置，所述方法包括在晶片上形成多个发光器件，评估多个发光器件的发射特性，并重新排列和对准多个发光器件 根据发射特性在载体基板上的发光器件; 通过压缩成型工艺将磷光体沉积在多个重新排列的发光器件上; 并且在载体基板上切割多个重新排列的发光器件。
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5.发明授权Method and apparatus for depositing phosphor on semiconductor-light emitting device 有权用于在半导体发光器件上沉积磷光体的方法和装置公开(公告)号：US08672308B2
公开(公告)日：2014-03-18
申请号：US13314783
申请日：2011-12-08
Applicant: Cheol-jun Yoo , Seong-jae Hong
Inventor： Cheol-jun Yoo , Seong-jae Hong
IPC: B25B11/00
CPC classification number: H01L22/20 , H01L33/005 , H01L33/0095 , H01L33/50 , H01L33/52 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
Abstract: A method and apparatus for depositing a phosphor using transfer molding. The method includes: forming a plurality of light-emitting devices on a wafer and rearranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices; depositing the phosphor on the rearranged light-emitting devices using transfer molding; and separating the light-emitting devices on the carrier substrate.
Abstract translation: 一种使用传递模塑沉积磷光体的方法和装置。 该方法包括：在晶片上形成多个发光器件，并通过检查多个发光器件的亮度特性，根据多个发光器件的亮度特性重新排列载体衬底上的发光器件 设备; 使用传递模塑将磷光体沉积在重排的发光器件上; 并分离载体基板上的发光装置。
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Patent Agency Ranking
6.发明申请PHOSPHOR FILM, METHOD OF FORMING THE SAME, AND METHOD OF COATING PHOSPHOR LAYER ON LED CHIPS 有权磷光体膜，其形成方法以及在LED灯上涂覆磷光体层的方法公开(公告)号：US20120052608A1
公开(公告)日：2012-03-01
申请号：US13217828
申请日：2011-08-25
Applicant: Cheol-jun Yoo , Seong-jae Hong
Inventor： Cheol-jun Yoo , Seong-jae Hong
CPC classification number: B32B3/10 , B32B3/08 , B32B3/14 , B32B3/16 , B32B3/18 , B32B5/16 , B32B7/12 , B32B9/04 , B32B9/045 , B32B27/06 , B32B27/08 , B32B27/32 , B32B2250/03 , B32B2250/40 , B32B2250/44 , B32B2266/025 , B32B2307/40 , B32B2307/422 , B32B2457/00 , C09K11/06 , H01L33/50 , H01L33/505 , H01L2224/45139 , H01L2224/48091 , H01L2933/0041 , Y10T428/24802 , Y10T428/24851 , Y10T428/24893 , Y10T428/24942 , Y10T428/31855 , H01L2924/00014 , H01L2924/00
Abstract: Phosphor films, methods of forming the phosphor films, and methods of coating a phosphor layer on light-emitting chips are disclosed. The phosphor film includes: a base film; a phosphor layer that is formed on the base film and comprises an incompletely cured resin material and phosphor particles mixed with the incompletely cured resin material; and a cover film that is formed on the phosphor layer and protects the phosphor layer.
Abstract translation: 公开了荧光体膜，形成荧光体膜的方法以及在发光芯片上涂布磷光体层的方法。 荧光体膜包括：基膜; 形成在所述基底膜上的荧光体层，其包含未完全固化的树脂材料和与所述不完全固化的树脂材料混合的荧光体颗粒; 以及形成在荧光体层上并保护荧光体层的覆盖膜。
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公开(公告)号：US08710513B2
公开(公告)日：2014-04-29
申请号：US13365922
申请日：2012-02-03
Applicant: Cheol-jun Yoo , Young-hee Song
Inventor： Cheol-jun Yoo , Young-hee Song
IPC: H01L33/62
CPC classification number: H01L25/167 , H01L2224/16 , H01L2224/48091 , H01L2224/4824 , H01L2224/73265 , H01L2224/8592 , H01L2924/15151 , H01L2924/00014
Abstract: A light-emitting device package and a method of manufacturing the light-emitting device package. The light-emitting device package includes a wiring substrate; a Zener diode mounted on a first region of the wiring substrate; a light-emitting device chip mounted on the first region and a second region of the wiring substrate; and a molding member for fixing at least a portion of the wiring substrate, wherein the Zener diode is embedded in the molding member.
Abstract translation: 发光器件封装以及制造发光器件封装的方法。 发光器件封装包括布线基板; 安装在所述布线基板的第一区域上的齐纳二极管; 安装在所述第一区域上的发光器件芯片和所述布线基板的第二区域; 以及用于固定所述布线基板的至少一部分的模制构件，其中所述齐纳二极管嵌入所述模制构件中。
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8.发明授权Light-emitting device package and method of manufacturing the light-emitting device package 有权发光器件封装以及制造发光器件封装的方法公开(公告)号：US08952404B2
公开(公告)日：2015-02-10
申请号：US13348369
申请日：2012-01-11
Applicant: Cheol-jun Yoo , Young-hee Song
Inventor： Cheol-jun Yoo , Young-hee Song
CPC classification number: H01L33/486 , B29C45/14344 , B29C45/14655 , B29C45/14836 , H01L33/54 , H01L33/647 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/4826 , H01L2224/73215 , H01L2924/15311 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
Abstract: A light-emitting device package having improved connection reliability of a bonding wire, heat dissipation properties, and light quality due to post-molding and a method of manufacturing the light-emitting device package. The light-emitting device package includes, for example, a wiring substrate having an opening; a light-emitting device that is disposed on the wiring substrate and covers the opening; a bonding wire electrically connecting a bottom surface of the wiring substrate to a bottom surface of the light-emitting device via the opening; a molding member that surrounds a side surface of the light-emitting device and not a top surface of the light-emitting device, which is an emission surface, is formed on a portion of a top surface of the wiring substrate, and is formed in the opening of the wiring substrate to cover the bonding wire; and a solder resist and a bump formed on the bottom surface of the wiring substrate.
Abstract translation: 具有提高接合线的连接可靠性的发光器件封装，由于后成型而导致的散热特性和光质量以及制造发光器件封装的方法。 发光器件封装包括例如具有开口的布线基板; 发光装置，其布置在所述布线基板上并覆盖所述开口; 通过所述开口将所述布线基板的底面与所述发光装置的底面电连接的接合线; 在布线基板的上表面的一部分上形成有围绕发光装置的侧面而不是作为发光面的发光元件的顶面的成型部件， 布线基板的开口以覆盖接合线; 以及形成在布线基板的底面上的阻焊剂和凸块。
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公开(公告)号：US08987022B2
公开(公告)日：2015-03-24
申请号：US13344255
申请日：2012-01-05
Applicant: Cheol-jun Yoo , Young-hee Song , Seong-deok Hwang , Sang-hyun Lee
Inventor： Cheol-jun Yoo , Young-hee Song , Seong-deok Hwang , Sang-hyun Lee
CPC classification number: H01L33/486 , H01L24/73 , H01L33/62 , H01L33/64 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2224/92247 , H01L2924/01079 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device.
Abstract translation: 可以使用后成型制造并具有改善的散热性能和光学质量的发光器件封装以及制造发光器件封装的方法。 发光器件封装包括：散热垫; 形成在所述散热垫上的发光装置; 一对引线框架，设置成在发光装置和散热垫的两侧彼此间隔开; 围绕所述发光装置的除了所述发光装置的发射表面的侧面的成型构件; 以及用于将引线框架电连接到发光器件的接合线。
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10.发明授权公开(公告)号：US08860069B2
公开(公告)日：2014-10-14
申请号：US13365882
申请日：2012-02-03
Applicant: Cheol-jun Yoo , Young-hee Song
Inventor： Cheol-jun Yoo , Young-hee Song
CPC classification number: H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2933/005 , H01L2924/00014
Abstract: A light-emitting device package. The light-emitting device package includes a lead frame comprising a plurality of separate leads; a molding member that fixes the plurality of leads and comprises an opening portion that exposes the lead frame; and a light-emitting device chip that is attached on the lead frame in the opening portion and emits light through an upper surface portion of the light-emitting device chip, wherein a height of the molding member is lower than a height of the light-emitting device chip with respect to the lead frame.
Abstract translation: 一种发光器件封装。 发光器件封装包括引线框架，该引线框架包括多个单独的引线; 模制构件，其固定所述多个引线并且包括暴露所述引线框架的开口部; 以及发光器件芯片，其安装在所述引线框架中的所述开口部分中并且通过所述发光器件芯片的上表面部分发射光，其中所述模制构件的高度低于所述发光器件芯片的高度， 相对于引线框架的发光器件芯片。
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