公开(公告)号：US20130149508A1

公开(公告)日：2013-06-13

申请号：US13818373

申请日：2011-08-24

申请人： Chang Hoon Kwak ,  Il Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

发明人： Chang Hoon Kwak ,  Il Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

IPC分类号： H01L33/50

CPC分类号： H01L33/50 ,  B32B3/08 ,  B32B3/10 ,  B32B3/14 ,  B32B3/16 ,  B32B3/18 ,  B32B5/16 ,  B32B7/12 ,  B32B9/04 ,  B32B9/045 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2250/44 ,  B32B2266/025 ,  B32B2307/40 ,  B32B2307/422 ,  B32B2457/00 ,  C09K11/06 ,  H01L24/97 ,  H01L33/505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2933/0041 ,  H05B33/22 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  Y10T428/31855 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2924/00012

摘要： There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

摘要翻译： 提供了荧光体膜，其制造方法以及涂覆荧光体层的LED芯片的方法。 荧光体膜包括：基膜; 通过将部分固化的树脂材料中的荧光体粒子混合而形成在基底膜上的荧光体层; 以及形成在荧光体层上以保护荧光体层的覆盖膜。

公开(公告)号：US08795817B2

公开(公告)日：2014-08-05

申请号：US13818373

申请日：2011-08-24

申请人： Chang Hoon Kwak ,  II Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

发明人： Chang Hoon Kwak ,  II Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

IPC分类号： B32B3/10 ,  B32B5/16 ,  H01L33/50 ,  C09K11/06

CPC分类号： H01L33/50 ,  B32B3/08 ,  B32B3/10 ,  B32B3/14 ,  B32B3/16 ,  B32B3/18 ,  B32B5/16 ,  B32B7/12 ,  B32B9/04 ,  B32B9/045 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2250/44 ,  B32B2266/025 ,  B32B2307/40 ,  B32B2307/422 ,  B32B2457/00 ,  C09K11/06 ,  H01L24/97 ,  H01L33/505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2933/0041 ,  H05B33/22 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  Y10T428/31855 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2924/00012

摘要： There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

摘要翻译： 提供了荧光体膜，其制造方法以及涂覆荧光体层的LED芯片的方法。 荧光体膜包括：基膜; 通过将部分固化的树脂材料中的荧光体粒子混合而形成在基底膜上的荧光体层; 以及形成在荧光体层上以保护荧光体层的覆盖膜。

公开(公告)号：US20120286566A1

公开(公告)日：2012-11-15

申请号：US13574733

申请日：2010-12-13

申请人： Jung Ho Park ,  Kyu Jin Lee

发明人： Jung Ho Park ,  Kyu Jin Lee

IPC分类号： B62D55/24

CPC分类号： B62D55/244 ,  E02F9/02

摘要： The present invention relates to a rubber crawler having a metal core for improvement of wheel separation and durability, and comprises metal core extensions formed at predetermined intervals along the lengthwise direction of the metal core of the rubber crawler, thereby avoiding the phenomenon of wheel separation which occurs during crawler operation, and minimizing lug breakage due to foreign objects, bend fatigue of a metal core, metal core exposure and breakage of a tread portion, so that the durability performance is enhanced. According to an embodiment of the present invention, the rubber crawler having a metal core for improvement of wheel separation and durability comprises a lug formed to protrude on an external side surface and grounded on the ground; a steel cord disposed internally for enduring compressive load and the driving load of a tracked vehicle; a metal core which is embedded within the steel cord, and transfers the driving force of the engine; and metal core extensions which are embedded along both lengths on the basis of the center portion of the metal core, and prevents wheel separation of the metal core, wherein the metal core extensions are assembled on the mutually opposite surfaces of which are inclined at a predetermined angle, and the overlapped portion (center portion) surfaces of the metal core extensions are formed to have an angle of inclination to each other, thereby supporting the X axis, Y axis, and Z axis displacements.

摘要翻译： 橡胶履带技术领域本发明涉及具有用于提高车轮分离和耐久性的金属芯的橡胶履带，并且包括沿着橡胶履带的金属芯的长度方向以预定间隔形成的金属芯延伸部，从而避免了车轮分离现象 在履带操作期间发生，并且使由于异物引起的凸耳断裂最小化，金属芯的弯曲疲劳，金属芯暴露和胎面部分的破损最小化，从而提高了耐久性能。 根据本发明的实施例，具有用于改善车轮分离和耐久性的金属芯的橡胶履带包括形成为在外侧表面突出并在地面上接地的凸耳; 在内部设置的钢帘线用于承受压缩载荷和履带车辆的驱动载荷; 嵌入钢帘线内的金属芯，并传递发动机的驱动力; 以及金属芯延伸部，其基于金属芯的中心部分沿着两个长度嵌入，并且防止金属芯的车轮分离，其中金属芯延伸部组装在相互相对的表面上倾斜预定的 角度，并且金属芯延伸部的重叠部分（中心部分）表面形成为具有彼此倾斜的角度，从而支撑X轴，Y轴和Z轴位移。

公开(公告)号：US06252298B1

公开(公告)日：2001-06-26

申请号：US09081564

申请日：1998-05-19

申请人： Kyu Jin Lee ,  Wan Gyun Choi

发明人： Kyu Jin Lee ,  Wan Gyun Choi

IPC分类号： H01L23495

CPC分类号： H01L23/3107 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： An active surface of a semiconductor chip is attached to the bottom surface of a flexible circuit board having a central opening. Input/output pads on the active surface of the chip are electrically connected to a circuit layer on the top surface of the flexible circuit board through the opening. The semiconductor chip package can thus be of a size on the order of that of the chip. The circuit layer on the circuit board includes bonding pads for receipt of metal wires, land pads for receipt of terminals, and circuit traces connecting the pairs of the bonding and land pads, respectively. The input/output pads, the bonding pads, and the wires are encapsulated in an encapsulant formed by dispensing a liquid resin having a certain viscosity into the opening in the flexible circuit board. A dam around the opening prevents the liquid resin from overflowing. The flexible circuit board may further include a protective layer for protecting the circuit traces, a stiffener, or an adhesive layer thereunder. The protective layer may have a groove in which the dam is formed.

摘要翻译： 半导体芯片的有源表面附接到具有中心开口的柔性电路板的底表面。 芯片的有源表面上的输入/输出焊盘通过开口电连接到柔性电路板的顶表面上的电路层。 因此，半导体芯片封装可以具有与芯片的尺寸相同的尺寸。 电路板上的电路层包括用于接收金属线的接合焊盘，用于接收端子的接地焊盘和连接接合焊盘和焊盘对的电路迹线。 输入/输出焊盘，接合焊盘和电线被封装在通过将具有一定粘度的液体树脂分配到柔性电路板中的开口中形成的密封剂中。 开口周围的水坝防止液体树脂溢出。 柔性电路板还可以包括用于保护电路迹线的保护层，加强件或其下的粘合剂层。 保护层可以具有形成坝的槽。

公开(公告)号：US6013946A

公开(公告)日：2000-01-11

申请号：US831465

申请日：1997-03-31

申请人： Kyu Jin Lee ,  Do Soo Jeong ,  Jae June Kim

发明人： Kyu Jin Lee ,  Do Soo Jeong ,  Jae June Kim

IPC分类号： H01L23/28 ,  H01L21/50 ,  H01L23/02 ,  H01L23/04 ,  H01L23/10 ,  H01L23/12 ,  H01L23/13 ,  H01L23/24 ,  H01L23/06 ,  H01L23/495

CPC分类号： H01L23/13 ,  H01L21/50 ,  H01L23/10 ,  H01L23/24 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/30107

摘要： A package for a semiconductor chip including a plurality of input/output pads includes an insulating layer and a plurality of conductive traces. The insulating layer has a first surface for bonding with the surface of the semiconductor chip so that the input/output pads are exposed adjacent the insulating layer. The conductive traces are provided on a second surface of the insulating layer opposite the first surface wherein each of the conductive traces corresponds to a respective one of the input/output pads. In particular, the conductive traces are adapted to receive a plurality of bonding wires each of which corresponds to a respective one of the input/output pads. Accordingly, each of the bonding wires can be bonded at a first end to the respective input/output pad and at a second end to the respective conductive trace. Furthermore, the input/output pads can be on an interior portion of the surface of the semiconductor chip, and the insulating layer can have an opening therein for exposing the input/output pads. Accordingly, a dam on the second surface of the insulating layer can be provided around the opening wherein each of the conductive traces extends from adjacent the opening under the dam to a portion of the insulating layer outside the dam. Related methods and assemblies are also discussed.

摘要翻译： 包括多个输入/输出焊盘的半导体芯片的封装包括绝缘层和多个导电迹线。 绝缘层具有用于与半导体芯片的表面接合的第一表面，使得输入/输出焊盘在绝缘层附近露出。 导电迹线设置在与第一表面相对的绝缘层的第二表面上，其中每个导电迹线对应于输入/输出焊盘中的相应一个。 特别地，导电迹线适于接收多个接合线，每个接合线对应于相应的一个输入/输出焊盘。 因此，每个接合线可以在第一端处接合到相应的输入/输出焊盘，并且在第二端可以接合到相应的导电迹线。 此外，输入/输出焊盘可以在半导体芯片的表面的内部，并且绝缘层可以具有用于暴露输入/输出焊盘的开口。 因此，可以在开口周围设置绝缘层的第二表面上的堤坝，其中每个导电迹线从坝的下方的开口附近延伸到坝外部的绝缘层的一部分。 还讨论了相关方法和装配。

公开(公告)号：US20170082786A1

公开(公告)日：2017-03-23

申请号：US15267830

申请日：2016-09-16

申请人： Robert Magnusson ,  Manoj Niraula ,  Yeong Hwan Ko ,  Kyu Jin Lee

发明人： Robert Magnusson ,  Manoj Niraula ,  Yeong Hwan Ko ,  Kyu Jin Lee

IPC分类号： G02B5/18 ,  G02B27/42

CPC分类号： G02B5/1861 ,  G02B5/1809 ,  G02B27/4277 ,  G02B27/4288

摘要： There is immense scientific interest in the properties of resonant thin films embroidered with periodic nanoscale features. This device class possesses considerable innovation potential. Accordingly, we report unpolarized broadband reflectors enabled by a serial arrangement of a pair of polarized subwavelength gratings. Optimized with numerical methods, the elemental gratings can be fabricated in various materials systems. Illustrative examples provided consist of a partially-etched crystalline-silicon films on a quartz substrate and amorphous silicon films on glass. The resulting reflectors exhibit extremely wide spectral reflection bands in one polarization. By arranging two such reflectors sequentially with orthogonal there results an unpolarized spectral band that exceeds those of the individual polarized bands. In the prototypes disclosed herein, there results zero-order reflectance exceeding 97% under unpolarized light incidence over a 500-nm-wide wavelength band. This wideband represents a ˜44% fractional band in the near infrared spectral band. The elemental polarization-sensitive reflectors based on one-dimensional resonant gratings have simple design, robust performance, and are straightforward to fabricate. Hence, this technology is a promising alternative to traditional multilayer thin-film reflectors especially at longer wavelengths of light where multilayer deposition may be infeasible or impractical

公开(公告)号：US20120181571A1

公开(公告)日：2012-07-19

申请号：US13350516

申请日：2012-01-13

申请人： Na Na Park ,  II Woo Park ,  Kyu Jin Lee

发明人： Na Na Park ,  II Woo Park ,  Kyu Jin Lee

IPC分类号： H01L33/48 ,  H01L33/40 ,  B82Y99/00

CPC分类号： H01L33/62 ,  F21V21/0808 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/0753 ,  H01L33/0095 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32245 ,  H01L2224/83191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0543 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： Provided is an adhesive film for an LED chip, including: a double-sided adhesive layer having the LED chip adhered to an upper surface thereof and a lead frame adhered to a lower surface thereof; an ultraviolet (UV) cured layer adhered to one surface of the double-sided adhesive layer; and upper and lower cover layers respectively adhered to faces exposed to the exterior of the double-sided adhesive layer and the UV cured layer.

摘要翻译： 本发明提供一种LED芯片用粘合膜，其特征在于，包括：具有附着在其上表面的LED芯片的双面粘合剂层和粘附于其下表面的引线框架; 附着在双面粘合剂层的一个表面上的紫外线（UV）固化层; 以及分别粘附到暴露于双面粘合剂层和UV固化层的外部的表面的上和下覆盖层。

公开(公告)号：US07023096B2

公开(公告)日：2006-04-04

申请号：US10243784

申请日：2002-09-12

申请人： Kyu Jin Lee ,  Hyung Jik Byun

发明人： Kyu Jin Lee ,  Hyung Jik Byun

IPC分类号： H01L23/48

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L23/3128 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/48237 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multi-chip package includes a substrate with a chip mounting area and a first chip positioned in the mounting area. A spacer is attached to the active surface of the first chip and has a thickness to allow space for wire-bonding the first chip's active surface to the substrate. A second chip is attached to the spacer over the first chip. Conductive metal wires electrically connect the first and second chips to the substrate. A package body is formed by encapsulating the first and second chips and the conductive metal wires. Ends of the spacer extend to the edge the package body. External connection terminals are attached to the bottom surface of the substrate and a method for the manufacturing thereof.

公开(公告)号：US09381959B2

公开(公告)日：2016-07-05

申请号：US13574733

申请日：2010-12-13

申请人： Jung Ho Park ,  Kyu Jin Lee

发明人： Jung Ho Park ,  Kyu Jin Lee

IPC分类号： B62D55/24 ,  E02F9/02

CPC分类号： B62D55/244 ,  E02F9/02

摘要： A rubber crawler having a metal core which comprises metal core extensions formed at predetermined intervals along the lengthwise direction of the metal core of the rubber crawler, thereby avoiding the phenomenon of wheel separation which occurs during crawler operation Wherein the metal core extensions are assembled on the mutually opposite surfaces of which are inclined at a predetermined angle, and the overlapped portion (center portion) surfaces of the metal core extensions are formed to have an angle of inclination to each other, thereby supporting the X axis, Y axis, and Z axis displacements.

摘要翻译： 一种具有金属芯的橡胶履带，其包括沿着橡胶履带的金属芯的长度方向以预定间隔形成的金属芯延伸部，从而避免了在履带式作业期间发生的车轮分离现象，其中金属芯延伸部组装在 相互相对的表面以预定角度倾斜，并且金属芯延伸部的重叠部分（中心部分）表面形成为具有彼此的倾斜角度，从而支撑X轴，Y轴和Z轴 位移。

公开(公告)号：US5940680A

公开(公告)日：1999-08-17

申请号：US854587

申请日：1997-05-12

申请人： Kyu Jin Lee ,  Sang Hyeog Lee ,  In Ho Hyun ,  Il Ung Kim

发明人： Kyu Jin Lee ,  Sang Hyeog Lee ,  In Ho Hyun ,  Il Ung Kim

IPC分类号： H01L21/28 ,  G01R31/28 ,  H01L21/304 ,  H01L21/321 ,  H01L21/60 ,  H01L21/66

CPC分类号： H01L22/20 ,  H01L24/11 ,  G01R31/2886 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13171 ,  H01L2224/45144 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  Y10T29/49004

摘要： A method for manufacturing a known good die array("KGD" array ), which includes the steps of: (a) forming a plurality of circuit patterns, and bonding pads to match solder bumps on a wafer; (b) providing solder bumps on the bonding pads; (c) forming metal layers for wire-bonding on the solder bumps; (d) dividing the wafer having metal layers into respective individual circuit pattern unit dies; (e) holding at least one die in a die holder for testing; (f) wire-bonding circuit contacts of the die holder with the metal layers using wires; (g) testing the die which is electrically interconnected with the die holder; and (h) removing simultaneously the metal layer on the solder bumps for wire bonding and the wires from the die to give a known good die array having solder bumps.

摘要翻译： 一种用于制造已知的良好裸片阵列（“KGD”阵列）的方法，其包括以下步骤：（a）形成多个电路图案和接合焊盘以使晶片上的焊料凸块匹配; （b）在焊盘上提供焊料凸点; （c）在焊料凸点上形成用于引线接合的金属层; （d）将具有金属层的晶片分成相应的单独电路图案单元模具; （e）将至少一个模具保持在模具座中进行测试; （f）使用金属丝的金属层使模具座的引线接合电路触点; （g）测试与模座相互电连接的模具; 和（h）同时去除用于引线接合的焊料凸块上的金属层和来自芯片的电线，以得到具有焊料凸块的已知的良好的裸片阵列。