Abstract:
A card connector includes an insulating housing, a plurality of contacts, a projection and a detecting contact set. The insulating housing includes a bottom wall, a right wall and a left wall for defining a receiving space. The contacts are received in the insulating housing. The projection is protruded from the right wall and into the receiving space, which includes a slanting surface slanted relative to the right wall. The detecting contact set is fixed in the insulating housing, which includes a contacting arm protruding from the slating surface of the projection and into the receiving space. Due to the contacting arm of the detecting contact set is protruded from the slanting surface of the projection in the receiving space, the detecting contact set will be actuated while a card is inserted into the receiving space correctly and completely. Since, the detecting accuracy of the card connector is improved.
Abstract:
A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't pass over any split of the ground plane.
Abstract:
Provided is a high-k metal gate structure formed over a semiconductor fin. A nitride layer is formed over the gate structure and the semiconductor fin, using two separate deposition operations, the first forming a very thin nitride film. Implantation operations may be carried out in between the two nitride film deposition operations. The first nitride film may be SiNx or SiCNx and the second nitride film is SiCNx. The nitride films may be combined to form low wet etch rate spacers enabling further processing operations to be carried out without damaging underlying structures and without requiring the formation of further dummy spacers. Further processing operations include epitaxial silicon/SiGe processing sequences and source/drain implanting operations carried out with the low etch rate spacers intact.
Abstract:
A method for fabricating a photoelectric device initially provides a ceramic substrate comprising a thermal dissipation layer on a bottom layer of the ceramic substrate, an electrode layer on the top surface of the ceramic substrate, and a reflective structure in cavities of the ceramic substrate. Next, a plurality of photoelectric dies is disposed on the top surface of the ceramic substrate. Then, a first packaging layer is formed on the top surfaces of the photoelectric dies. Next, the ceramic substrate is placed between an upper mold and a lower mold. Finally, a plurality of lenses is formed on the top surface of the first packaging layer by using an injection molding technique or a transfer molding technique.
Abstract:
A black ink composition is provided. The black ink composition includes a dispersive black colorant; less than 1 wt % of a glycol ether compound based on total weight of the black ink composition; a solvent; and water. The black ink composition of the present invention is free of surfactants and has excellent compatibility with a nozzle, and thus provides good smoothness in printing and high-quality image.
Abstract:
An electrical connector includes an insulating housing, a terminal pack module, at least one propping element and a shielding shell. A front of the insulating housing defines a receiving space. At least one fastening groove is opened in an outer periphery of the insulating housing. A bottom of the fastening groove defines a fastening hole. A plurality of terminals is received in the insulating housing. The propping element is received in the corresponding fastening groove and has a base portion. An elastic portion is extended frontward from the base portion, and a contacting portion is protruded inward from a free end of the elastic portion for being inserted into the fastening hole to be exposed to the receiving space. A shielding shell encloses the insulating housing and the propping element. The shielding shell has at least one mouth corresponding to the fastening hole and the contacting portion.
Abstract:
The present application discloses a semiconductor light-emitting device with a protection layer. The structure includes a heat dispersion substrate, a first connecting layer on the heat dispersion substrate, a protection layer on the first connecting layer, a second connecting layer on the protection layer, and a light-emitting unit on the second connecting layer. The protection layer is highly insulative and can avoid the current leakage forming between the light-emitting unit and the heat dispersion substrate.
Abstract:
An electrical connector is adapted for being mounted to a printed circuit board. The electrical connector includes a housing, a plurality of terminals, a shell and a bracket. A front edge of a periphery of the housing is protruded outward to form a flange. The terminals are received in the housing. The shell surrounds the housing. A front edge of the shell abuts against the flange. The bracket has a base board, and two opposite ends of the base board extends downward to form two blocking boards. Bottoms of the blocking boards extend outward to form two soldering boards. The base board of the bracket is mounted on the top board of the shell. The blocking boards are mounted on the two side boards. Front edges of the base board and the blocking boards of the bracket abut against the flange.
Abstract:
Disclosed are a biomass chemical toner composition and a method for manufacturing the same. First, a biomass resin is mixed with a first hydrophobic resin to form organic particles. The organic particles, a second hydrophobic resin, and a pigment are mixed by emulsion aggregation to form cores. Subsequently, a third hydrophobic resin is formed on the surface of the cores, and the third hydrophobic resin is further heated and coalesced to form a continuous structure encapsulating the cores. Accordingly, the biomass chemical toner obtained from the described method has good anti-humidity, good charge stability, and low fusing temperature.